Nick Baker

1.0k total citations
28 papers, 856 citations indexed

About

Nick Baker is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Atomic and Molecular Physics, and Optics. According to data from OpenAlex, Nick Baker has authored 28 papers receiving a total of 856 indexed citations (citations by other indexed papers that have themselves been cited), including 28 papers in Electrical and Electronic Engineering, 4 papers in Mechanical Engineering and 2 papers in Atomic and Molecular Physics, and Optics. Recurrent topics in Nick Baker's work include Silicon Carbide Semiconductor Technologies (24 papers), Semiconductor materials and devices (10 papers) and Advancements in Semiconductor Devices and Circuit Design (9 papers). Nick Baker is often cited by papers focused on Silicon Carbide Semiconductor Technologies (24 papers), Semiconductor materials and devices (10 papers) and Advancements in Semiconductor Devices and Circuit Design (9 papers). Nick Baker collaborates with scholars based in Denmark, United States and Germany. Nick Baker's co-authors include Marco Liserre, Francesco Iannuzzo, Laurent Dupont, Stig Munk‐Nielsen, Yvan Avenas, Haoze Luo, Frede Blaabjerg, Szymon Bęczkowski, Wuhua Li and Xiangning He and has published in prestigious journals such as IEEE Transactions on Industrial Electronics, IEEE Transactions on Power Electronics and Energies.

In The Last Decade

Nick Baker

27 papers receiving 833 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Nick Baker Denmark 13 826 85 67 37 29 28 856
Pramod Ghimire Denmark 13 606 0.7× 109 1.3× 78 1.2× 41 1.1× 11 0.4× 25 649
Paula Diaz Reigosa Denmark 16 852 1.0× 82 1.0× 61 0.9× 81 2.2× 24 0.8× 40 890
Johannes Falck Germany 8 639 0.8× 77 0.9× 123 1.8× 74 2.0× 18 0.6× 8 700
J.-J. Huselstein France 6 608 0.7× 59 0.7× 63 0.9× 49 1.3× 13 0.4× 10 645
Reinhold Bayerer Germany 9 695 0.8× 96 1.1× 57 0.9× 62 1.7× 13 0.4× 17 728
Huaping Jiang China 19 1.2k 1.4× 112 1.3× 70 1.0× 44 1.2× 88 3.0× 77 1.2k
Michel Mermet-Guyennet France 14 634 0.8× 115 1.4× 52 0.8× 36 1.0× 11 0.4× 39 680
Christoph H. van der Broeck Germany 20 918 1.1× 140 1.6× 135 2.0× 31 0.8× 24 0.8× 47 963
Max Poech Germany 7 589 0.7× 106 1.2× 42 0.6× 39 1.1× 6 0.2× 10 626

Countries citing papers authored by Nick Baker

Since Specialization
Citations

This map shows the geographic impact of Nick Baker's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Nick Baker with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Nick Baker more than expected).

Fields of papers citing papers by Nick Baker

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Nick Baker. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Nick Baker. The network helps show where Nick Baker may publish in the future.

Co-authorship network of co-authors of Nick Baker

This figure shows the co-authorship network connecting the top 25 collaborators of Nick Baker. A scholar is included among the top collaborators of Nick Baker based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Nick Baker. Nick Baker is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Baker, Nick, et al.. (2025). Solder Void Impact on Power Device Thermal Impedance using Transient Thermal Analysis. 1–6. 1 indexed citations
2.
Baker, Nick, Francesco Iannuzzo, & Szymon Bęczkowski. (2025). Liquid Paste Interconnects on a Silicon Power Diode. IEEE Transactions on Components Packaging and Manufacturing Technology. 15(8). 1661–1665.
3.
Baker, Nick, Laurent Dupont, Szymon Bęczkowski, & Francesco Iannuzzo. (2024). Proof-of-Concept for an On-Chip Kelvin-Emitter RTD Sensor for Junction Temperature Monitoring of IGBTs. IEEE Transactions on Components Packaging and Manufacturing Technology. 14(12). 2240–2247. 1 indexed citations
4.
Baker, Nick, et al.. (2023). Temperature Monitoring of Multi-Chip SiC MOSFET Modules: On-Chip RTDs vs. VSD(T). VBN Forskningsportal (Aalborg Universitet). 1–9. 1 indexed citations
5.
Jørgensen, Asger Bjørn, Nick Baker, Szymon Bęczkowski, et al.. (2023). Thermal Characteristics of Liquid Metal Interconnects for Power Semiconductors. VBN Forskningsportal (Aalborg Universitet). 1135–1140. 2 indexed citations
6.
7.
Baker, Nick, et al.. (2020). Effect of short-circuit degradation on the remaining useful lifetime of SiC MOSFETs and its failure analysis. Microelectronics Reliability. 114. 113784–113784. 11 indexed citations
8.
Luo, Haoze, Francesco Iannuzzo, Nick Baker, et al.. (2019). Study of Current Density Influence on Bond Wire Degradation Rate in SiC MOSFET Modules. IEEE Journal of Emerging and Selected Topics in Power Electronics. 8(2). 1622–1632. 40 indexed citations
9.
Baker, Nick, et al.. (2019). Proof-of-Concept for a Kelvin-Emitter On-Chip Temperature Sensor for Power Semiconductors. VBN Forskningsportal (Aalborg Universitet). P.1–P.8. 4 indexed citations
10.
Baker, Nick, Francesco Iannuzzo, & Helong Li. (2018). Impact of Kelvin-Source Resistors on Current Sharing and Failure Detection in Multichip Power Modules. VBN Forskningsportal (Aalborg Universitet). 1–7. 8 indexed citations
11.
Baker, Nick & Francesco Iannuzzo. (2018). Failure protection in power modules with auxiliary-emitter bondwires. VBN Forskningsportal (Aalborg Universitet). 3 indexed citations
12.
Baker, Nick & Francesco Iannuzzo. (2018). Smart SiC MOSFET accelerated lifetime testing. Microelectronics Reliability. 88-90. 43–47. 8 indexed citations
13.
Baker, Nick, Haoze Luo, & Francesco Iannuzzo. (2017). Simultaneous On-State Voltage and Bond-Wire Resistance Monitoring of Silicon Carbide MOSFETs. Energies. 10(3). 384–384. 33 indexed citations
14.
Baker, Nick. (2016). An Electrical Method for Junction Temperature Measurement of Power Semiconductor Switches. Aalborg University Library. 6 indexed citations
15.
Baker, Nick, Stig Munk‐Nielsen, Francesco Iannuzzo, & Marco Liserre. (2015). Online junction temperature measurement using peak gate current. VBN Forskningsportal (Aalborg Universitet). 1270–1275. 31 indexed citations
16.
Anurag, Anup, et al.. (2015). Vce-based chip temperature estimation methods for high power IGBT modules during power cycling — A comparison. VBN Forskningsportal (Aalborg Universitet). 1–9. 21 indexed citations
17.
Avenas, Yvan, et al.. (2015). Condition Monitoring: A Decade of Proposed Techniques. IEEE Industrial Electronics Magazine. 9(4). 22–36. 94 indexed citations
18.
Baker, Nick, Stig Munk‐Nielsen, Marco Liserre, & Francesco Iannuzzo. (2014). Online junction temperature measurement via internal gate resistance during turn-on. VBN Forskningsportal (Aalborg Universitet). 1–10. 42 indexed citations
19.
Baker, Nick, Marco Liserre, Laurent Dupont, & Yvan Avenas. (2013). Junction temperature measurements via thermo-sensitive electrical parameters and their application to condition monitoring and active thermal control of power converters. SPIRE - Sciences Po Institutional REpository. 38 indexed citations
20.
Baker, Nick, Stig Munk‐Nielsen, & Szymon Bęczkowski. (2013). Test setup for long term reliability investigation of Silicon Carbide MOSFETs. VBN Forskningsportal (Aalborg Universitet). 1–9. 26 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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