Clemens Schmetterer
- General Materials Science top 0.5%
- Metallurgical and Alloy Processes 19
- Mechanical Engineering top 5%
- Intermetallics and Advanced Alloy Properties 27
- Metallurgical Processes and Thermodynamics 5
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- Thermal and Kinetic Analysis 5
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- Electronic Packaging and Soldering Technologies 17
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- Rare-earth and actinide compounds 5
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- Semiconductor materials and interfaces 4
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- Inorganic Chemistry and Materials 3
Clemens Schmetterer
39 papers receiving 809 citations
Peers
Comparison fields: 5 of 40
- General Materials Science 145
- Mechanical Engineering 575
- Materials Chemistry 315
- Electrical and Electronic Engineering 383
- Ceramics and Composites 35
Countries citing papers authored by Clemens Schmetterer
This map shows the geographic impact of Clemens Schmetterer's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Clemens Schmetterer with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Clemens Schmetterer more than expected).
Fields of papers citing papers by Clemens Schmetterer
This network shows the impact of papers produced by Clemens Schmetterer. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Clemens Schmetterer. The network helps show where Clemens Schmetterer may publish in the future.
Co-authorship network
The 25 scholars most cited alongside Clemens Schmetterer, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2021 | 5 | |
| 2 | 2020 | 1 | |
| 3 | 2016 | 8 | |
| 4 | 2015 | 16 | |
| 5 | 2015 | 42 | |
| 6 | 2014 | 6 | |
| 7 | 2013 | 9 | |
| 8 | 2012 | 10 | |
| 9 | 2012 | 3 | |
| 10 | 2012 | 3 | |
| 11 | 2012 | 18 | |
| 12 | 2012 | 1 | |
| 13 | 2011 | 109 | |
| 14 | 2011 | 15 | |
| 15 | 2011 | 12 | |
| 16 | Interaction of Sn-based Solders with Ni(P)-Substrates: The Ni-P, P-Sn and Ni-P-Sn Phase Diagrams | 2009 | 2 |
| 17 | 2009 | 8 | |
| 18 | 2009 | 22 | |
| 19 | 2008 | 45 | |
| 20 | 2006 | 198 |
About Clemens Schmetterer
Clemens Schmetterer is a scholar working on General Materials Science, Mechanical Engineering and Condensed Matter Physics, having authored 39 papers that have together received 844 indexed citations. Recurring topics across this work include Intermetallics and Advanced Alloy Properties (27 papers), Metallurgical and Alloy Processes (19 papers), Electronic Packaging and Soldering Technologies (17 papers), Thermal and Kinetic Analysis (5 papers), Rare-earth and actinide compounds (5 papers), Metallurgical Processes and Thermodynamics (5 papers), Semiconductor materials and interfaces (4 papers) and Inorganic Chemistry and Materials (3 papers). The work is most often cited by research in General Materials Science (145 citations), Mechanical Engineering (575 citations) and Materials Chemistry (315 citations). Clemens Schmetterer has collaborated with scholars based in Austria, Germany and Australia. Frequent co-authors include Herbert Ipser, Hans Flandorfer, Klaus W. Richter, Usman Saeed, H. Effenberger, Pascal Roussel, Bengt Hallstedt, Jiří Vízdal, Patrick J. Masset and Alexandra Khvan. Their work appears in journals such as Chemistry of Materials, Acta Materialia and Journal of Physics Condensed Matter.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.