Soon Wee Ho

Comprehensive review and future prospects on chip-scale thermal management: Core of data center’s thermal management

Roadmapping the next generation of silicon photonics

3-D Packaging With Through-Silicon Via (TSV) for Electrical and Fluidic Interconnections

Fabrication of High Aspect Ratio TSV and Assembly With Fine-Pitch Low-Cost Solder Microbump for Si Interposer Technology With High-Density Interconnects