Daeil Kwon

1.8k total citations · 1 hit paper
49 papers, 1.4k citations indexed

About

Daeil Kwon is a scholar working on Electrical and Electronic Engineering, Automotive Engineering and Control and Systems Engineering. According to data from OpenAlex, Daeil Kwon has authored 49 papers receiving a total of 1.4k indexed citations (citations by other indexed papers that have themselves been cited), including 31 papers in Electrical and Electronic Engineering, 11 papers in Automotive Engineering and 11 papers in Control and Systems Engineering. Recurrent topics in Daeil Kwon's work include Electronic Packaging and Soldering Technologies (20 papers), Integrated Circuits and Semiconductor Failure Analysis (14 papers) and Fault Detection and Control Systems (10 papers). Daeil Kwon is often cited by papers focused on Electronic Packaging and Soldering Technologies (20 papers), Integrated Circuits and Semiconductor Failure Analysis (14 papers) and Fault Detection and Control Systems (10 papers). Daeil Kwon collaborates with scholars based in South Korea, United States and Thailand. Daeil Kwon's co-authors include Michael Pecht, Chang‐Yong Lee, Jinwoo Lee, Michael H. Azarian, Bin Xu, Lingxi Kong, Oh-Jin Kwon, Melinda Hodkiewicz, Tadahiro Shibutani and Jiajie Fan and has published in prestigious journals such as Renewable and Sustainable Energy Reviews, IEEE Transactions on Industrial Electronics and IEEE Access.

In The Last Decade

Daeil Kwon

47 papers receiving 1.3k citations

Hit Papers

align trajectories

What are hit papers?

Hit papers significantly outperform the citation benchmark for their cohort. A paper qualifies if it has ≥500 total citations, achieves ≥1.5× the top-1% citation threshold for papers in the same subfield and year (this is the minimum needed to enter the top 1%, not the average within it), or reaches the top citation threshold in at least one of its specific research topics.

Mitigation strategies for Li-ion battery thermal runaway: A review

2021 263 citations Bin Xu, Jinwoo Lee et al. Renewable and Sustainable Energy Reviews profile →

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
Daeil Kwon South Korea	18	703	551	252	166	152	49	1.4k
Namwoo Kang South Korea	18	219 0.3×	366 0.7×	76 0.3×	42 0.3×	278 1.8×	62	1.2k
G. Reinhart Germany	16	355 0.5×	353 0.6×	162 0.6×	63 0.4×	326 2.1×	51	2.0k
Prashant Kumar Tiwari India	24	1.1k 1.5×	408 0.7×	658 2.6×	110 0.7×	95 0.6×	94	2.1k
Sachin Kumar India	16	531 0.8×	108 0.2×	342 1.4×	131 0.8×	79 0.5×	54	951
Moneer Helu United States	22	263 0.4×	157 0.3×	263 1.0×	145 0.9×	438 2.9×	43	1.8k
Dariusz Kacprzak New Zealand	17	1.2k 1.7×	576 1.0×	99 0.4×	17 0.1×	302 2.0×	65	1.6k
Tieling Zhang Australia	20	282 0.4×	202 0.4×	220 0.9×	344 2.1×	199 1.3×	62	1.2k
Yan Lu United States	22	206 0.3×	682 1.2×	186 0.7×	52 0.3×	808 5.3×	65	1.8k
David Baglee United Kingdom	15	495 0.7×	90 0.2×	67 0.3×	88 0.5×	57 0.4×	90	934

Countries citing papers authored by Daeil Kwon

Since Specialization

Citations

This map shows the geographic impact of Daeil Kwon's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Daeil Kwon with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Daeil Kwon more than expected).

Fields of papers citing papers by Daeil Kwon

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Daeil Kwon. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Daeil Kwon. The network helps show where Daeil Kwon may publish in the future.

Co-authorship network of co-authors of Daeil Kwon

This figure shows the co-authorship network connecting the top 25 collaborators of Daeil Kwon. A scholar is included among the top collaborators of Daeil Kwon based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Daeil Kwon. Daeil Kwon is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Kwon, Daeil, et al.. (2025). Evaluation of IEC 60529 as a standard for liquid protection assessment of portable electronics. e-Prime - Advances in Electrical Engineering Electronics and Energy. 12. 100952–100952. 2 indexed citations

Xu, Bin, Jinwoo Lee, Daeil Kwon, Lingxi Kong, & Michael Pecht. (2021). Mitigation strategies for Li-ion battery thermal runaway: A review. Renewable and Sustainable Energy Reviews. 150. 111437–111437. 263 indexed citations breakdown →

Park, Hyung Jun, et al.. (2021). Review on Quality Control Methods in Metal Additive Manufacturing. Applied Sciences. 11(4). 1966–1966. 36 indexed citations

Kim, Seokgoo, Hyung Jun Park, Joo-Ho Choi, & Daeil Kwon. (2020). A Novel Prognostics Approach Using Shifting Kernel Particle Filter of Li-Ion Batteries Under State Changes. IEEE Transactions on Industrial Electronics. 68(4). 3485–3493. 49 indexed citations

Choi, Hongjun, Chang‐Wan Kim, & Daeil Kwon. (2020). Data-driven fault diagnosis based on coal-fired power plant operating data. Journal of Mechanical Science and Technology. 34(10). 3931–3936. 10 indexed citations

Kwon, Daeil, et al.. (2019). Effect of Material Property Uncertainty on Warpage during Fan Out Wafer-Level Packaging Process. Journal of the Microelectronics and Packaging Society. 26(1). 29–33. 2 indexed citations

Kwon, Daeil, et al.. (2018). Warpage Analysis during Fan-Out Wafer Level Packaging Process using Finite Element Analysis. Scholarworks@UNIST (Ulsan National Institute of Science and Technology). 25(1). 41–45.

Lee, Chang‐Yong & Daeil Kwon. (2018). A similarity based prognostics approach for real time health management of electronics using impedance analysis and SVM regression. Microelectronics Reliability. 83. 77–83. 19 indexed citations

Ha, Sangho, et al.. (2018). A dimensional compensation algorithm for vertical bending deformation of 3D printed parts in selective laser sintering. Rapid Prototyping Journal. 24(6). 955–963. 22 indexed citations

10.

Lee, Jinwoo, Daeil Kwon, & Michael Pecht. (2018). Reduction of Li-ion Battery Qualification Time Based on Prognostics and Health Management. IEEE Transactions on Industrial Electronics. 66(9). 7310–7315. 32 indexed citations

11.

Youn, Byeng D., et al.. (2017). Deep Neural Network for Fault Diagnosis of Power Transformers using Dissolved Gas Analysis. 1(1). 1 indexed citations

12.

Lee, Jinwoo & Daeil Kwon. (2016). Use of Digital Signal Characteristics for Solder Joint Failure Precursors. Scholarworks@UNIST (Ulsan National Institute of Science and Technology). 806–811. 2 indexed citations

13.

Ha, Sangho, et al.. (2015). Systematic Dimensional Calibration Process for 3D Printed Parts in Selective Laser Sintering (SLS). Scholarworks@UNIST (Ulsan National Institute of Science and Technology). 4 indexed citations

14.

Park, Juyoung, et al.. (2015). A prognostic method of assessing solder joint reliability based on digital signal characterization. Scholarworks@UNIST (Ulsan National Institute of Science and Technology). 4. 2060–2065. 5 indexed citations

15.

Kwon, Daeil, Michael H. Azarian, & Michael Pecht. (2015). Remaining-Life Prediction of Solder Joints Using RF Impedance Analysis and Gaussian Process Regression. IEEE Transactions on Components Packaging and Manufacturing Technology. 5(11). 1602–1609. 33 indexed citations

16.

Kwon, Daeil, Michael H. Azarian, & Michael Pecht. (2013). Failure Prediction of Multilayer Ceramic Capacitors (MLCCs) under Temperature-Humidity-Bias Testing Conditions Using Non-Linear Modeling. Journal of the Microelectronics and Packaging Society. 20(3). 7–10. 2 indexed citations

17.

Kwon, Daeil, et al.. (2013). A preliminary solder joint life prediction model by experiment and simulation for translation of use condition to temperature cycling test condition. 827–834. 4 indexed citations

18.

Kwon, Daeil, Michael H. Azarian, & Michael Pecht. (2010). Prognostics of Interconnect Degradation using RF Impedance Monitoring and Sequential Probability Ratio Test. International Journal of Performability Engineering. 6(5). 443. 8 indexed citations

19.

Kwon, Daeil, Michael H. Azarian, & Michael Pecht. (2010). Degradation of digital signal characteristics due to intermediate stages of interconnect failure. Scholarworks@UNIST (Ulsan National Institute of Science and Technology). 105. 55–58. 2 indexed citations

20.

Kwon, Daeil, Michael H. Azarian, & Michael Pecht. (2008). Early detection of interconnect degradation using RF impedance and SPRT. Scholarworks@UNIST (Ulsan National Institute of Science and Technology). 1–8. 21 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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