Helei Dong
- Electrical and Electronic Engineering top 2%
- Biomedical Engineering top 2%
- Materials Chemistry top 5%
- Polymers and Plastics top 5%
- Electronic, Optical and Magnetic Materials top 10%
- Topics
- Ferroelectric and Piezoelectric Materials (41 papers)Microwave Dielectric Ceramics Synthesis (37 papers)Gas Sensing Nanomaterials and Sensors (16 papers)
- Journals
- SHILAP Revista de lepidopterologíaJournal of Applied PhysicsJournal of Power Sources
In The Last Decade
Helei Dong
92 papers receiving 2.2k citations
Hit Papers
Peers
Comparison fields: 5 of 72
- Electrical and Electronic Engineering 1.6k
- Biomedical Engineering 1.1k
- Materials Chemistry 1.1k
- Polymers and Plastics 333
- Electronic, Optical and Magnetic Materials 270
Countries citing papers authored by Helei Dong
This map shows the geographic impact of Helei Dong's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Helei Dong with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Helei Dong more than expected).
Fields of papers citing papers by Helei Dong
This network shows the impact of papers produced by Helei Dong. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Helei Dong. The network helps show where Helei Dong may publish in the future.
Co-authorship network of co-authors of Helei Dong
This figure shows the co-authorship network connecting the top 25 collaborators of Helei Dong. A scholar is included among the top collaborators of Helei Dong based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Helei Dong. Helei Dong is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 0 | |
| 2 | 2 | |
| 3 | 2 | |
| 4 | Facile preparation of porous MXene/cellulose nanofiber composite for highly-sensitive flexible piezoresistive sensors in e-skinbreakdown → | 35 |
| 5 | 3 | |
| 6 | 1 | |
| 7 | 2 | |
| 8 | 4 | |
| 9 | 8 | |
| 10 | 2 | |
| 11 | 11 | |
| 12 | 34 | |
| 13 | 9 | |
| 14 | 139 | |
| 15 | 6 | |
| 16 | 12 | |
| 17 | 12 | |
| 18 | 51 | |
| 19 | 82 | |
| 20 | 25 |
About Helei Dong
Helei Dong is a scholar working on Statistics, Probability and Uncertainty, Electrical and Electronic Engineering and Materials Chemistry, having authored 95 papers that have together received 2.2k indexed citations. Recurring topics across this work include Ferroelectric and Piezoelectric Materials (41 papers), Microwave Dielectric Ceramics Synthesis (37 papers) and Gas Sensing Nanomaterials and Sensors (16 papers). The work is most often cited by research in Electrical and Electronic Engineering (1.6k citations), Biomedical Engineering (1.1k citations) and Materials Chemistry (1.1k citations). Helei Dong has collaborated with scholars based in China and Taiwan. Frequent co-authors include Qiulin Tan, Jijun Xiong, Dan Xu, Feng Shi, Shihui Yu, Shihui Yu, Yuxin Jin, Lingxia Li, Hairong Kou and Wen Lv. Their work appears in journals such as SHILAP Revista de lepidopterología, Journal of Applied Physics and Journal of Power Sources.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.