Hongchu Du
- Materials Chemistry top 5%
- Electrical and Electronic Engineering top 5%
- Electronic, Optical and Magnetic Materials top 5%
- Polymers and Plastics top 10%
- Biomedical Engineering
- Co-authors
- Chun‐Lin JiaJoachim MayerRainer WaserRegina DittmannStefan KaskelRafal E. Dunin–BorkowskiRoger A. De SouzaSebastian Wohlrab
- Topics
- Electronic and Structural Properties of Oxides (20 papers)Advanced Memory and Neural Computing (16 papers)Ferroelectric and Negative Capacitance Devices (13 papers)
- Partner nations
- GermanyChinaUnited States
In The Last Decade
Hongchu Du
65 papers receiving 2.0k citations
Peers
Comparison fields: 5 of 66
- Materials Chemistry 1.4k
- Electrical and Electronic Engineering 1.1k
- Electronic, Optical and Magnetic Materials 425
- Polymers and Plastics 211
- Biomedical Engineering 203
Countries citing papers authored by Hongchu Du
This map shows the geographic impact of Hongchu Du's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Hongchu Du with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Hongchu Du more than expected).
Fields of papers citing papers by Hongchu Du
This network shows the impact of papers produced by Hongchu Du. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Hongchu Du. The network helps show where Hongchu Du may publish in the future.
Co-authorship network of co-authors of Hongchu Du
This figure shows the co-authorship network connecting the top 25 collaborators of Hongchu Du. A scholar is included among the top collaborators of Hongchu Du based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Hongchu Du. Hongchu Du is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 2 | |
| 2 | 2 | |
| 3 | 6 | |
| 4 | 8 | |
| 5 | 17 | |
| 6 | 10 | |
| 7 | 30 | |
| 8 | 33 | |
| 9 | 33 | |
| 10 | 1 | |
| 11 | 29 | |
| 12 | 19 | |
| 13 | 65 | |
| 14 | 57 | |
| 15 | 27 | |
| 16 | 31 | |
| 17 | 100 | |
| 18 | 56 | |
| 19 | 22 | |
| 20 | 5 |
About Hongchu Du
Hongchu Du is a scholar working on Structural Biology, Acoustics and Ultrasonics and Materials Chemistry, having authored 67 papers that have together received 2.0k indexed citations. Recurring topics across this work include Electronic and Structural Properties of Oxides (20 papers), Advanced Memory and Neural Computing (16 papers) and Ferroelectric and Negative Capacitance Devices (13 papers). The work is most often cited by research in Materials Chemistry (1.4k citations), Structural Biology (37 citations) and Electronic, Optical and Magnetic Materials (425 citations). Hongchu Du has collaborated with scholars based in Germany, China and United States. Frequent co-authors include Chun‐Lin Jia, Joachim Mayer, Rainer Waser, Regina Dittmann, Stefan Kaskel, Rafal E. Dunin–Borkowski, Roger A. De Souza, Sebastian Wohlrab, Katharina Skaja and Stephan Menzel. Their work appears in journals such as Physical Review Letters, Advanced Materials and Angewandte Chemie International Edition.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.