Dongkwan Kim

1.5k total citations
31 papers, 1.2k citations indexed

About

Dongkwan Kim is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Polymers and Plastics. According to data from OpenAlex, Dongkwan Kim has authored 31 papers receiving a total of 1.2k indexed citations (citations by other indexed papers that have themselves been cited), including 13 papers in Electrical and Electronic Engineering, 12 papers in Biomedical Engineering and 6 papers in Polymers and Plastics. Recurrent topics in Dongkwan Kim's work include Nanomaterials and Printing Technologies (11 papers), Advanced Sensor and Energy Harvesting Materials (11 papers) and Conducting polymers and applications (5 papers). Dongkwan Kim is often cited by papers focused on Nanomaterials and Printing Technologies (11 papers), Advanced Sensor and Energy Harvesting Materials (11 papers) and Conducting polymers and applications (5 papers). Dongkwan Kim collaborates with scholars based in South Korea, United States and Türkiye. Dongkwan Kim's co-authors include Seung Hwan Ko, Sukjoon Hong, Seungyong Han, Jinhyeong Kwon, Jinwook Jung, Jinwoo Lee, Junyeob Yeo, Habeom Lee, Hyunmin Cho and Junhyuk Bang and has published in prestigious journals such as Advanced Materials, Advanced Functional Materials and ACS Applied Materials & Interfaces.

In The Last Decade

Dongkwan Kim

28 papers receiving 1.2k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Dongkwan Kim South Korea 16 872 624 249 222 189 31 1.2k
Yeosang Yoon South Korea 12 797 0.9× 530 0.8× 219 0.9× 293 1.3× 165 0.9× 17 1.2k
Hyeon Cho South Korea 16 757 0.9× 581 0.9× 268 1.1× 341 1.5× 200 1.1× 32 1.3k
Tural Khudiyev United States 19 1.1k 1.3× 613 1.0× 362 1.5× 263 1.2× 179 0.9× 25 1.7k
Jiean Li China 16 817 0.9× 491 0.8× 361 1.4× 233 1.0× 174 0.9× 35 1.2k
Joonhwa Choi South Korea 18 1.3k 1.5× 588 0.9× 438 1.8× 255 1.1× 342 1.8× 20 1.8k
Zhenlong Huang China 15 984 1.1× 588 0.9× 470 1.9× 380 1.7× 244 1.3× 38 1.5k
Byeongmoon Lee South Korea 22 1.2k 1.4× 551 0.9× 442 1.8× 327 1.5× 372 2.0× 51 1.6k
Zhipeng Li Singapore 18 903 1.0× 485 0.8× 226 0.9× 248 1.1× 136 0.7× 40 1.8k
Hangbo Zhao United States 21 1.0k 1.2× 408 0.7× 230 0.9× 224 1.0× 137 0.7× 42 1.6k
Fuqin Sun China 26 1.2k 1.4× 957 1.5× 448 1.8× 219 1.0× 290 1.5× 56 2.2k

Countries citing papers authored by Dongkwan Kim

Since Specialization
Citations

This map shows the geographic impact of Dongkwan Kim's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Dongkwan Kim with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Dongkwan Kim more than expected).

Fields of papers citing papers by Dongkwan Kim

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Dongkwan Kim. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Dongkwan Kim. The network helps show where Dongkwan Kim may publish in the future.

Co-authorship network of co-authors of Dongkwan Kim

This figure shows the co-authorship network connecting the top 25 collaborators of Dongkwan Kim. A scholar is included among the top collaborators of Dongkwan Kim based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Dongkwan Kim. Dongkwan Kim is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Bang, Junhyuk, Yeongju Jung, Hyungjun Kim, et al.. (2022). Multi-Bandgap Monolithic Metal Nanowire Percolation Network Sensor Integration by Reversible Selective Laser-Induced Redox. Nano-Micro Letters. 14(1). 49–49. 49 indexed citations
2.
Durukan, Mete Batuhan, et al.. (2021). Highly stable silver–platinum core–shell nanowires for H2O2 detection. Nanoscale. 13(30). 13129–13141. 21 indexed citations
3.
Kim, Dongkwan & Pavlo Pylyavskyy. (2021). Robinson–Schensted correspondence for unit interval orders. Selecta Mathematica. 27(5). 1 indexed citations
4.
Min, Byung-Chan, et al.. (2020). Behavior Case Study of Temporary Structures during Underground Extension Work by Field Measurement. Journal of the Korean geoenvironmental society. 21(8). 5–13. 1 indexed citations
5.
Lee, Jinwoo, Yeongju Jung, Hyeonseok Kim, et al.. (2020). Thermally Controlled, Active Imperceptible Artificial Skin in Visible‐to‐Infrared Range. Advanced Functional Materials. 30(36). 88 indexed citations
6.
Bang, Junhyuk, Şahin Coşkun, Kyung Rok Pyun, et al.. (2020). Advances in protective layer-coating on metal nanowires with enhanced stability and their applications. Applied Materials Today. 22. 100909–100909. 63 indexed citations
7.
Kim, Dongkwan, Junhyuk Bang, Phillip Won, et al.. (2020). Biocompatible Cost‐Effective Electrophysiological Monitoring with Oxidation‐Free Cu–Au Core–Shell Nanowire. Advanced Materials Technologies. 5(12). 45 indexed citations
8.
Lee, Jinwoo, Kyung Rok Pyun, Inho Ha, et al.. (2020). Stretchable Skin‐Like Cooling/Heating Device for Reconstruction of Artificial Thermal Sensation in Virtual Reality. Advanced Functional Materials. 30(29). 133 indexed citations
9.
Kim, Dongkwan & Pavlo Pylyavskyy. (2020). Two-row W-graphs in affine type A. Advances in Mathematics. 370. 107207–107207.
10.
Kim, Dongkwan, Junhyuk Bang, Phillip Won, et al.. (2020). Wearable Electronics: Biocompatible Cost‐Effective Electrophysiological Monitoring with Oxidation‐Free Cu–Au Core–Shell Nanowire (Adv. Mater. Technol. 12/2020). Advanced Materials Technologies. 5(12). 3 indexed citations
11.
12.
Kim, Dongkwan, Junhyuk Bang, Inho Ha, et al.. (2020). Highly stretchable and oxidation-resistive Cu nanowire heater for replication of the feeling of heat in a virtual world. Journal of Materials Chemistry A. 8(17). 8281–8291. 75 indexed citations
13.
Jung, Jinwook, Hyunmin Cho, Recep Yüksel, et al.. (2019). Stretchable/flexible silver nanowire electrodes for energy device applications. Nanoscale. 11(43). 20356–20378. 109 indexed citations
14.
Kim, Dongkwan & Sangjun Park. (2019). The Impact Analysis of Leading Pedestrian Interval Using Surrogate Safety Assesment Model. Journal of Korean Society of Transportation. 37(3). 232–244.
15.
Hong, Insic, Seunggon Lee, Dongkwan Kim, et al.. (2018). Study on the oxidation of copper nanowire network electrodes for skin mountable flexible, stretchable and wearable electronics applications. Nanotechnology. 30(7). 74001–74001. 52 indexed citations
17.
Choi, Hyunwoo, et al.. (2017). When Cellular Networks Met IPv6: Security Problems of Middleboxes in IPv6 Cellular Networks. 595–609. 12 indexed citations
18.
Kwon, Jinhyeong, Hyunmin Cho, Young Duk Suh, et al.. (2017). Flexible Substrates: Flexible and Transparent Cu Electronics by Low‐Temperature Acid‐Assisted Laser Processing of Cu Nanoparticles (Adv. Mater. Technol. 2/2017). Advanced Materials Technologies. 2(2). 2 indexed citations
20.
Koyama, Shigeru, et al.. (2001). Numerical study on in-tube laminar heat transfer characteristics of CO_2 at supercritical condition. Nihon dennetsu gakkai ronbunshu/Thermal science and engineering. 9(4). 49–50. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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