C. Prindle

453 total citations
5 papers, 28 citations indexed

About

C. Prindle is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, C. Prindle has authored 5 papers receiving a total of 28 indexed citations (citations by other indexed papers that have themselves been cited), including 5 papers in Electrical and Electronic Engineering, 2 papers in Mechanics of Materials and 2 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in C. Prindle's work include Semiconductor materials and devices (3 papers), Copper Interconnects and Reliability (2 papers) and Metal and Thin Film Mechanics (2 papers). C. Prindle is often cited by papers focused on Semiconductor materials and devices (3 papers), Copper Interconnects and Reliability (2 papers) and Metal and Thin Film Mechanics (2 papers). C. Prindle collaborates with scholars based in United States, Belgium and Netherlands. C. Prindle's co-authors include Kent Chamberlin, Nazri Kamsah, Yuanyan Wu, T.S. Gross, Wenyu Liu, R.J.O.M. Hoofman, K. Hempel, Florence Fusalba, M. Assous and L.G. Gosset and has published in prestigious journals such as Ultramicroscopy and Digital Access to Libraries (Université catholique de Louvain (UCL), l'Université de Namur (UNamur) and the Université Saint-Louis (USL-B)).

In The Last Decade

C. Prindle

5 papers receiving 26 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
C. Prindle United States	4	20	14	6	4	3	5	28
D. Allasia Italy	3	13 0.7×	17 1.2×	6 1.0×	5 1.3×	5 1.7×	4	25
T. Kammler Canada	5	34 1.7×	21 1.5×	3 0.5×	5 1.3×	5 1.7×	8	36
Dave Huffman United States	2	23 1.1×	5 0.4×	5 0.8×	7 1.8×	4 1.3×	6	28
Tung-Hsun Chung China	4	18 0.9×	22 1.6×	2 0.3×	3 0.8×	3 1.0×	6	25
William Hvidtfelt Padkær Nielsen Denmark	2	11 0.6×	15 1.1×	4 0.7×	3 0.8×		2	19
Weihao Wu Taiwan	3	16 0.8×	5 0.4×	8 1.3×	2 0.5×	4 1.3×	4	18
T. P. Downes United States	4	11 0.6×	6 0.4×	4 0.7×	2 0.5×	3 1.0×	7	25
M. Fabre Switzerland	3	9 0.5×	20 1.4×	4 0.7×	2 0.5×	4 1.3×	4	28
A. Perera United States	4	21 1.1×	7 0.5×	2 0.3×	3 0.8×	3 1.0×	5	26
M. Homann Germany	4	21 1.1×	6 0.4×	5 0.8×	9 2.3×	6 2.0×	5	33

Countries citing papers authored by C. Prindle

Since Specialization

Citations

This map shows the geographic impact of C. Prindle's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by C. Prindle with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites C. Prindle more than expected).

Fields of papers citing papers by C. Prindle

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by C. Prindle. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by C. Prindle. The network helps show where C. Prindle may publish in the future.

Co-authorship network of co-authors of C. Prindle

This figure shows the co-authorship network connecting the top 25 collaborators of C. Prindle. A scholar is included among the top collaborators of C. Prindle based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with C. Prindle. C. Prindle is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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5 of 5 papers shown

1.

Lederer, Dimitri, Arvind Kumar, Sudesh Saroop, et al.. (2021). Novel mmWave NMOS Device for High Pout mmWave Power Amplifiers in 45RFSOI. Digital Access to Libraries (Université catholique de Louvain (UCL), l'Université de Namur (UNamur) and the Université Saint-Louis (USL-B)). 199–202. 5 indexed citations

2.

Erben, Elke, K. Hempel, Dina H. Triyoso, et al.. (2012). Impact of process parameters of TiN cap formation on threshold voltage and gate leakage in HKMG last integration. 173–174. 1 indexed citations

3.

Gosset, L.G., V. Arnal, C. Prindle, et al.. (2004). General review of issues and perspectives for advanced copper interconnections using air gap as ultra-low K material. 473. 65–67. 6 indexed citations

4.

Prindle, C., et al.. (2002). CVD TiSiN diffusion barrier integration in sub-130 mn technology nodes. 182–184. 3 indexed citations

5.

Gross, T.S., C. Prindle, Kent Chamberlin, Nazri Kamsah, & Yuanyan Wu. (2001). Two-dimensional, electrostatic finite element study of tip–substrate interactions in electric force microscopy of high density interconnect structures. Ultramicroscopy. 87(3). 147–154. 13 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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