Yung‐Chi Lin

445 total citations
19 papers, 372 citations indexed

About

Yung‐Chi Lin is a scholar working on Education, Electrical and Electronic Engineering and Mechanical Engineering. According to data from OpenAlex, Yung‐Chi Lin has authored 19 papers receiving a total of 372 indexed citations (citations by other indexed papers that have themselves been cited), including 9 papers in Education, 9 papers in Electrical and Electronic Engineering and 4 papers in Mechanical Engineering. Recurrent topics in Yung‐Chi Lin's work include Electronic Packaging and Soldering Technologies (9 papers), 3D IC and TSV technologies (8 papers) and Mathematics Education and Teaching Techniques (8 papers). Yung‐Chi Lin is often cited by papers focused on Electronic Packaging and Soldering Technologies (9 papers), 3D IC and TSV technologies (8 papers) and Mathematics Education and Teaching Techniques (8 papers). Yung‐Chi Lin collaborates with scholars based in Taiwan. Yung‐Chi Lin's co-authors include Jenq‐Gong Duh, Der‐Ching Yang, Shih-Kang Tien, Sien Chi, Ching‐Hung Lee and Jey‐Jau Lee and has published in prestigious journals such as Journal of Alloys and Compounds, Scripta Materialia and Journal of materials research/Pratt's guide to venture capital sources.

In The Last Decade

Yung‐Chi Lin

17 papers receiving 362 citations

Peers

Yung‐Chi Lin
R. J. Roedel United States
Po-Jui Chiang Taiwan
Felipe Jiménez Spain
Nguyen Huu Trung Japan
Juan C. González Spain
Dadi Setiadi Indonesia
Branimir Pejčinović United States
Eny Latifah Indonesia
R. J. Roedel United States
Yung‐Chi Lin
Citations per year, relative to Yung‐Chi Lin Yung‐Chi Lin (= 1×) peers R. J. Roedel

Countries citing papers authored by Yung‐Chi Lin

Since Specialization
Citations

This map shows the geographic impact of Yung‐Chi Lin's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Yung‐Chi Lin with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Yung‐Chi Lin more than expected).

Fields of papers citing papers by Yung‐Chi Lin

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Yung‐Chi Lin. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Yung‐Chi Lin. The network helps show where Yung‐Chi Lin may publish in the future.

Co-authorship network of co-authors of Yung‐Chi Lin

This figure shows the co-authorship network connecting the top 25 collaborators of Yung‐Chi Lin. A scholar is included among the top collaborators of Yung‐Chi Lin based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Yung‐Chi Lin. Yung‐Chi Lin is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

19 of 19 papers shown
1.
Yang, Der‐Ching & Yung‐Chi Lin. (2024). A comparison of functions in Finnish, Singaporean, and Taiwanese middle-school mathematics textbooks. Humanities and Social Sciences Communications. 11(1). 1 indexed citations
2.
3.
Lin, Yung‐Chi. (2022). Using virtual classroom simulations in a mathematics methods course to develop pre‐service primary mathematics teachers' noticing skills. British Journal of Educational Technology. 54(3). 734–753. 7 indexed citations
4.
Lin, Yung‐Chi. (2021). Using a drawing method to investigate pre-service teachers’ beliefs, knowledge and emotions about mathematics teaching and learning. Asia-Pacific Journal of Teacher Education. 50(5). 474–497. 6 indexed citations
5.
Lin, Yung‐Chi, et al.. (2016). Analyzing Changes in Four Teachers’ Knowledge and Practice of Inquiry-Based Mathematics Teaching. The Asia-Pacific Education Researcher. 25(5-6). 845–862. 5 indexed citations
6.
Lin, Yung‐Chi & Der‐Ching Yang. (2015). Examining the Differences of Linear Systems between Finnish and Taiwanese Textbooks. Eurasia Journal of Mathematics Science and Technology Education. 11(6). 10 indexed citations
7.
Yang, Der‐Ching & Yung‐Chi Lin. (2015). Assessing 10- to 11-year-old children’s performance and misconceptions in number sense using a four-tier diagnostic test. Educational Research. 57(4). 368–388. 40 indexed citations
8.
Yang, Der‐Ching & Yung‐Chi Lin. (2015). Using Calculator-Assisted Instruction to Enhance Low-Achievers in Learning Number Sense: A Case Study of Two Fifth Graders in Taiwan. Journal of Education and Learning. 4(2). 1 indexed citations
9.
Yang, Der‐Ching, et al.. (2015). Diagnosing Students’ Misconceptions in Number Sense via a Web-Based Two-Tier Test. Eurasia Journal of Mathematics Science and Technology Education. 12(1). 20 indexed citations
10.
Lin, Yung‐Chi, et al.. (2010). In situ investigation of the interfacial reaction in Sn/Cu system by synchrotron radiation. Journal of materials research/Pratt's guide to venture capital sources. 25(5). 972–975. 8 indexed citations
11.
Lin, Yung‐Chi, et al.. (2009). Detailed Phase Evolution of a Phosphorous-Rich Layer and Formation of the Ni-Sn-P Compound in Sn-Ag-Cu/Electroplated Ni-P Solder Joints. Journal of Electronic Materials. 39(3). 283–294. 39 indexed citations
12.
Lin, Yung‐Chi & Ching‐Hung Lee. (2008). System Identification and Adaptive Filter Using a Novel Fuzzy Neuro System. 13 indexed citations
13.
Lin, Yung‐Chi, et al.. (2007). Morphological and Microstructural Evolution of Phosphorous-Rich Layer in SnAgCu/Ni-P UBM Solder Joint. Journal of Electronic Materials. 36(11). 1469–1475. 20 indexed citations
14.
Lin, Yung‐Chi & Jenq‐Gong Duh. (2006). Effect of surfactant on electrodeposited Ni–P layer as an under bump metallization. Journal of Alloys and Compounds. 439(1-2). 74–80. 24 indexed citations
15.
Lin, Yung‐Chi, et al.. (2006). Controlling intermetallic compound growth in SnAgCu/Ni-P solder joints by nanosized Cu6Sn5 addition. Journal of Electronic Materials. 35(3). 486–493. 27 indexed citations
16.
Lin, Yung‐Chi & Jenq‐Gong Duh. (2006). Phase transformation of the phosphorus-rich layer in SnAgCu/Ni–P solder joints. Scripta Materialia. 54(9). 1661–1665. 61 indexed citations
17.
Lin, Yung‐Chi, et al.. (2006). Suppressing Ni–Sn–P growth in SnAgCu/Ni–P solder joints. Scripta Materialia. 56(1). 49–52. 53 indexed citations
18.
Lin, Yung‐Chi, Jenq‐Gong Duh, & Sien Chi. (2006). Wettability of electroplated Ni-P in under bump metallurgy with Sn-Ag-Cu solder. Journal of Electronic Materials. 35(1). 7–14. 26 indexed citations
19.
Lin, Yung‐Chi & Jenq‐Gong Duh. (2006). Optimal phosphorous content selection for the soldering reaction of Ni-P under bump metallization with Sn-Ag-Cu solder. Journal of Electronic Materials. 35(8). 1665–1671. 11 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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