Chris Chang

582 total citations
29 papers, 430 citations indexed

About

Chris Chang is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Civil and Structural Engineering. According to data from OpenAlex, Chris Chang has authored 29 papers receiving a total of 430 indexed citations (citations by other indexed papers that have themselves been cited), including 20 papers in Electrical and Electronic Engineering, 10 papers in Mechanical Engineering and 4 papers in Civil and Structural Engineering. Recurrent topics in Chris Chang's work include Electronic Packaging and Soldering Technologies (18 papers), 3D IC and TSV technologies (17 papers) and Aluminum Alloys Composites Properties (6 papers). Chris Chang is often cited by papers focused on Electronic Packaging and Soldering Technologies (18 papers), 3D IC and TSV technologies (17 papers) and Aluminum Alloys Composites Properties (6 papers). Chris Chang collaborates with scholars based in United States, Germany and Hong Kong. Chris Chang's co-authors include John H. Lau, S. W. Ricky Lee, Yuelong Huang, F. Mansfeld, J. E. Daugherty, H. Shih, Erik M. Bollt, David Cheng, Parsa Zamankhan and Tony Chen and has published in prestigious journals such as Corrosion Science, International Journal of Pediatric Otorhinolaryngology and AIP Advances.

In The Last Decade

Chris Chang

29 papers receiving 374 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
Chris Chang United States	10	224	134	132	69	65	29	430
Zhijun Han China	11	58 0.3×	107 0.8×	103 0.8×	57 0.8×	128 2.0×	42	347
Seung‐Ho Ahn South Korea	13	131 0.6×	289 2.2×	146 1.1×	23 0.3×	244 3.8×	27	488
Guangdong Liu China	14	180 0.8×	186 1.4×	93 0.7×	27 0.4×	28 0.4×	50	494
K.H. Cho South Korea	7	117 0.5×	123 0.9×	212 1.6×	34 0.5×	296 4.6×	7	492
Chongchong Li China	11	97 0.4×	129 1.0×	306 2.3×	46 0.7×	45 0.7×	41	556
S. Latha India	13	60 0.3×	177 1.3×	204 1.5×	22 0.3×	77 1.2×	33	374
D.R. Arnott Australia	8	59 0.3×	258 1.9×	95 0.7×	97 1.4×	98 1.5×	14	405
Limin Ma China	14	381 1.7×	109 0.8×	323 2.4×	10 0.1×	45 0.7×	73	570
Zhe Wu China	12	171 0.8×	207 1.5×	103 0.8×	144 2.1×	40 0.6×	66	465
Irappa Sogalad India	12	152 0.7×	114 0.9×	192 1.5×	23 0.3×	168 2.6×	41	369

Countries citing papers authored by Chris Chang

Since Specialization

Citations

This map shows the geographic impact of Chris Chang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Chris Chang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Chris Chang more than expected).

Fields of papers citing papers by Chris Chang

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Chris Chang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Chris Chang. The network helps show where Chris Chang may publish in the future.

Co-authorship network of co-authors of Chris Chang

This figure shows the co-authorship network connecting the top 25 collaborators of Chris Chang. A scholar is included among the top collaborators of Chris Chang based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Chris Chang. Chris Chang is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Kapuria, Devika, et al.. (2022). A retrospective study on use of palliative care for patients with alcohol related end stage liver disease in United States. World Journal of Hepatology. 14(9). 1817–1829. 7 indexed citations

Chang, Chris, et al.. (2018). FHWA Computation Procedure for the Pavement Condition Measures. 4 indexed citations

Chang, Chris, et al.. (2018). FHWA Computation Procedure for the Bridge Condition Measures. 1 indexed citations

Chang, Chris, et al.. (2012). Best practices in geographic information systems-based transportation asset management. Rosa P: A digital library for transportation research (United States Department of Transportation). 3 indexed citations

Chang, Chris, et al.. (2012). The Effect of Advertisement Frequency on the Advertisement Attitude-The controlled Effects of Brand Image and Spokesperson's Credibility. Procedia - Social and Behavioral Sciences. 57. 352–359. 30 indexed citations

Lau, John H., et al.. (2002). Nonlinear-Time-Dependent Analysis of Micro Via-In-Pad Substrates for Solder Bumped Flip Chip Applications. Journal of Electronic Packaging. 124(3). 205–211. 10 indexed citations

Lau, John H., et al.. (2001). DSC, TMA, DMA, and TGA of Epoxies for Fiber-Optic Transceiver Applications. 163–168. 1 indexed citations

Lau, John H., et al.. (2000). Nonlinear fracture mechanics analysis of wafer level chip scale package solder joints with cracks. 24(1). 857–865. 11 indexed citations

Lau, John H., et al.. (2000). DESIGN AND MANUFACTURING OF MICRO VIA-IN-PAD SUBSTRATES FOR SOLDER BUMPED FLIP CHIP APPLICATIONS. Journal of Electronics Manufacturing. 10(1). 79–87. 4 indexed citations

10.

Lau, John H., et al.. (2000). Nonlinear-Time-Dependent Analysis of Micro Via-In-Pad Substrates for Solder Bumped Flip Chip Applications. 135–144. 3 indexed citations

11.

Lau, John H., S. W. Ricky Lee, & Chris Chang. (2000). Solder Joint Reliability of Wafer Level Chip Scale Packages (WLCSP): A Time-Temperature-Dependent Creep Analysis. Journal of Electronic Packaging. 122(4). 311–316. 41 indexed citations

12.

Lau, John H., et al.. (2000). Creep Analysis of Wafer Level Chip Scale Package (WLCSP) With 96.5Sn-3.5Ag and 100In Lead-Free Solder Joints and Microvia Build-Up Printed Circuit Board. 79–89. 4 indexed citations

13.

Lau, John H. & Chris Chang. (2000). An overview of microvia technology. Circuit World. 26(2). 22–32. 34 indexed citations

14.

Lau, John H., Chris Chang, & Chih‐Chiang Chen. (1999). Characteristics and Reliability of No-Flow Underfills for Solder Bumped Flip Chip Assemblies. 22(4). 370–381. 3 indexed citations

15.

Lau, John H. & Chris Chang. (1999). TMA, DMA, DSC and TGA of lead free solders. Soldering and Surface Mount Technology. 11(2). 17–24. 14 indexed citations

16.

Lau, John H., et al.. (1999). DESIGN, MANUFACTURING, AND TESTING OF A NOVEL PLASTIC BALL GRID ARRAY PACKAGE. Journal of Electronics Manufacturing. 9(4). 283–291. 3 indexed citations

17.

Lau, John H. & Chris Chang. (1998). How to select underfill materials for solder bumped flip chips on low cost substrates. 3582(1). 693–700. 18 indexed citations

18.

Lau, John H., et al.. (1998). SMT COMPATIBLE NO-FLOW UNDERFILL FOR SOLDER BUMPED FLIP CHIP ON LOW-COST SUBSTRATES. Journal of Electronics Manufacturing. 8(03n04). 151–164. 8 indexed citations

19.

Lau, John H., et al.. (1998). A low‐cost solder‐bumped chip scale package ‐NuCSP. Circuit World. 24(3). 11–25. 3 indexed citations

20.

Chang, Chris, et al.. (1985). Bacterial tracheitis, diagnosis and treatment. International Journal of Pediatric Otorhinolaryngology. 10(3). 271–277. 9 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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