Hui‐Wang Cui

963 citations
69 papers · 856 · h-index 18

Impact in

    • Polymer Nanocomposites and Properties
    • Synthesis and properties of polymers
    • Conducting polymers and applications
    • Advanced Sensor and Energy Harvesting Materials

Papers in

    • Polymer Nanocomposites and Properties 21
    • Synthesis and properties of polymers 14
    • Polymer crystallization and properties 9
    • Polymer Nanocomposite Synthesis and Irradiation 8
    • Electronic Packaging and Soldering Technologies 20
    • 3D IC and TSV technologies 12
    • Nanomaterials and Printing Technologies 8

Hui‐Wang Cui

69 papers receiving 837 citations

Peers

Hui‐Wang Cui
Comparison fields: 5 of 62
  • Polymers and Plastics 464
  • Biomedical Engineering 356
  • Biomaterials 104
  • Electrical and Electronic Engineering 311
  • Materials Chemistry 212
Replace Dongyang Wu with:
Dongyang Wu China
Shital Patangrao Pawar India
Keon‐Soo Jang South Korea
Hossein Cheraghi Bidsorkhi Italy
María Elena Leyva Brazil
Yazhou Tian China
Yuanhao Guo United States
Krishnendu Nath India
Seyed Ismail Seyed Shahabadi Singapore
Hui‐Wang Cui relative to Dongyang Wu China Dongyang Wu's profile →
Citations per field
00.5×6.3×
Dongyang Wu · 1×
Citations per year

Countries citing papers authored by Hui‐Wang Cui

Since Specialization
Citations

This map shows the geographic impact of Hui‐Wang Cui's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Hui‐Wang Cui with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Hui‐Wang Cui more than expected).

Fields of papers citing papers by Hui‐Wang Cui

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Hui‐Wang Cui. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Hui‐Wang Cui. The network helps show where Hui‐Wang Cui may publish in the future.

Co-authors

The 25 scholars most cited alongside Hui‐Wang Cui, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with Hui‐Wang Cui Line = papers co-authored together Hui‐Wang Cui links everyone, so they are left out of the graph.

All Works

20 of 20 papers shown

Showing the 20 most-cited of 69 papers — load more, or switch the sort, to bring in the rest.

#Work
1 201561
2 201455
3 201451
4 201341
5 201339
6 201335
7 201329
8 201525
9 201323
10 201322
11 201021
12 201119
13 201219
14 201319
15 201219
16 201318
17 201118
18 201417
19 201116
20 201516

About Hui‐Wang Cui

Hui‐Wang Cui is a scholar working on Polymers and Plastics, Electrical and Electronic Engineering, Biomedical Engineering, Mechanical Engineering and Materials Chemistry, having authored 69 papers that have together received 856 indexed citations. Recurring topics across this work include Polymer Nanocomposites and Properties (21 papers), Electronic Packaging and Soldering Technologies (20 papers), Synthesis and properties of polymers (14 papers), Advanced Sensor and Energy Harvesting Materials (14 papers), 3D IC and TSV technologies (12 papers), Polymer crystallization and properties (9 papers), Polymer Nanocomposite Synthesis and Irradiation (8 papers) and Nanomaterials and Printing Technologies (8 papers). The work is most often cited by research in Polymers and Plastics (464 citations), Biomedical Engineering (356 citations), Biomaterials (104 citations), Electrical and Electronic Engineering (311 citations) and Materials Chemistry (212 citations). Hui‐Wang Cui has collaborated with scholars based in China, Japan and Taiwan. Frequent co-authors include Guanben Du, Katsuaki Suganuma, Hiroshi Uchida, Shiao‐Wei Kuo, Dong‐Sheng Li, Qun Fang, Jinting Jiu, Shijo Nagao, Tohru Sugahara and Dongsheng Li. Their work appears in journals such as International Journal of Adhesion and Adhesives, RSC Advances, Advances in Polymer Technology, Electronic Materials Letters and Journal of Thermal Analysis and Calorimetry.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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