A. Plößl

723 total citations
14 papers, 536 citations indexed

About

A. Plößl is a scholar working on Electrical and Electronic Engineering, Condensed Matter Physics and Atomic and Molecular Physics, and Optics. According to data from OpenAlex, A. Plößl has authored 14 papers receiving a total of 536 indexed citations (citations by other indexed papers that have themselves been cited), including 13 papers in Electrical and Electronic Engineering, 4 papers in Condensed Matter Physics and 2 papers in Atomic and Molecular Physics, and Optics. Recurrent topics in A. Plößl's work include 3D IC and TSV technologies (6 papers), Semiconductor Lasers and Optical Devices (5 papers) and Electronic Packaging and Soldering Technologies (5 papers). A. Plößl is often cited by papers focused on 3D IC and TSV technologies (6 papers), Semiconductor Lasers and Optical Devices (5 papers) and Electronic Packaging and Soldering Technologies (5 papers). A. Plößl collaborates with scholars based in Germany, United States and Austria. A. Plößl's co-authors include U. Gösele, T. Akatsu, S. Bäder, D. Eisert, Franz Eberhard, A. Weimar, S. Kaiser, Roland W. Scholz, B. Hahn and Andreas Schumacher and has published in prestigious journals such as Journal of Applied Physics, Materials Science and Engineering R Reports and Sensors and Actuators A Physical.

In The Last Decade

A. Plößl

14 papers receiving 513 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
A. Plößl Germany	8	437	195	133	99	92	14	536
T. Akatsu France	14	453 1.0×	167 0.9×	119 0.9×	131 1.3×	46 0.5×	20	522
F. Letertre France	17	938 2.1×	214 1.1×	227 1.7×	218 2.2×	81 0.9×	57	1.0k
Bangzhi Liu United States	9	188 0.4×	185 0.9×	135 1.0×	115 1.2×	169 1.8×	22	471
H. Wang Singapore	12	266 0.6×	237 1.2×	177 1.3×	54 0.5×	80 0.9×	29	479
M. Hoshino Japan	13	672 1.5×	236 1.2×	122 0.9×	131 1.3×	36 0.4×	36	762
Qingzhe Wen United States	7	177 0.4×	131 0.7×	110 0.8×	161 1.6×	26 0.3×	10	417
J. Stasiak United States	8	717 1.6×	89 0.5×	61 0.5×	243 2.5×	53 0.6×	19	814
Reza Sanatinia Sweden	12	228 0.5×	182 0.9×	237 1.8×	118 1.2×	47 0.5×	20	392
Y. Ohmura Japan	12	414 0.9×	171 0.9×	99 0.7×	194 2.0×	28 0.3×	58	522
A Stoffel Germany	10	251 0.6×	114 0.6×	133 1.0×	67 0.7×	33 0.4×	20	341

Countries citing papers authored by A. Plößl

Since Specialization

Citations

This map shows the geographic impact of A. Plößl's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by A. Plößl with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites A. Plößl more than expected).

Fields of papers citing papers by A. Plößl

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by A. Plößl. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by A. Plößl. The network helps show where A. Plößl may publish in the future.

Co-authorship network of co-authors of A. Plößl

This figure shows the co-authorship network connecting the top 25 collaborators of A. Plößl. A scholar is included among the top collaborators of A. Plößl based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with A. Plößl. A. Plößl is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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14 of 14 papers shown

Oppermann, Hermann, O. Ehrmann, A. Plößl, et al.. (2016). A thermally enhanced bond interface for pixelated LEDs in adaptive front lighting systems. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 1–7. 6 indexed citations

Illek, S., Ines Pietzonka, Michael Furitsch, et al.. (2011). Recent advances in VECSELs for laser projection applications. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 7919. 79190D–79190D. 4 indexed citations

Plößl, A., J. Baur, Karl Engl, et al.. (2010). (Invited) Wafer Bonding for the Manufacture of High-Brightness and High-Efficiency Light-Emitting Diodes. ECS Transactions. 33(4). 613–624. 6 indexed citations

Härle, V., Berthold Hahn, J. Baur, et al.. (2004). Advanced technologies for high-efficiency GaInN LEDs for solid state lighting. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 5187. 34–34. 13 indexed citations

Hahn, B., S. Kaiser, A. Weimar, et al.. (2004). High brightness LEDs for general lighting applications Using the new ThinGaN™-Technology. physica status solidi (a). 201(12). 2736–2739. 63 indexed citations

Gösele, U., G. Kästner, Stephan Senz, et al.. (2003). Wafer bonding: a flexible approach to materials integration. 231–231. 1 indexed citations

Schmid, W., et al.. (2002). High-efficiency red and infrared light-emitting diodes using radial outcoupling taper. IEEE Journal of Selected Topics in Quantum Electronics. 8(2). 256–263. 6 indexed citations

Akatsu, T., et al.. (2001). Wafer bonding of different III–V compound semiconductors by atomic hydrogen surface cleaning. Journal of Applied Physics. 90(8). 3856–3862. 37 indexed citations

Plößl, A., et al.. (2000). Silicon-on-insulator: materials aspects and applications. Solid-State Electronics. 44(5). 775–782. 39 indexed citations

10.

Kästner, G., T. Akatsu, Stephan Senz, A. Plößl, & U. Gösele. (2000). Large-area wafer bonding of GaAs using hydrogen and ultrahigh vacuum atmospheres. Applied Physics A. 70(1). 13–19. 19 indexed citations

11.

Akatsu, T., et al.. (1999). GaAs wafer bonding by atomic hydrogen surface cleaning. Journal of Applied Physics. 86(12). 7146–7150. 40 indexed citations

12.

Plößl, A.. (1999). Wafer direct bonding: tailoring adhesion between brittle materials. Materials Science and Engineering R Reports. 25(1-2). 1–88. 246 indexed citations

13.

Gösele, U., et al.. (1999). Wafer bonding for microsystems technologies. Sensors and Actuators A Physical. 74(1-3). 161–168. 53 indexed citations

14.

Senz, Stephan, A. Plößl, U. Gösele, et al.. (1998). Growth of partially strain-relaxed Si 1-y C y epilayers on (100)Si. Applied Physics A. 67(2). 147–150. 3 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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