Harry K. Charles
- Electrical and Electronic Engineering top 10%
- Mechanical Engineering
- Biomedical Engineering
- Materials Chemistry
- Atomic and Molecular Physics, and Optics
- Co-authors
- Bliss G. CarkhuffN. A. BlumRichard L. EdwardsCharles FeldmanStewartRichard A. MeyerF. G. SatkiewiczR. C. Benson
- Topics
- Electronic Packaging and Soldering Technologies (22 papers)3D IC and TSV technologies (16 papers)Photonic and Optical Devices (7 papers)
- Cited by
- Electrical and Electronic EngineeringCellular and Molecular NeuroscienceMechanical Engineering
- Partner nations
- United States
In The Last Decade
Harry K. Charles
66 papers receiving 583 citations
Peers
Comparison fields: 5 of 81
- Electrical and Electronic Engineering 410
- Mechanical Engineering 129
- Biomedical Engineering 105
- Materials Chemistry 79
- Atomic and Molecular Physics, and Optics 74
Countries citing papers authored by Harry K. Charles
This map shows the geographic impact of Harry K. Charles's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Harry K. Charles with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Harry K. Charles more than expected).
Fields of papers citing papers by Harry K. Charles
This network shows the impact of papers produced by Harry K. Charles. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Harry K. Charles. The network helps show where Harry K. Charles may publish in the future.
Co-authorship network of co-authors of Harry K. Charles
This figure shows the co-authorship network connecting the top 25 collaborators of Harry K. Charles. A scholar is included among the top collaborators of Harry K. Charles based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Harry K. Charles. Harry K. Charles is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 1 | |
| 2 | 5 | |
| 3 | 47 | |
| 4 | AMPDXA for Precision Bone Loss Measurements on Earth and in Space | 1 |
| 5 | 0 | |
| 6 | 2 | |
| 7 | 3 | |
| 8 | 1 | |
| 9 | 4 | |
| 10 | Laser testing of MCM-D structures | 1 |
| 11 | SOME KEY ISSUES IN MICROELECTRONIC PACKAGING | 2 |
| 12 | APL's Packaging Future: The Next Few Years | 4 |
| 13 | 56 | |
| 14 | Wirebonding for Multichip Modules | 5 |
| 15 | 69 | |
| 16 | 18 | |
| 17 | 2 | |
| 18 | 6 | |
| 19 | 27 | |
| 20 | Vacuum deposited polycrystalline silicon solar cells | 0 |
About Harry K. Charles
Harry K. Charles is a scholar working on Hardware and Architecture, Electrical and Electronic Engineering and Bioengineering, having authored 74 papers that have together received 650 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (22 papers), 3D IC and TSV technologies (16 papers) and Photonic and Optical Devices (7 papers). The work is most often cited by research in Electrical and Electronic Engineering (410 citations), Cellular and Molecular Neuroscience (68 citations) and Mechanical Engineering (129 citations). Harry K. Charles has collaborated with scholars based in United States. Frequent co-authors include Bliss G. Carkhuff, N. A. Blum, Richard L. Edwards, Charles Feldman, Stewart, Richard A. Meyer, F. G. Satkiewicz, R. C. Benson, Wayne Johnson and Tan Zhang. Their work appears in journals such as Physical Review Letters, Journal of Applied Physics and Magnetic Resonance in Medicine.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.