Yangang He

627 total citations
32 papers, 496 citations indexed

About

Yangang He is a scholar working on Biomedical Engineering, Electrical and Electronic Engineering and Materials Chemistry. According to data from OpenAlex, Yangang He has authored 32 papers receiving a total of 496 indexed citations (citations by other indexed papers that have themselves been cited), including 22 papers in Biomedical Engineering, 15 papers in Electrical and Electronic Engineering and 14 papers in Materials Chemistry. Recurrent topics in Yangang He's work include Advanced Surface Polishing Techniques (22 papers), Advanced machining processes and optimization (10 papers) and Diamond and Carbon-based Materials Research (9 papers). Yangang He is often cited by papers focused on Advanced Surface Polishing Techniques (22 papers), Advanced machining processes and optimization (10 papers) and Diamond and Carbon-based Materials Research (9 papers). Yangang He collaborates with scholars based in China and Türkiye. Yangang He's co-authors include Fang Yang, Fengxia Ren, Gang Li, Guixiang Wang, Baimei Tan, Shihao Zhang, Baohong Gao, Xinhuan Niu, Baoguo Zhang and Chenqi Yan and has published in prestigious journals such as Carbohydrate Polymers, Applied Surface Science and Journal of Applied Polymer Science.

In The Last Decade

Yangang He

30 papers receiving 472 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Yangang He China 11 293 199 148 119 52 32 496
Chuan‐Lin Mou China 12 447 1.5× 226 1.1× 185 1.3× 54 0.5× 77 1.5× 23 648
Mingyu Zhou China 9 121 0.4× 389 2.0× 215 1.5× 269 2.3× 76 1.5× 52 757
Haidong Zhao China 13 121 0.4× 237 1.2× 140 0.9× 52 0.4× 54 1.0× 33 520
Barbara Berke Hungary 10 173 0.6× 147 0.7× 85 0.6× 48 0.4× 51 1.0× 16 459
Qiannan Zhou China 17 159 0.5× 214 1.1× 423 2.9× 40 0.3× 35 0.7× 28 787
Danping Sun China 13 143 0.5× 223 1.1× 90 0.6× 38 0.3× 8 0.2× 18 916
Lijun Xiong China 11 210 0.7× 65 0.3× 43 0.3× 159 1.3× 266 5.1× 38 600

Countries citing papers authored by Yangang He

Since Specialization
Citations

This map shows the geographic impact of Yangang He's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Yangang He with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Yangang He more than expected).

Fields of papers citing papers by Yangang He

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Yangang He. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Yangang He. The network helps show where Yangang He may publish in the future.

Co-authorship network of co-authors of Yangang He

This figure shows the co-authorship network connecting the top 25 collaborators of Yangang He. A scholar is included among the top collaborators of Yangang He based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Yangang He. Yangang He is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Guo, Yongkang, et al.. (2025). Effect of L-isoleucine on the Removal Rate Selectivity of SiO2/Si3N4 in Chemical Mechanical Polishing of Shallow Trench Isolation. ECS Journal of Solid State Science and Technology. 14(4). 44008–44008.
2.
Li, Xianghui, et al.. (2024). Effect of picolinic acid and sorbitol in ceria-based slurry on shallow trench isolation chemical mechanical polishing. Colloids and Surfaces A Physicochemical and Engineering Aspects. 708. 136013–136013.
3.
Li, Xianghui, Ying Wei, Mingyan Xu, et al.. (2024). A special electrostatic self-assembly structure of colloidal silica: Improving Chemical Mechanical Polishing performance. Materials Science in Semiconductor Processing. 173. 108169–108169. 3 indexed citations
4.
5.
Wang, Hanxiao, et al.. (2024). Effect of 3-amino-1,2,4-triazole and triethylenetetramine on silicon backside thinning chemical mechanical polishing. Materials Science in Semiconductor Processing. 185. 108960–108960. 2 indexed citations
6.
Li, Xianghui, et al.. (2023). The role of ammonium citrate and dodecyl pyridinium chloride on chemical mechanical polishing relevant to SiO2 dielectric layer. Journal of Manufacturing Processes. 107. 333–344. 9 indexed citations
7.
Li, Xianghui, et al.. (2023). The Role of EDTA-2K in the Chemical Mechanical Polishing of Aluminum. ECS Journal of Solid State Science and Technology. 12(2). 24002–24002. 8 indexed citations
8.
Zhang, Chao, et al.. (2023). Film-Cooling Performance of Cylindrical and Cratered Holes Fed by a Perpendicular Crossflow. Journal of Engineering Physics and Thermophysics. 96(2). 482–491. 1 indexed citations
9.
Li, Xianghui, et al.. (2023). Effect of ammonium-species addition on tantalum chemical mechanical polishing with oxalic-acid-based slurries. Journal of materials research/Pratt's guide to venture capital sources. 38(9). 2379–2388. 6 indexed citations
10.
Zhang, Shihao, Fangyuan Wang, Baimei Tan, et al.. (2022). Recent advances and future developments in PVA brush scrubbing cleaning: A review. Materials Science in Semiconductor Processing. 152. 107122–107122. 14 indexed citations
11.
Wang, Hanxiao, et al.. (2022). Synergistic effect of aminosilane and K2CO3 on improving Chemical Mechanical Polishing performance of SiO2 dielectric layer. Materials Science in Semiconductor Processing. 146. 106702–106702. 12 indexed citations
12.
Ma, Tengda, Baimei Tan, Lei Guo, et al.. (2021). Multidimensional insights into the corrosion inhibition of potassium oleate on Cu in alkaline medium: A combined Experimental and theoretical investigation. Materials Science and Engineering B. 272. 115330–115330. 28 indexed citations
13.
Wang, Hanxiao, et al.. (2020). Effect of Abrasive Particle Size Distribution on Removal Rate of Silicon Wafers. ECS Journal of Solid State Science and Technology. 9(12). 124001–124001. 9 indexed citations
14.
Yang, Shenghua, Baoguo Zhang, Chenwei Wang, et al.. (2019). Effect of multi-functional amines on SiGe surface finish during chemical mechanical polishing. Materials Science in Semiconductor Processing. 99. 114–124. 2 indexed citations
15.
Hu, Yi, et al.. (2016). The optimization of FA/O barrier slurry with respect to removal rate selectivity on patterned Cu wafers. Journal of Semiconductors. 37(2). 26003–26003. 1 indexed citations
16.
Lin, Wenxian, et al.. (2015). Hydrodynamic stability analysis of sheared convective boundary layer flows in stratified environments. ResearchOnline at James Cook University (James Cook University). 1 indexed citations
17.
Hu, Yi, et al.. (2011). Effect of alkaline slurry on the electric character of the pattern Cu wafer. Journal of Semiconductors. 32(7). 76002–76002. 4 indexed citations
18.
He, Yangang, Gang Li, Xueqing Yu, et al.. (2007). Plasma-Initiated Polymerization of (2-Methacryloyloxyethyl) Thrimethyl Ammonium Chloride. TURKISH JOURNAL OF CHEMISTRY. 31(1). 11–16. 1 indexed citations
19.
He, Yangang, Gang Li, Fang Yang, et al.. (2007). Precipitation polymerization of acrylamide with quaternary ammonium cationic monomer in potassium carbonate solution initiated by plasma. Journal of Applied Polymer Science. 104(6). 4060–4067. 10 indexed citations
20.
Yang, Chao, et al.. (2007). Studies of precipitated polymerization of acrylamide with quaternary ammonium cationic comonomer in potassium citrate solution. Journal of Applied Polymer Science. 106(4). 2479–2484. 5 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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