Binli Liu

547 total citations
30 papers, 399 citations indexed

About

Binli Liu is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Atomic and Molecular Physics, and Optics. According to data from OpenAlex, Binli Liu has authored 30 papers receiving a total of 399 indexed citations (citations by other indexed papers that have themselves been cited), including 29 papers in Electrical and Electronic Engineering, 6 papers in Mechanical Engineering and 3 papers in Atomic and Molecular Physics, and Optics. Recurrent topics in Binli Liu's work include Silicon Carbide Semiconductor Technologies (28 papers), Electrostatic Discharge in Electronics (13 papers) and Electromagnetic Compatibility and Noise Suppression (12 papers). Binli Liu is often cited by papers focused on Silicon Carbide Semiconductor Technologies (28 papers), Electrostatic Discharge in Electronics (13 papers) and Electromagnetic Compatibility and Noise Suppression (12 papers). Binli Liu collaborates with scholars based in China. Binli Liu's co-authors include Yifei Luo, Fei Xiao, Yongle Huang, Ming Chen, Bo Wang, Yong Tang, Dezhi Liu, Yong Tang, Bo Wang and Bo Wang and has published in prestigious journals such as IEEE Transactions on Industrial Electronics, IEEE Transactions on Power Electronics and Energies.

In The Last Decade

Binli Liu

28 papers receiving 388 citations

Peers

Binli Liu
Shengyou Xu China
Aaron D. Brovont United States
Stefan Mollov France
Kristian Bonderup Pedersen Denmark
Régis Meuret France
D.C. Katsis United States
Mohd. Amir Eleffendi United Kingdom
Cheng Zhao China
Antonio Pio Catalano Italy
Yanyong Yang China
Shengyou Xu China
Binli Liu
Citations per year, relative to Binli Liu Binli Liu (= 1×) peers Shengyou Xu

Countries citing papers authored by Binli Liu

Since Specialization
Citations

This map shows the geographic impact of Binli Liu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Binli Liu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Binli Liu more than expected).

Fields of papers citing papers by Binli Liu

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Binli Liu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Binli Liu. The network helps show where Binli Liu may publish in the future.

Co-authorship network of co-authors of Binli Liu

This figure shows the co-authorship network connecting the top 25 collaborators of Binli Liu. A scholar is included among the top collaborators of Binli Liu based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Binli Liu. Binli Liu is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Luo, Yifei, et al.. (2025). Thermal Balance-Based Evaluation Method for Safe Operating Areas and Its Degradation of IGBT Power Module. IEEE Journal of Emerging and Selected Topics in Power Electronics. 13(6). 6828–6839.
2.
Ma, Xiao, et al.. (2024). Evaluation on the electro-thermal instability process of thermal runaway under high temperature based on TCAD. Microelectronics Reliability. 154. 115339–115339. 3 indexed citations
3.
Liu, Binli, et al.. (2024). A High Accuracy and Low-Cost Fatigue Life Evaluation Method for IGBTs Based on Variable-Parameter Power Cycling. IEEE Transactions on Power Electronics. 39(12). 15635–15643. 1 indexed citations
4.
Liu, Binli, et al.. (2024). Parameter Correction Method of Vce(on)-Based Junction Temperature Estimation Model Based on Bonding Wire Fatigue. IEEE Journal of Emerging and Selected Topics in Power Electronics. 12(4). 4178–4190.
5.
Luo, Yifei, et al.. (2023). A Reduced-Order Decoupling Method Applied to Efficient Junction Temperature Simulation Model in Multichip Devices. IEEE Journal of Emerging and Selected Topics in Power Electronics. 11(5). 5405–5416. 10 indexed citations
6.
Luo, Yifei, et al.. (2020). Physics of failure of die-attach joints in IGBTs under accelerated aging: Evolution of micro-defects in lead-free solder alloys. Microelectronics Reliability. 109. 113637–113637. 35 indexed citations
7.
Luo, Yifei, Fei Xiao, Binli Liu, & Yongle Huang. (2019). A Physics-Based Transient Electrothermal Model of High-Voltage Press-Pack IGBTs Under HVdc Interruption. IEEE Transactions on Power Electronics. 35(6). 5660–5669. 21 indexed citations
8.
Xiao, Fei, et al.. (2019). PSpice-COMSOL-Based 3-D Electrothermal–Mechanical Modeling of IGBT Power Module. IEEE Journal of Emerging and Selected Topics in Power Electronics. 8(4). 4173–4185. 43 indexed citations
9.
Luo, Yifei, et al.. (2019). A Lumped-Charge Model for High-Power PT-p-i-n Diode With a Buffer Layer. IEEE Journal of Emerging and Selected Topics in Power Electronics. 7(1). 52–61. 6 indexed citations
10.
Luo, Yifei, et al.. (2018). A Physics-based Lumped-charge Model for SiC MPS Diode Implemented in PSPICE. 162–168. 1 indexed citations
11.
12.
Huang, Yongle, Yifei Luo, Fei Xiao, & Binli Liu. (2018). Failure Mechanism of Die-Attach Solder Joints in IGBT Modules Under Pulse High-Current Power Cycling. IEEE Journal of Emerging and Selected Topics in Power Electronics. 7(1). 99–107. 50 indexed citations
13.
Luo, Yifei, et al.. (2018). Temperature monitoring inside IGBT modules at forward bias from the cross section and its finite element analysis. Microelectronics Reliability. 83. 187–197. 10 indexed citations
14.
15.
16.
Luo, Yifei, et al.. (2014). Investigation into the reverse recovery voltage peak mechanism of freewheeling diode at a switching transition. Acta Physica Sinica. 63(21). 217201–217201. 3 indexed citations
17.
Liu, Binli, et al.. (2014). Investigation of the prediction model of IGBT junction temperature based on the rate of voltage change. Acta Physica Sinica. 63(17). 177201–177201. 2 indexed citations
18.
Liu, Binli, Dezhi Liu, Yifei Luo, Yong Tang, & Bo Wang. (2013). Investigation into the turn-off mechanism and time of IGBT based on voltage and current. Acta Physica Sinica. 62(5). 57202–57202. 4 indexed citations
19.
Liu, Binli. (2011). Failure Mechanism and Lifetime Prediction Modeling of IGBT Power Electronic Devices. Xi'an Jiaotong Daxue xuebao. 3 indexed citations
20.
Liu, Binli, et al.. (2011). The Investigation on the Lifetime Prediction Model of IGBT Module. Energy Procedia. 12. 394–402. 6 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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