Anqiang He

467 total citations
17 papers, 382 citations indexed

About

Anqiang He is a scholar working on Electrical and Electronic Engineering, Materials Chemistry and Atomic and Molecular Physics, and Optics. According to data from OpenAlex, Anqiang He has authored 17 papers receiving a total of 382 indexed citations (citations by other indexed papers that have themselves been cited), including 13 papers in Electrical and Electronic Engineering, 7 papers in Materials Chemistry and 6 papers in Atomic and Molecular Physics, and Optics. Recurrent topics in Anqiang He's work include Electronic Packaging and Soldering Technologies (8 papers), Semiconductor materials and interfaces (5 papers) and 3D IC and TSV technologies (5 papers). Anqiang He is often cited by papers focused on Electronic Packaging and Soldering Technologies (8 papers), Semiconductor materials and interfaces (5 papers) and 3D IC and TSV technologies (5 papers). Anqiang He collaborates with scholars based in Canada, Japan and China. Anqiang He's co-authors include Qi Liu, Douglas G. Ivey, Wenming Tang, S.M. Phillips, Jie Yang, A. H. Heuer, H. Kahn, Hideki Matsumura, Akira Heya and N. Ōtsuka and has published in prestigious journals such as Langmuir, Acta Materialia and Journal of Non-Crystalline Solids.

In The Last Decade

Anqiang He

17 papers receiving 368 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Anqiang He Canada 10 319 117 104 70 48 17 382
A. Zribi United States 12 287 0.9× 176 1.5× 48 0.5× 55 0.8× 66 1.4× 24 373
В. Н. Целуйкин Russia 13 199 0.6× 78 0.7× 248 2.4× 40 0.6× 54 1.1× 56 376
Yunbo Zhong China 12 235 0.7× 157 1.3× 254 2.4× 38 0.5× 25 0.5× 19 393
Hidehiko Enomoto Japan 11 291 0.9× 45 0.4× 175 1.7× 27 0.4× 18 0.4× 37 334
A. Maričić Serbia 12 168 0.5× 241 2.1× 194 1.9× 72 1.0× 27 0.6× 63 395
Aliona Nicolenco Spain 11 235 0.7× 100 0.9× 197 1.9× 52 0.7× 35 0.7× 26 354
C.O. Kim South Korea 10 124 0.4× 112 1.0× 112 1.1× 85 1.2× 64 1.3× 26 326
John Persic Canada 13 277 0.9× 134 1.1× 150 1.4× 23 0.3× 45 0.9× 33 460
A. Castaing United Kingdom 9 150 0.5× 89 0.8× 201 1.9× 24 0.3× 68 1.4× 16 333
I. Shao United States 10 287 0.9× 65 0.6× 245 2.4× 84 1.2× 21 0.4× 17 400

Countries citing papers authored by Anqiang He

Since Specialization
Citations

This map shows the geographic impact of Anqiang He's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Anqiang He with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Anqiang He more than expected).

Fields of papers citing papers by Anqiang He

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Anqiang He. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Anqiang He. The network helps show where Anqiang He may publish in the future.

Co-authorship network of co-authors of Anqiang He

This figure shows the co-authorship network connecting the top 25 collaborators of Anqiang He. A scholar is included among the top collaborators of Anqiang He based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Anqiang He. Anqiang He is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

17 of 17 papers shown
1.
He, Anqiang, Yunqing Tang, Mingyu Wu, D.L. Chen, & Dongyang Li. (2022). A Simple Surface Treatment for Mg to Gain Enhanced Resistance to Corrosion and Corrosive Wear by Hammering Al Powder‐Covered Mg Substrate. Advanced Materials Interfaces. 9(17). 2 indexed citations
2.
Clark, M.P., et al.. (2021). Atomic layer deposition of iron oxide on a porous carbon substrate via ethylferrocene and an oxygen plasma. Surface and Coatings Technology. 421. 127390–127390. 10 indexed citations
3.
Park, Dong-Yeob, Babak Shalchi Amirkhiz, Yiyu Wang, et al.. (2017). Effects of Heat-Affected Zone Microstructure on Fracture Toughness of Two X70 Pipe Girth Welds. Metallurgical and Materials Transactions A. 48(7). 3248–3260. 5 indexed citations
4.
He, Anqiang, et al.. (2016). Morphology and Composition of Structured, Phase-Separated Behenic Acid–Perfluorotetradecanoic Acid Monolayer Films. Langmuir. 32(21). 5341–5349. 16 indexed citations
5.
Tang, Wenming, et al.. (2010). Solid state interfacial reactions in electrodeposited Ni/Sn couples. International Journal of Minerals Metallurgy and Materials. 17(4). 459–463. 21 indexed citations
6.
He, Anqiang, et al.. (2010). A Cryo-XPS Study of Triammonium Citrate-KAuCl4-Na2SO3 Electroplating Solutions for Pb-Free Solder Packaging. Journal of Electronic Materials. 39(9). 1554–1561. 2 indexed citations
7.
Tang, Wenming, Anqiang He, Qi Liu, & Douglas G. Ivey. (2010). Solid state interfacial reactions in electrodeposited Cu/Sn couples. Transactions of Nonferrous Metals Society of China. 20(1). 90–96. 58 indexed citations
8.
Tang, Wenming, Anqiang He, Qi Liu, & Douglas G. Ivey. (2008). Fabrication and Microstructures of Sequentially Electroplated Sn-Rich Au-Sn Alloy Solders. Journal of Electronic Materials. 37(6). 837–844. 16 indexed citations
9.
Tang, Wenming, Anqiang He, Qi Liu, & Douglas G. Ivey. (2008). Room temperature interfacial reactions in electrodeposited Au/Sn couples. Acta Materialia. 56(19). 5818–5827. 62 indexed citations
10.
Tang, Wenming, Anqiang He, Qi Liu, & Douglas G. Ivey. (2007). Fabrication and microstructures of sequentially electroplated Au-rich, eutectic Au/Sn alloy solder. Journal of Materials Science Materials in Electronics. 19(12). 1176–1183. 16 indexed citations
11.
He, Anqiang, Qi Liu, & Douglas G. Ivey. (2007). Electrodeposition of tin: a simple approach. Journal of Materials Science Materials in Electronics. 19(6). 553–562. 67 indexed citations
12.
He, Anqiang & Douglas G. Ivey. (2003). Electron microscopy characterization of a molybdenum diffusion barrier in metallizations for chip carriers. Materials Science and Engineering B. 106(1). 33–40. 3 indexed citations
13.
Kumano, H., et al.. (2000). Intrinsic and Extrinsic Excitonic Features in MgS/ZnSe Superlattices Revealed by Microspectroscopy. Japanese Journal of Applied Physics. 39(2R). 501–501. 1 indexed citations
14.
Yang, Jie, H. Kahn, Anqiang He, S.M. Phillips, & A. H. Heuer. (2000). A new technique for producing large-area as-deposited zero-stress LPCVD polysilicon films: the MultiPoly process. Journal of Microelectromechanical Systems. 9(4). 485–494. 78 indexed citations
15.
Heya, Akira, Anqiang He, N. Ōtsuka, & Hideki Matsumura. (1998). Anomalous grain boundary and carrier transport in cat-CVD poly-Si films. Journal of Non-Crystalline Solids. 227-230. 1016–1020. 11 indexed citations
16.
He, Anqiang, Akira Heya, N. Ōtsuka, & Hideki Matsumura. (1998). Microstructure of Polysilicon Films Grown by Catalytic Chemical Vapor Deposition Method. Japanese Journal of Applied Physics. 37(1R). 92–92. 9 indexed citations
17.
Matsumura, Hideki, et al.. (1996). Low-Temperature Formation of Device-Quality Polysilicon Films by cat-CVD Method. MRS Proceedings. 452. 5 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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