Standout Papers

Damascene copper electroplating for chip interconnections 1998 2026 2007 2016 961
  1. Damascene copper electroplating for chip interconnections (1998)
    P. C. Andricacos, Cyprian Uzoh et al. IBM Journal of Research and Development

Immediate Impact

7 from Science/Nature 60 standout
Sub-graph 1 of 24

Citing Papers

Separators and Membranes for Advanced Alkaline Water Electrolysis
2024 Standout
Bifunctional Electrocatalysts for Overall and Hybrid Water Splitting
2024 Standout
14 intermediate papers

Works of John Dukovic being referenced

Feature-scale simulation of resist-patterned electrodeposition
1993
The Influence of Attached Bubbles on Potential Drop and Current Distribution at Gas‐Evolving Electrodes
1987

Author Peers

Author Last Decade Papers Cites
John Dukovic 1348 643 469 18 1.6k
Jean Horkans 1453 713 504 31 1.8k
Cyprian Uzoh 1131 474 593 18 1.3k
Valery M. Dubin 1128 658 514 38 1.5k
Cody Friesen 696 507 200 33 1.3k
J.W. Diggle 725 1168 148 13 1.7k
Pengwei Wang 665 842 265 28 1.5k
S. Senderoff 1095 758 103 28 1.8k
Jonathan P. Edgeworth 746 1102 197 9 1.6k
Ganapathiraman Ramanath 717 1522 312 36 2.1k
C. M. Wang 1081 1175 524 36 2.1k

All Works

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2026