Zhijia Han
- Materials Chemistry top 5%
- Electrical and Electronic Engineering top 10%
- Biomedical Engineering
- Civil and Structural Engineering top 5%
- Electronic, Optical and Magnetic Materials top 10%
- Topics
- Advanced Thermoelectric Materials and Devices (26 papers)Thermal properties of materials (15 papers)Thermal Expansion and Ionic Conductivity (8 papers)
- Cited by
- Materials ChemistryElectronic, Optical and Magnetic MaterialsCivil and Structural Engineering
- Partner nations
- ChinaHong KongUnited States
In The Last Decade
Zhijia Han
29 papers receiving 1.3k citations
Hit Papers
Peers
Comparison fields: 5 of 51
- Materials Chemistry 1.1k
- Electrical and Electronic Engineering 425
- Biomedical Engineering 251
- Civil and Structural Engineering 243
- Electronic, Optical and Magnetic Materials 223
Countries citing papers authored by Zhijia Han
This map shows the geographic impact of Zhijia Han's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Zhijia Han with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Zhijia Han more than expected).
Fields of papers citing papers by Zhijia Han
This network shows the impact of papers produced by Zhijia Han. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Zhijia Han. The network helps show where Zhijia Han may publish in the future.
Co-authorship network of co-authors of Zhijia Han
This figure shows the co-authorship network connecting the top 25 collaborators of Zhijia Han. A scholar is included among the top collaborators of Zhijia Han based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Zhijia Han. Zhijia Han is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 3 | |
| 2 | 1 | |
| 3 | 16 | |
| 4 | 16 | |
| 5 | 94 | |
| 6 | 6 | |
| 7 | 7 | |
| 8 | 5 | |
| 9 | 15 | |
| 10 | 42 | |
| 11 | 5 | |
| 12 | 27 | |
| 13 | 35 | |
| 14 | 40 | |
| 15 | 54 | |
| 16 | 22 | |
| 17 | 7 | |
| 18 | 31 | |
| 19 | Giant thermopower of ionic gelatin near room temperaturebreakdown → | 565 |
| 20 | 37 |
About Zhijia Han
Zhijia Han is a scholar working on Materials Chemistry, Electronic, Optical and Magnetic Materials and Polymers and Plastics, having authored 30 papers that have together received 1.3k indexed citations. Recurring topics across this work include Advanced Thermoelectric Materials and Devices (26 papers), Thermal properties of materials (15 papers) and Thermal Expansion and Ionic Conductivity (8 papers). The work is most often cited by research in Materials Chemistry (1.1k citations), Electronic, Optical and Magnetic Materials (223 citations) and Civil and Structural Engineering (243 citations). Zhijia Han has collaborated with scholars based in China, Hong Kong and United States. Frequent co-authors include Weishu Liu, Yongbin Zhu, Wenqing Zhang, Biao Deng, Gang Chen, Qikai Li, Cheng‐Gong Han, Weichao Wang, Shien‐Ping Feng and Xin Qian. Their work appears in journals such as Science, Advanced Materials and Nature Communications.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.