Dongming Liu

1.5k citations
34 papers · 1.3k indexed · h-index 19
Topics
High voltage insulation and dielectric phenomena (6 papers)Polymer Nanocomposites and Properties (6 papers)Dielectric materials and actuators (4 papers)
Partner nations
ChinaSwedenFrance

In The Last Decade

Dongming Liu

31 papers receiving 1.2k citations

Peers

Dongming Liu
Comparison fields: 5 of 91
  • Materials Chemistry 496
  • Polymers and Plastics 320
  • Biomedical Engineering 320
  • Computational Mechanics 276
  • Electrical and Electronic Engineering 222
Replace Jean‐Michel Piau with:
Jean‐Michel Piau France
L. Nicodemo Italy
Piyush Thakre United States
Ali Ata Türkiye
Jianfei Xie United Kingdom
M. Arduini-Schuster Germany
Hossein Sojoudi United States
Zijun Hu China
John Newman United States
Martin Mosquet France
Dongming Liu relative to Jean‐Michel Piau France Jean‐Michel Piau's profile →
Citations per field
00.5×4.9×
Jean‐Michel Piau · 1×
Citations per year

Countries citing papers authored by Dongming Liu

Since Specialization
Citations

This map shows the geographic impact of Dongming Liu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Dongming Liu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Dongming Liu more than expected).

Fields of papers citing papers by Dongming Liu

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Dongming Liu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Dongming Liu. The network helps show where Dongming Liu may publish in the future.

Co-authorship network of co-authors of Dongming Liu

This figure shows the co-authorship network connecting the top 25 collaborators of Dongming Liu. A scholar is included among the top collaborators of Dongming Liu based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Dongming Liu. Dongming Liu is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
#WorkIndexed citations
1 0
2 0
3 33
4 6
5 15
6 19
7 20
8 4
9 5
10 55
11 140
12 42
13 20
14 2
15 5
16 42
17 1
18 7
19 32
20 1

About Dongming Liu

Dongming Liu is a scholar working on Polymers and Plastics, Materials Chemistry and Biomaterials, having authored 34 papers that have together received 1.3k indexed citations. Recurring topics across this work include High voltage insulation and dielectric phenomena (6 papers), Polymer Nanocomposites and Properties (6 papers) and Dielectric materials and actuators (4 papers). The work is most often cited by research in Polymers and Plastics (320 citations), Biomaterials (194 citations) and Computational Mechanics (276 citations). Dongming Liu has collaborated with scholars based in China, Sweden and France. Frequent co-authors include Pengzhi Lin, Mikael S. Hedenqvist, Ulf W. Gedde, Amir Masoud Pourrahimi, Love Pallon, Richard T. Olsson, Stanislaw Gubanski, Anh T. Hoang, Valter Ström and Yuriy Serdyuk. Their work appears in journals such as Advanced Materials, Journal of Computational Physics and ACS Applied Materials & Interfaces.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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