Immediate Impact
2 from Science/Nature 43 standout
Citing Papers
Recent Advances and Trends in Advanced Packaging
2022 Standout
Two-dimensional materials for next-generation computing technologies
2020 Standout
Works of N. Sillon being referenced
ASSESSMENT AND CHARACTERIZATION OF STRESS INDUCED BY VIA-FIRST TSV TECHNOLOGY
2011
System on Wafer: A New Silicon Concept in SiP
2009
Author Peers
| Author | Last Decade | Papers | Cites | ||||
|---|---|---|---|---|---|---|---|
| N. Sillon | 87 | 46 | 12 | 29 | 17 | 120 | |
| Xiaokang Guan | 94 | 22 | 7 | 34 | 21 | 162 | |
| Kurt K. Christenson | 61 | 28 | 5 | 6 | 21 | 121 | |
| Nonchanutt Chudpooti | 184 | 83 | 2 | 7 | 27 | 204 | |
| Yunshan Wang | 150 | 25 | 5 | 18 | 26 | 176 | |
| P. Santos | 128 | 21 | 17 | 7 | 25 | 176 | |
| Stefan Götz | 29 | 10 | 20 | 7 | 17 | 106 | |
| Alexandre Giry | 90 | 24 | 4 | 7 | 20 | 128 | |
| J. C. Barbé | 203 | 57 | 7 | 5 | 18 | 234 | |
| Jingjing Zhou | 151 | 43 | 16 | 10 | 25 | 187 | |
| Jianguo Hu | 120 | 119 | 4 | 7 | 21 | 178 |
All Works
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