Yaocheng Zhang
- Mechanical Engineering top 2%
- Electrical and Electronic Engineering top 10%
- Automotive Engineering top 5%
- Aerospace Engineering top 5%
- Materials Chemistry
- Co-authors
- Li YangJun DaiPulin NieYixiong WuZhuguo LiJinguo GeTao MengPengcheng Shi
- Topics
- Electronic Packaging and Soldering Technologies (33 papers)Aluminum Alloys Composites Properties (28 papers)3D IC and TSV technologies (19 papers)
- Partner nations
- ChinaAustraliaUnited States
In The Last Decade
Yaocheng Zhang
65 papers receiving 1.2k citations
Peers
Comparison fields: 5 of 57
- Mechanical Engineering 903
- Electrical and Electronic Engineering 443
- Automotive Engineering 247
- Aerospace Engineering 199
- Materials Chemistry 161
Countries citing papers authored by Yaocheng Zhang
This map shows the geographic impact of Yaocheng Zhang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Yaocheng Zhang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Yaocheng Zhang more than expected).
Fields of papers citing papers by Yaocheng Zhang
This network shows the impact of papers produced by Yaocheng Zhang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Yaocheng Zhang. The network helps show where Yaocheng Zhang may publish in the future.
Co-authorship network of co-authors of Yaocheng Zhang
This figure shows the co-authorship network connecting the top 25 collaborators of Yaocheng Zhang. A scholar is included among the top collaborators of Yaocheng Zhang based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Yaocheng Zhang. Yaocheng Zhang is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 0 | |
| 2 | 1 | |
| 3 | 0 | |
| 4 | 0 | |
| 5 | 3 | |
| 6 | 11 | |
| 7 | 0 | |
| 8 | 10 | |
| 9 | 5 | |
| 10 | 22 | |
| 11 | 6 | |
| 12 | 8 | |
| 13 | 18 | |
| 14 | 6 | |
| 15 | 2 | |
| 16 | Microstructure and mechanical properties of Sn58Bi-xW composite solder | 1 |
| 17 | 14 | |
| 18 | 5 | |
| 19 | 22 | |
| 20 | Effect of Ca on Compressive Creep Behavior of AE41 Alloy | 1 |
About Yaocheng Zhang
Yaocheng Zhang is a scholar working on Mechanical Engineering, Aerospace Engineering and Electrical and Electronic Engineering, having authored 69 papers that have together received 1.2k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (33 papers), Aluminum Alloys Composites Properties (28 papers) and 3D IC and TSV technologies (19 papers). The work is most often cited by research in Mechanical Engineering (903 citations), Automotive Engineering (247 citations) and Biomaterials (119 citations). Yaocheng Zhang has collaborated with scholars based in China, Australia and United States. Frequent co-authors include Li Yang, Jun Dai, Pulin Nie, Yixiong Wu, Zhuguo Li, Jinguo Ge, Tao Meng, Pengcheng Shi, Zhonghui Wang and Hongfa Xiang. Their work appears in journals such as Langmuir, ACS Applied Materials & Interfaces and Journal of Membrane Science.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.