Flip Chip Technologies
- Authors
- John H. Lau
In The Last Decade
doi.org/w89957637 →Countries where authors are citing Flip Chip Technologies
This map shows the geographic impact of Flip Chip Technologies. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Flip Chip Technologies with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Flip Chip Technologies more than expected).
Fields of papers citing Flip Chip Technologies
This network shows the impact of Flip Chip Technologies. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the Flip Chip Technologies.
About Flip Chip Technologies
This paper, published in 1995, received 489 indexed citations . Written by John H. Lau covering the research area of Hardware and Architecture, Electrical and Electronic Engineering and Biomedical Engineering. It is primarily cited by scholars working on Electrical and Electronic Engineering (451 citations), Mechanical Engineering (162 citations) and Mechanics of Materials (76 citations).
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.
This paper is also available at doi.org/w89957637.