D. Di Maio
- Mechanics of Materials top 10%
- Materials Chemistry
- Mechanical Engineering
- Electrical and Electronic Engineering
- Atomic and Molecular Physics, and Optics
- Co-authors
- Steve RobertsChristopher G. HuntM.A. MonclúsC. P. HuntNoriyuki MIYAZAKIC. BaileyShinya KawaharaHua Lu
- Topics
- Electronic Packaging and Soldering Technologies (10 papers)3D IC and TSV technologies (4 papers)Force Microscopy Techniques and Applications (3 papers)
- Journals
- Journal of Materials ScienceJournal of materials research/Pratt's guide to venture capital sourcesIEEE Transactions on Instrumentation and Measurement
- Partner nations
- United KingdomJapan
In The Last Decade
D. Di Maio
12 papers receiving 362 citations
Peers
Comparison fields: 5 of 50
- Mechanics of Materials 167
- Materials Chemistry 154
- Mechanical Engineering 151
- Electrical and Electronic Engineering 102
- Atomic and Molecular Physics, and Optics 78
Countries citing papers authored by D. Di Maio
This map shows the geographic impact of D. Di Maio's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by D. Di Maio with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites D. Di Maio more than expected).
Fields of papers citing papers by D. Di Maio
This network shows the impact of papers produced by D. Di Maio. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by D. Di Maio. The network helps show where D. Di Maio may publish in the future.
Co-authorship network of co-authors of D. Di Maio
This figure shows the co-authorship network connecting the top 25 collaborators of D. Di Maio. A scholar is included among the top collaborators of D. Di Maio based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with D. Di Maio. D. Di Maio is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 6 | |
| 2 | 12 | |
| 3 | 0 | |
| 4 | 49 | |
| 5 | 5 | |
| 6 | 1 | |
| 7 | 6 | |
| 8 | 21 | |
| 9 | A test methodology for copper dissolution in lead-free alloys. | 1 |
| 10 | 6 | |
| 11 | 18 | |
| 12 | 5 | |
| 13 | 243 |
About D. Di Maio
D. Di Maio is a scholar working on General Materials Science, Mechanics of Materials and Electrical and Electronic Engineering, having authored 13 papers that have together received 373 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (10 papers), 3D IC and TSV technologies (4 papers) and Force Microscopy Techniques and Applications (3 papers). The work is most often cited by research in Metals and Alloys (24 citations), Ceramics and Composites (53 citations) and Mechanics of Materials (167 citations). D. Di Maio has collaborated with scholars based in United Kingdom and Japan. Frequent co-authors include Steve Roberts, Christopher G. Hunt, M.A. Monclús, C. P. Hunt, Noriyuki MIYAZAKI, C. Bailey, Shinya Kawahara, Hua Lu and Tōru IKEDA. Their work appears in journals such as Journal of Materials Science, Journal of materials research/Pratt's guide to venture capital sources and IEEE Transactions on Instrumentation and Measurement.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.