Anqiang He
- General Materials Science top 5%
-
- Electronic Packaging and Soldering Technologies 8
- 3D IC and TSV technologies 5
- Silicon and Solar Cell Technologies 3
- Thin-Film Transistor Technologies 3
- Electrodeposition and Electroless Coatings 2
-
- Semiconductor materials and interfaces 5
-
- Silicon Nanostructures and Photoluminescence 3
-
- Copper Interconnects and Reliability 2
Anqiang He
17 papers receiving 368 citations
Peers
Comparison fields: 5 of 41
- General Materials Science 21
- Electrical and Electronic Engineering 319
- Mechanical Engineering 117
- Electrochemistry 15
- Metals and Alloys 6
Countries citing papers authored by Anqiang He
This map shows the geographic impact of Anqiang He's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Anqiang He with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Anqiang He more than expected).
Fields of papers citing papers by Anqiang He
This network shows the impact of papers produced by Anqiang He. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Anqiang He. The network helps show where Anqiang He may publish in the future.
Co-authorship network
The 25 scholars most cited alongside Anqiang He, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2022 | 2 | |
| 2 | 2021 | 10 | |
| 3 | 2017 | 5 | |
| 4 | 2016 | 16 | |
| 5 | 2010 | 21 | |
| 6 | 2010 | 2 | |
| 7 | 2010 | 58 | |
| 8 | 2008 | 16 | |
| 9 | 2008 | 62 | |
| 10 | 2007 | 16 | |
| 11 | 2007 | 67 | |
| 12 | 2003 | 3 | |
| 13 | 2000 | 1 | |
| 14 | 2000 | 78 | |
| 15 | 1998 | 11 | |
| 16 | 1998 | 9 | |
| 17 | 1996 | 5 |
About Anqiang He
Anqiang He is a scholar working on General Materials Science, Electrical and Electronic Engineering and Atomic and Molecular Physics, and Optics, having authored 17 papers that have together received 382 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (8 papers), Semiconductor materials and interfaces (5 papers), 3D IC and TSV technologies (5 papers), Silicon and Solar Cell Technologies (3 papers), Silicon Nanostructures and Photoluminescence (3 papers), Thin-Film Transistor Technologies (3 papers), Copper Interconnects and Reliability (2 papers) and Electrodeposition and Electroless Coatings (2 papers). The work is most often cited by research in General Materials Science (21 citations), Electrical and Electronic Engineering (319 citations) and Mechanical Engineering (117 citations). Anqiang He has collaborated with scholars based in Canada, Japan and China. Frequent co-authors include Qi Liu, Douglas G. Ivey, Wenming Tang, S.M. Phillips, Jie Yang, A. H. Heuer, H. Kahn, Hideki Matsumura, Akira Heya and N. Ōtsuka. Their work appears in journals such as Japanese Journal of Applied Physics, Journal of Electronic Materials, Journal of Materials Science Materials in Electronics, International Journal of Minerals Metallurgy and Materials and Transactions of Nonferrous Metals Society of China.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.