Chorng Niou

571 total citations
39 papers, 509 citations indexed

About

Chorng Niou is a scholar working on Materials Chemistry, Electrical and Electronic Engineering and Condensed Matter Physics. According to data from OpenAlex, Chorng Niou has authored 39 papers receiving a total of 509 indexed citations (citations by other indexed papers that have themselves been cited), including 15 papers in Materials Chemistry, 13 papers in Electrical and Electronic Engineering and 10 papers in Condensed Matter Physics. Recurrent topics in Chorng Niou's work include Physics of Superconductivity and Magnetism (10 papers), High-Velocity Impact and Material Behavior (10 papers) and High-pressure geophysics and materials (10 papers). Chorng Niou is often cited by papers focused on Physics of Superconductivity and Magnetism (10 papers), High-Velocity Impact and Material Behavior (10 papers) and High-pressure geophysics and materials (10 papers). Chorng Niou collaborates with scholars based in United States, China and Italy. Chorng Niou's co-authors include L.E. Murr, S. Pappu, C. Kennedy, Marc A. Meyers, Juan C. Sánchez, Han-Cheng Shih, A.H. Advani, J. M. Rivas, David A. Roberson and R. C. Sherwood and has published in prestigious journals such as Applied Physics Letters, Acta Materialia and Materials Science and Engineering A.

In The Last Decade

Chorng Niou

37 papers receiving 489 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Chorng Niou United States 11 368 186 150 102 66 39 509
C. G. Fountzoulas United States 13 271 0.7× 161 0.9× 203 1.4× 39 0.4× 49 0.7× 34 414
S. J. Zhou United States 9 364 1.0× 253 1.4× 350 2.3× 35 0.3× 27 0.4× 16 657
C. F. Gardinier United States 8 449 1.2× 83 0.4× 201 1.3× 104 1.0× 20 0.3× 10 501
В. И. Бетехтин Russia 14 381 1.0× 332 1.8× 186 1.2× 24 0.2× 29 0.4× 86 566
C.S.J. Pickles United Kingdom 15 450 1.2× 117 0.6× 199 1.3× 88 0.9× 37 0.6× 33 635
L. J. Graham United States 10 332 0.9× 241 1.3× 231 1.5× 63 0.6× 28 0.4× 31 542
Han-Ryong Pak Japan 10 402 1.1× 318 1.7× 182 1.2× 37 0.4× 40 0.6× 17 556
Akihito Matsumuro Japan 10 233 0.6× 108 0.6× 139 0.9× 60 0.6× 26 0.4× 49 377
G.F. Hurley United States 13 613 1.7× 245 1.3× 77 0.5× 55 0.5× 37 0.6× 29 859
Mark Anderson United States 11 226 0.6× 109 0.6× 201 1.3× 123 1.2× 63 1.0× 45 446

Countries citing papers authored by Chorng Niou

Since Specialization
Citations

This map shows the geographic impact of Chorng Niou's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Chorng Niou with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Chorng Niou more than expected).

Fields of papers citing papers by Chorng Niou

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Chorng Niou. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Chorng Niou. The network helps show where Chorng Niou may publish in the future.

Co-authorship network of co-authors of Chorng Niou

This figure shows the co-authorship network connecting the top 25 collaborators of Chorng Niou. A scholar is included among the top collaborators of Chorng Niou based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Chorng Niou. Chorng Niou is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Niou, Chorng, et al.. (2009). Electrical Signature Verification of a Lightly Doped Drain Profile Abnormality in a 65nm Device via Nano-Probing and Junction Stain TEM. Proceedings - International Symposium for Testing and Failure Analysis. 30088. 88–92. 1 indexed citations
2.
Wu, Linfeng, et al.. (2009). Application of passive voltage contrast fault isolation on 65nm SRAM single bit failure. 128. 256–259. 2 indexed citations
3.
4.
Chen, Xianfeng, et al.. (2006). Deformation Study of Low K Dielectric after E-beam Exposure. Proceedings - International Symposium for Testing and Failure Analysis. 30897. 246–248. 2 indexed citations
5.
Gao, Qiang, et al.. (2004). Sidewall damage induced by FIB milling during TEM sample preparation. 157. 613–614. 8 indexed citations
6.
Dong, Wan Jae, et al.. (2004). Finding voids in dual damascene Cu vias and their impact on reliability. 343–346. 1 indexed citations
7.
Murr, L.E., et al.. (1997). Shock-induced deformation twinning in tantalum. Acta Materialia. 45(1). 157–175. 145 indexed citations
8.
Murr, L.E., et al.. (1997). Exfoliation and related microstructures in 2024 aluminum body skins on aging aircraft. Materials Characterization. 38(4-5). 259–272. 37 indexed citations
9.
Murr, L.E., et al.. (1997). TEM observations of void-lobed defects and the origin of stringers in copper rod and drawn magnet wire. Materials Research Innovations. 1(1). 26–37. 4 indexed citations
10.
Grace, Fergal, et al.. (1997). Energy partitioning and microstructural observations related to perforation of titanium and steel targets. International Journal of Impact Engineering. 20(6-10). 685–696. 8 indexed citations
11.
Murr, L.E., S. Pappu, Juan C. Sánchez, et al.. (1996). Novel deformation processes and microstructures involving ballistic penetrator formation and hypervelocity impact and penetration phenomena. Materials Characterization. 37(5). 245–276. 34 indexed citations
12.
Murr, L.E., et al.. (1996). Microstructural aspects of hypervelocity impact cratering and jetting in copper. Journal of Materials Science. 31(22). 5915–5932. 20 indexed citations
13.
Murr, L.E., et al.. (1996). Microbands and shear-related microstructural phenomena associated with impact craters in 6061-T6 aluminum. Materials Science and Engineering A. 216(1-2). 69–79. 37 indexed citations
14.
Murr, L.E., et al.. (1996). Aspects of dynamic recrystallization in shaped charge and explosively formed projectile devices. Metallurgical and Materials Transactions A. 27(7). 1773–1778. 14 indexed citations
15.
Murr, L.E., et al.. (1993). Characterization and comparison of microstructures in the shaped-charge regime: copper and tantalum. Materials Characterization. 30(3). 201–216. 39 indexed citations
16.
Niou, Chorng, et al.. (1993). Transport critical current densities in shock-loaded and thermally processed YBa2Cu3O7. Journal of Materials Science Letters. 12(3). 170–172.
17.
Niou, Chorng & L.E. Murr. (1991). Improvement of the shock-wave-induced resistance-temperature signature for superconducting Y-Ba-Cu-O by silver additions. Scripta Metallurgica et Materialia. 25(1). 127–130. 1 indexed citations
18.
Niou, Chorng, et al.. (1991). Effect of Ag additions on shock wave degradation of superconductivity in BiPBSrCaCuO and YBaCuO. Scripta Metallurgica et Materialia. 25(4). 829–834. 1 indexed citations
19.
Murr, L.E., et al.. (1991). Effect of shock pressure on superconductivity in explosively fabricated Y—Ba—Cu—O/metal matrix composites. physica status solidi (a). 123(2). 507–526. 6 indexed citations
20.
Murr, L.E., et al.. (1990). Shock-wave-induced degradation of superconductivity and localized lattice deffects in explosively fabricated YBa2Cu3O7. Solid State Communications. 73(10). 695–700. 6 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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