Hui Bi
- Electrical and Electronic Engineering top 1%
- Electronic, Optical and Magnetic Materials top 1%
- Materials Chemistry top 2%
- Biomedical Engineering top 2%
- Polymers and Plastics top 2%
- Co-authors
- Tianquan LinFuqiang HuangI‐Wei ChenFengxin LiuFangfang XuChongyin YangXiaoming XieMianheng Jiang
- Topics
- Advanced SAR Imaging Techniques (51 papers)Microwave Imaging and Scattering Analysis (34 papers)Sparse and Compressive Sensing Techniques (33 papers)
- Cited by
- Electronic, Optical and Magnetic MaterialsPolymers and PlasticsElectrical and Electronic Engineering
- Partner nations
- ChinaSingaporeUnited States
In The Last Decade
Hui Bi
125 papers receiving 5.1k citations
Hit Papers
Peers
Comparison fields: 5 of 135
- Electrical and Electronic Engineering 2.7k
- Electronic, Optical and Magnetic Materials 2.4k
- Materials Chemistry 2.0k
- Biomedical Engineering 1.2k
- Polymers and Plastics 833
Countries citing papers authored by Hui Bi
This map shows the geographic impact of Hui Bi's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Hui Bi with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Hui Bi more than expected).
Fields of papers citing papers by Hui Bi
This network shows the impact of papers produced by Hui Bi. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Hui Bi. The network helps show where Hui Bi may publish in the future.
Co-authorship network of co-authors of Hui Bi
This figure shows the co-authorship network connecting the top 25 collaborators of Hui Bi. A scholar is included among the top collaborators of Hui Bi based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Hui Bi. Hui Bi is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 17 | |
| 2 | 0 | |
| 3 | 0 | |
| 4 | 1 | |
| 5 | 9 | |
| 6 | 23 | |
| 7 | 0 | |
| 8 | 2 | |
| 9 | 53 | |
| 10 | 1 | |
| 11 | 1 | |
| 12 | 5 | |
| 13 | 51 | |
| 14 | 3 | |
| 15 | 8 | |
| 16 | 4 | |
| 17 | 19 | |
| 18 | 14 | |
| 19 | 10 | |
| 20 | 19 |
About Hui Bi
Hui Bi is a scholar working on Aerospace Engineering, Computational Mechanics and Electronic, Optical and Magnetic Materials, having authored 138 papers that have together received 5.2k indexed citations. Recurring topics across this work include Advanced SAR Imaging Techniques (51 papers), Microwave Imaging and Scattering Analysis (34 papers) and Sparse and Compressive Sensing Techniques (33 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (2.4k citations), Polymers and Plastics (833 citations) and Electrical and Electronic Engineering (2.7k citations). Hui Bi has collaborated with scholars based in China, Singapore and United States. Frequent co-authors include Tianquan Lin, Fuqiang Huang, I‐Wei Chen, Fengxin Liu, Fangfang Xu, Chongyin Yang, Xiaoming Xie, Mianheng Jiang, Dongyun Wan and Yufeng Tang. Their work appears in journals such as Science, Advanced Materials and Angewandte Chemie International Edition.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.