G. L. Lehmann

414 total citations
23 papers, 331 citations indexed

About

G. L. Lehmann is a scholar working on Mechanical Engineering, Mechanics of Materials and Computational Mechanics. According to data from OpenAlex, G. L. Lehmann has authored 23 papers receiving a total of 331 indexed citations (citations by other indexed papers that have themselves been cited), including 16 papers in Mechanical Engineering, 9 papers in Mechanics of Materials and 9 papers in Computational Mechanics. Recurrent topics in G. L. Lehmann's work include Heat Transfer and Optimization (10 papers), Heat Transfer Mechanisms (7 papers) and Surface Modification and Superhydrophobicity (5 papers). G. L. Lehmann is often cited by papers focused on Heat Transfer and Optimization (10 papers), Heat Transfer Mechanisms (7 papers) and Surface Modification and Superhydrophobicity (5 papers). G. L. Lehmann collaborates with scholars based in United States. G. L. Lehmann's co-authors include R. A. Wirtz, B. R. Hollworth, E. J. Cotts, Ying‐Qing Guo, Narendra S. Goel, Klaus Ehrenfried, Hao Zhang, Bruce T. Murray, J. Kompenhans and Markus Raffel and has published in prestigious journals such as International Communications in Heat and Mass Transfer, Heat Transfer Engineering and Journal of Electronic Packaging.

In The Last Decade

G. L. Lehmann

22 papers receiving 308 citations

Peers

G. L. Lehmann
Adrian Briggs United Kingdom
E. T. Mahefkey United States
Huang-Hsiu Tsai Taiwan
Mohamed Chaker Zaghdoudi Tunisia
Eric A. Silk United States
Fujio Tachibana Japan
Shiro Nukiyama Japan
Axel Heß Germany
Gary Mandrusiak United States
Adrian Briggs United Kingdom
G. L. Lehmann
Citations per year, relative to G. L. Lehmann G. L. Lehmann (= 1×) peers Adrian Briggs

Countries citing papers authored by G. L. Lehmann

Since Specialization
Citations

This map shows the geographic impact of G. L. Lehmann's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by G. L. Lehmann with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites G. L. Lehmann more than expected).

Fields of papers citing papers by G. L. Lehmann

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by G. L. Lehmann. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by G. L. Lehmann. The network helps show where G. L. Lehmann may publish in the future.

Co-authorship network of co-authors of G. L. Lehmann

This figure shows the co-authorship network connecting the top 25 collaborators of G. L. Lehmann. A scholar is included among the top collaborators of G. L. Lehmann based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with G. L. Lehmann. G. L. Lehmann is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Lehmann, G. L., et al.. (2008). Horizontal capillary flow of a Newtonian liquid in a narrow gap between a plane wall and a sinusoidal wall. Fluid Dynamics Research. 40(11-12). 779–802. 1 indexed citations
2.
Lehmann, G. L., et al.. (2006). Study of a gel thermal interface material with micron-size particles. 4. 497–504. 4 indexed citations
3.
Lehmann, G. L., et al.. (2005). Squeeze Flow Study of a Colloidal Paste. 557–567. 2 indexed citations
4.
Lehmann, G. L., et al.. (2005). Thermal Resistance of Bond-Lines Formed With Composite Thermal Interface Materials. 503–509. 2 indexed citations
5.
Agonafer, Dereje, et al.. (2004). Numerical Investigation of Enclosure Effects on Spot Cooling Devices. 303. 339–343. 1 indexed citations
6.
Guo, Ying‐Qing, et al.. (2003). A model of the underfill flow process: particle distribution effects. 71–76. 34 indexed citations
7.
Greenfield, Peter, et al.. (2003). A lamination study of a composite LCD flat panel display. 17. 1001–1006.
8.
Cotts, E. J., et al.. (2002). Underflow process for direct-chip-attachment packaging. 273–283. 31 indexed citations
9.
Cotts, E. J., et al.. (2002). Viscosity measurements and models of underfill mixtures. 1. 328–333. 4 indexed citations
10.
Lehmann, G. L., et al.. (1998). Underflow Process for Direct-Chip-Attachment Packaging. MRS Proceedings. 515. 5 indexed citations
11.
Lehmann, G. L., et al.. (1998). Underflow process for direct-chip-attachment packaging. IEEE Transactions on Components Packaging and Manufacturing Technology Part A. 21(2). 266–274. 34 indexed citations
12.
Raffel, Markus, J. Kompenhans, Klaus Ehrenfried, et al.. (1998). Feasibility and Capabilities of Particle Image Velocimetry (PIV) for large Scale Model Rotor Testing. elib (German Aerospace Center). 5 indexed citations
13.
Lehmann, G. L., et al.. (1996). Investigation of the Flow Behavior of Participate Filled Fluids. MRS Proceedings. 445. 4 indexed citations
14.
Goel, Narendra S., et al.. (1992). A simple model for heat conduction in heterogeneous materials and irregular boundaries. International Communications in Heat and Mass Transfer. 19(4). 519–530. 13 indexed citations
15.
Lehmann, G. L., et al.. (1991). Forced Convection Air Cooling of Simulated Low Profile Electronic Components: Part 2—Heat Sink Effects. Journal of Electronic Packaging. 113(1). 27–32. 6 indexed citations
16.
Lehmann, G. L., et al.. (1991). Forced Convection Air Cooling of Simulated Low Profile Electronic Components: Part 1—Base Case. Journal of Electronic Packaging. 113(1). 21–26. 25 indexed citations
17.
Lehmann, G. L., et al.. (1990). A Study of Forced Convection Direct Air Cooling in the Downstream Vicinity of Heat Sinks. Journal of Electronic Packaging. 112(3). 234–240. 4 indexed citations
18.
Wirtz, R. A. & G. L. Lehmann. (1990). Thermal modeling and design of electronic systems and devices. OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information). 8 indexed citations
19.
Lehmann, G. L. & R. A. Wirtz. (1988). Effect of variations in Streamwise Spacing and Length on convection from Surface-Mounted Rectangular Components. Heat Transfer Engineering. 9(3). 66–75. 16 indexed citations
20.
Hollworth, B. R., et al.. (1983). Arrays of Impinging Jets With Spent Fluid Removal Through Vent Holes on the Target Surface, Part 2: Local Heat Transfer. Journal of Engineering for Power. 105(2). 393–402. 88 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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