Immediate Impact
1 standout
Citing Papers
Comprehensive review and future prospects on chip-scale thermal management: Core of data center’s thermal management
2024 Standout
Works of Eric Qin being referenced
Architecture, Chip, and Package Codesign Flow for Interposer-Based 2.5-D Chiplet Integration Enabling Heterogeneous IP Reuse
2020
Author Peers
| Author | Last Decade | Papers | Cites | |||
|---|---|---|---|---|---|---|
| Eric Qin | 12 | 15 | 43 | 5 | 59 | |
| Aseem Sayal | 7 | 7 | 44 | 5 | 54 | |
| Wilfred Gomes | 9 | 6 | 26 | 4 | 49 | |
| Tadanobu Inoue | 8 | 7 | 45 | 5 | 69 | |
| R. Rand | 16 | 17 | 38 | 7 | 60 | |
| Hung-Sheng Chang | 27 | 27 | 21 | 7 | 53 | |
| Charbel Sakr | 5 | 10 | 35 | 6 | 66 | |
| Marcian E. Hoff | 9 | 13 | 30 | 7 | 49 | |
| Chien-Chin Huang | 7 | 8 | 10 | 4 | 44 | |
| John Wuu | 19 | 24 | 62 | 5 | 77 | |
| Edward Stott | 19 | 40 | 34 | 7 | 54 |
All Works
Loading papers...