Fangcheng Wang

974 total citations
30 papers, 770 citations indexed

About

Fangcheng Wang is a scholar working on Biomedical Engineering, Electrical and Electronic Engineering and Computational Mechanics. According to data from OpenAlex, Fangcheng Wang has authored 30 papers receiving a total of 770 indexed citations (citations by other indexed papers that have themselves been cited), including 16 papers in Biomedical Engineering, 10 papers in Electrical and Electronic Engineering and 9 papers in Computational Mechanics. Recurrent topics in Fangcheng Wang's work include Laser Material Processing Techniques (9 papers), Supercapacitor Materials and Fabrication (8 papers) and 3D IC and TSV technologies (7 papers). Fangcheng Wang is often cited by papers focused on Laser Material Processing Techniques (9 papers), Supercapacitor Materials and Fabrication (8 papers) and 3D IC and TSV technologies (7 papers). Fangcheng Wang collaborates with scholars based in China, Macao and United States. Fangcheng Wang's co-authors include Xuesong Mei, Kedian Wang, Zhaoyang Zhai, Xia Dong, Wenqiang Duan, Wenjun Wang, Wenjun Wang, Buxiang Zheng, Jing Lv and Meng Gao and has published in prestigious journals such as Advanced Materials, Nature Communications and Advanced Functional Materials.

In The Last Decade

Fangcheng Wang

26 papers receiving 753 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Fangcheng Wang China 15 385 315 277 225 146 30 770
Chen-Yang Huang China 14 274 0.7× 287 0.9× 146 0.5× 224 1.0× 49 0.3× 35 797
Huiqin Ling China 19 232 0.6× 373 1.2× 615 2.2× 225 1.0× 43 0.3× 70 930
Enshuang Zhang China 13 472 1.2× 222 0.7× 162 0.6× 115 0.5× 98 0.7× 24 1.0k
Rongqing Xu China 21 642 1.7× 564 1.8× 637 2.3× 270 1.2× 60 0.4× 53 1.3k
Denzel Bridges United States 16 487 1.3× 242 0.8× 470 1.7× 320 1.4× 50 0.3× 29 1.1k
Han Ma China 11 293 0.8× 311 1.0× 310 1.1× 71 0.3× 37 0.3× 17 740
Shimin Mao United States 11 358 0.9× 319 1.0× 262 0.9× 84 0.4× 30 0.2× 18 797
K. Khojier Iran 16 211 0.5× 447 1.4× 456 1.6× 85 0.4× 30 0.2× 42 770
Nadya Stankova Bulgaria 12 218 0.6× 196 0.6× 163 0.6× 40 0.2× 94 0.6× 40 499
Yunxiang Bai China 12 226 0.6× 565 1.8× 441 1.6× 112 0.5× 21 0.1× 32 1.1k

Countries citing papers authored by Fangcheng Wang

Since Specialization
Citations

This map shows the geographic impact of Fangcheng Wang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Fangcheng Wang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Fangcheng Wang more than expected).

Fields of papers citing papers by Fangcheng Wang

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Fangcheng Wang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Fangcheng Wang. The network helps show where Fangcheng Wang may publish in the future.

Co-authorship network of co-authors of Fangcheng Wang

This figure shows the co-authorship network connecting the top 25 collaborators of Fangcheng Wang. A scholar is included among the top collaborators of Fangcheng Wang based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Fangcheng Wang. Fangcheng Wang is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Wang, Fangcheng, et al.. (2025). Controlled interfacial debonding based on laser induced deformation-impact coupling effect for advanced packaging. Applied Surface Science. 721. 165350–165350.
2.
Zhang, Jieyuan, Yanlei Hu, Fangcheng Wang, et al.. (2024). Precise modulation of the debonding behaviours of ultra-thin wafers by laser-induced hot stamping effect and thermoelastic stress wave for advanced packaging of chips. International Journal of Extreme Manufacturing. 7(1). 15005–15005. 1 indexed citations
3.
Lei, Ming, Ziyi Dai, Sen Ding, et al.. (2024). Self‐Adhesive Electronic Skin with Bio‐Inspired 3D Architecture for Mechanical Stimuli Monitoring and Human‐Machine Interactions. Small. 20(51). e2406564–e2406564. 14 indexed citations
4.
Zhang, Jieyuan, Fangcheng Wang, Qiang Liu, et al.. (2024). Domain-limiting effect modulation of laser debonding threshold based on wafer stacking structure for advanced packaging. Applied Surface Science. 687. 162219–162219.
5.
Song, Zhaoqiang, Fangcheng Wang, Haojie Zhu, et al.. (2024). A popcorn-inspired strategy for compounding graphene@NiFe2O4 flexible films for strong electromagnetic interference shielding and absorption. Nature Communications. 15(1). 5486–5486. 31 indexed citations
6.
Wang, Fangcheng, Qiang Liu, Jinhui Li, et al.. (2023). Oriented design of wafer-level stacking structures to enhance reliability of laser debonding of thin devices. Optics & Laser Technology. 169. 110169–110169. 3 indexed citations
7.
Wang, Fangcheng, Jinhui Li, Qiang Liu, et al.. (2023). Temporary Bonding and Debonding in Advanced Packaging: Recent Progress and Applications. Electronics. 12(7). 1666–1666. 21 indexed citations
8.
9.
Zhang, Jieyuan, Fangcheng Wang, Qiang Liu, et al.. (2023). Effect of Different Defects in Temporary Bonding on Laser Debonding. 1–4.
10.
Wang, Fangcheng, Zhenbin Guo, Zhiyuan Wang, et al.. (2023). Laser‐Induced Transient Self‐Organization of TiN x Nano‐Filament Percolated Networks for High Performance Surface‐Mountable Filter Capacitors. Advanced Materials. 35(15). 2210038–2210038. 13 indexed citations
11.
Wang, Fangcheng, et al.. (2022). Laser Lift‐Off Technologies for Ultra‐Thin Emerging Electronics: Mechanisms, Applications, and Progress. Advanced Materials Technologies. 8(7). 22 indexed citations
12.
Liu, Jinshan, Jinhui Li, Fangcheng Wang, et al.. (2022). Controlled Thermal Imidization of Thermoplastic Polyimide for Temporary Bonding and Debonding in Advanced Packages. ACS Applied Polymer Materials. 4(11). 8508–8519. 19 indexed citations
13.
Wang, Fangcheng, et al.. (2022). Nondestructive Laser Debonding of Designable Responsive and Buffer Layers for Wafer Level Packaging. 2022 23rd International Conference on Electronic Packaging Technology (ICEPT). 1–4. 1 indexed citations
14.
Liang, Caiwu, Yiming Sui, Juan Wang, et al.. (2022). A Highly Compressible, Elastic, and Air‐Dryable Metallic Aerogels via Magnetic Field‐Assisted Synthesis. Advanced Functional Materials. 32(43). 42 indexed citations
15.
Wang, Fangcheng, Xia Dong, Kedian Wang, et al.. (2019). Laser-induced nitrogen-doped hierarchically porous graphene for advanced electrochemical energy storage. Carbon. 150. 396–407. 65 indexed citations
16.
Zhai, Zhaoyang, et al.. (2019). Experimental study on 800 nm femtosecond laser cutting of polyamide in air. Optik. 194. 163080–163080. 1 indexed citations
17.
Wang, Fangcheng, Xuesong Mei, Kedian Wang, et al.. (2018). Rapid and low-cost laser synthesis of hierarchically porous graphene materials as high-performance electrodes for supercapacitors. Journal of Materials Science. 54(7). 5658–5670. 24 indexed citations
18.
Zhu, Chenguang, Dongmei Zhao, Kedian Wang, et al.. (2018). Direct laser writing of graphene films from a polyether ether ketone precursor. Journal of Materials Science. 54(5). 4192–4201. 61 indexed citations
19.
Zhai, Zhaoyang, Wenjun Wang, Xuesong Mei, et al.. (2018). Effect of the surface microstructure ablated by femtosecond laser on the bonding strength of EBCs for SiC/SiC composites. Optics Communications. 424. 137–144. 79 indexed citations
20.
Zhai, Zhaoyang, Wenjun Wang, Jie Zhao, et al.. (2017). Influence of surface morphology on processing of C/SiC composites via femtosecond laser. Composites Part A Applied Science and Manufacturing. 102. 117–125. 87 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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