Hung C. Ling
- Materials Chemistry top 10%
- Ferroelectric and Piezoelectric Materials 6
- Shape Memory Alloy Transformations 5
- Titanium Alloys Microstructure and Properties 2
- Dielectric properties of ceramics 2
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- Microstructure and Mechanical Properties of Steels 3
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- Magnetic Properties and Applications 2
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- Microwave Dielectric Ceramics Synthesis 3
- Electronic Packaging and Soldering Technologies 2
- Journals
- Journal of the American Ceramic Society (4 papers)Metallurgical Transactions A (2 papers)IEEE Communications Standards Magazine (1 paper)
- Partner nations
- United StatesChina
In The Last Decade
Hung C. Ling
18 papers receiving 410 citations
Peers
Comparison fields: 5 of 44
- Materials Chemistry 385
- Ceramics and Composites 31
- Mechanical Engineering 116
- Electronic, Optical and Magnetic Materials 50
- Electrical and Electronic Engineering 154
Countries citing papers authored by Hung C. Ling
This map shows the geographic impact of Hung C. Ling's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Hung C. Ling with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Hung C. Ling more than expected).
Fields of papers citing papers by Hung C. Ling
This network shows the impact of papers produced by Hung C. Ling. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Hung C. Ling. The network helps show where Hung C. Ling may publish in the future.
Co-authorship network
The 10 scholars most cited alongside Hung C. Ling, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2021 | 3 | |
| 2 | 2018 | 1 | |
| 3 | Materials and processes for wireless communications | 1995 | 37 |
| 4 | Materials in Microelectronic and Optoelectronic Packaging | 1993 | 6 |
| 5 | 1991 | 5 | |
| 6 | 1991 | 19 | |
| 7 | 1990 | 4 | |
| 8 | Ceramic Dielectrics: Composition, Processing and Properties | 1990 | 22 |
| 9 | 1990 | 57 | |
| 10 | 1990 | 8 | |
| 11 | 1989 | 20 | |
| 12 | 1989 | 21 | |
| 13 | 1982 | 4 | |
| 14 | 1981 | 21 | |
| 15 | 1981 | 13 | |
| 16 | 1981 | 82 | |
| 17 | 1980 | 112 | |
| 18 | 1980 | 6 |
About Hung C. Ling
Hung C. Ling is a scholar working on Electronic, Optical and Magnetic Materials, Materials Chemistry, Pharmacy, Bioengineering and Emergency Medical Services, having authored 18 papers that have together received 441 indexed citations. Recurring topics across this work include Ferroelectric and Piezoelectric Materials (6 papers), Shape Memory Alloy Transformations (5 papers), Microwave Dielectric Ceramics Synthesis (3 papers), Microstructure and Mechanical Properties of Steels (3 papers), Titanium Alloys Microstructure and Properties (2 papers), Dielectric properties of ceramics (2 papers), Electronic Packaging and Soldering Technologies (2 papers) and Magnetic Properties and Applications (2 papers). The work is most often cited by research in Materials Chemistry (385 citations), Ceramics and Composites (31 citations), Mechanical Engineering (116 citations), Electronic, Optical and Magnetic Materials (50 citations) and Electrical and Electronic Engineering (154 citations). Hung C. Ling has collaborated with scholars based in United States and China. Frequent co-authors include Roy Kaplow, Man Yan, T. Negas, M. F. Yan, William R. Holland, H. McL. Gordon, V.N. Shukla, W. S. Owen, Koichi Niwa and Tak‐Lun Que. Their work appears in journals such as Journal of the American Ceramic Society, Metallurgical Transactions A, IEEE Communications Standards Magazine, Journal of Materials Science and Review of Scientific Instruments.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.