Immediate Impact

4 standout
Sub-graph 1 of 2

Citing Papers

Advances, limitations and prospects of nondestructive testing and evaluation of thick composites and sandwich structures: A state-of-the-art review
2020 Standout
Basic mechanisms and modeling of single-event upset in digital microelectronics
2003 Standout
2 intermediate papers

Works of A. Strong being referenced

Determination of the thermal conductivity of composite low-k dielectrics for advanced interconnect structures
2005
The use of simulation in semiconductor technology development
1990

Author Peers

Author Last Decade Papers Cites
A. Strong 23 4 6 5 28
C. Fuchs 20 4 5 4 22
Dave Huffman 23 5 5 6 28
T. P. Downes 11 4 1 6 7 25
A.J. van Genderen 44 4 9 4 44
K. Ranjan 27 3 4 5 5 33
Michel Mardiguian 34 4 1 2 5 43
K. Wessel 31 6 5 33
Uri Cummings 24 1 1 8 6 37
D. Allasia 13 6 12 17 4 25
А. А. Kosarev 15 4 2 5 33

All Works

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Rankless by CCL
2026