Dae Yun Kim
- Biomedical Engineering
- Polymers and Plastics top 10%
- Electrical and Electronic Engineering
- Computational Mechanics top 10%
- Electronic, Optical and Magnetic Materials
- Co-authors
- Seong Hyuk LeeJoo Hyun MoonSu‐Kyung LeeJihoon ChungTaehun KimMinhaeng ChoChang Kyoung ChoiJung‐Yeul Jung
- Topics
- Nanomaterials and Printing Technologies (6 papers)Fluid Dynamics and Thin Films (3 papers)Fluid Dynamics and Heat Transfer (3 papers)
- Journals
- ACS Applied Materials & InterfacesNano EnergyInternational Journal of Heat and Mass Transfer
- Partner nations
- South KoreaUnited StatesSingapore
In The Last Decade
Dae Yun Kim
16 papers receiving 319 citations
Peers
Comparison fields: 5 of 44
- Biomedical Engineering 230
- Polymers and Plastics 162
- Electrical and Electronic Engineering 78
- Computational Mechanics 67
- Electronic, Optical and Magnetic Materials 67
Countries citing papers authored by Dae Yun Kim
This map shows the geographic impact of Dae Yun Kim's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Dae Yun Kim with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Dae Yun Kim more than expected).
Fields of papers citing papers by Dae Yun Kim
This network shows the impact of papers produced by Dae Yun Kim. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Dae Yun Kim. The network helps show where Dae Yun Kim may publish in the future.
Co-authorship network of co-authors of Dae Yun Kim
This figure shows the co-authorship network connecting the top 25 collaborators of Dae Yun Kim. A scholar is included among the top collaborators of Dae Yun Kim based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Dae Yun Kim. Dae Yun Kim is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 0 | |
| 2 | 1 | |
| 3 | 1 | |
| 4 | 14 | |
| 5 | 2 | |
| 6 | 8 | |
| 7 | 12 | |
| 8 | 27 | |
| 9 | 1 | |
| 10 | 2 | |
| 11 | 56 | |
| 12 | 7 | |
| 13 | 98 | |
| 14 | 47 | |
| 15 | 1 | |
| 16 | 2 | |
| 17 | 0 | |
| 18 | 45 |
About Dae Yun Kim
Dae Yun Kim is a scholar working on Computational Mechanics, Automotive Engineering and Electrical and Electronic Engineering, having authored 18 papers that have together received 324 indexed citations. Recurring topics across this work include Nanomaterials and Printing Technologies (6 papers), Fluid Dynamics and Thin Films (3 papers) and Fluid Dynamics and Heat Transfer (3 papers). The work is most often cited by research in Polymers and Plastics (162 citations), Surfaces, Coatings and Films (49 citations) and Biomedical Engineering (230 citations). Dae Yun Kim has collaborated with scholars based in South Korea, United States and Singapore. Frequent co-authors include Seong Hyuk Lee, Joo Hyun Moon, Su‐Kyung Lee, Jihoon Chung, Taehun Kim, Minhaeng Cho, Chang Kyoung Choi, Jung‐Yeul Jung, Chan Ho Jeong and Sangmin Lee. Their work appears in journals such as ACS Applied Materials & Interfaces, Nano Energy and International Journal of Heat and Mass Transfer.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.