Xinhuan Niu

3.2k total citations
125 papers, 2.4k citations indexed

About

Xinhuan Niu is a scholar working on Biomedical Engineering, Electrical and Electronic Engineering and Materials Chemistry. According to data from OpenAlex, Xinhuan Niu has authored 125 papers receiving a total of 2.4k indexed citations (citations by other indexed papers that have themselves been cited), including 94 papers in Biomedical Engineering, 53 papers in Electrical and Electronic Engineering and 41 papers in Materials Chemistry. Recurrent topics in Xinhuan Niu's work include Advanced Surface Polishing Techniques (79 papers), Diamond and Carbon-based Materials Research (23 papers) and Integrated Circuits and Semiconductor Failure Analysis (23 papers). Xinhuan Niu is often cited by papers focused on Advanced Surface Polishing Techniques (79 papers), Diamond and Carbon-based Materials Research (23 papers) and Integrated Circuits and Semiconductor Failure Analysis (23 papers). Xinhuan Niu collaborates with scholars based in China, United States and United Kingdom. Xinhuan Niu's co-authors include Jianchao Wang, Yaqi Cui, Ru Wang, Jiakai Zhou, Zhi Wang, Chenwei Wang, Hao Liu, Yuling Liu, Haifeng Li and Shoukun Chen and has published in prestigious journals such as Applied and Environmental Microbiology, Journal of The Electrochemical Society and Journal of Agricultural and Food Chemistry.

In The Last Decade

Xinhuan Niu

114 papers receiving 2.3k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Xinhuan Niu China 29 1.5k 803 772 463 417 125 2.4k
Hongsheng Gao China 19 860 0.6× 1.2k 1.6× 271 0.4× 283 0.6× 251 0.6× 51 2.4k
Zhiguang Liu China 29 1.1k 0.7× 557 0.7× 776 1.0× 584 1.3× 84 0.2× 91 2.6k
Päivi Laaksonen Finland 26 868 0.6× 683 0.9× 244 0.3× 134 0.3× 332 0.8× 57 2.6k
Qiuyue Yang China 24 667 0.4× 709 0.9× 914 1.2× 88 0.2× 110 0.3× 45 1.9k
Hye Jin Hwang South Korea 10 1.4k 0.9× 153 0.2× 493 0.6× 195 0.4× 200 0.5× 13 1.9k
Petri Ihalainen Finland 33 1.8k 1.2× 365 0.5× 1.2k 1.5× 77 0.2× 121 0.3× 98 3.0k
Siyuan Lu China 27 458 0.3× 602 0.7× 289 0.4× 947 2.0× 126 0.3× 83 2.2k
Yusuke Ito Japan 22 418 0.3× 464 0.6× 973 1.3× 281 0.6× 118 0.3× 142 2.0k
Patrick A. Rühs Switzerland 24 1.2k 0.8× 637 0.8× 191 0.2× 406 0.9× 152 0.4× 46 2.6k
Young‐Jin Kim South Korea 17 1.2k 0.8× 293 0.4× 538 0.7× 220 0.5× 54 0.1× 68 2.0k

Countries citing papers authored by Xinhuan Niu

Since Specialization
Citations

This map shows the geographic impact of Xinhuan Niu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Xinhuan Niu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Xinhuan Niu more than expected).

Fields of papers citing papers by Xinhuan Niu

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Xinhuan Niu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Xinhuan Niu. The network helps show where Xinhuan Niu may publish in the future.

Co-authorship network of co-authors of Xinhuan Niu

This figure shows the co-authorship network connecting the top 25 collaborators of Xinhuan Niu. A scholar is included among the top collaborators of Xinhuan Niu based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Xinhuan Niu. Xinhuan Niu is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
2.
Hu, Bin, Xinhuan Niu, Jiakai Zhou, et al.. (2025). Unveiling Microscopic Mechanisms of Chemical Mechanical Polishing via Multi‐Scale Theoretical Calculations. Journal of Computational Chemistry. 46(22). e70213–e70213.
3.
Zhang, Haining, Bo Gao, Fengyu Li, et al.. (2025). Ligand-performance relationships of surface-modified CeO2 in chemical mechanical polishing: A case of coordination number. Surfaces and Interfaces. 74. 107734–107734. 1 indexed citations
4.
He, Chao, et al.. (2024). Effect of novel non-inhibitor slurry on chemical mechanical polishing properties of copper interconnect copper film based on experiments and theoretical calculations. Colloids and Surfaces A Physicochemical and Engineering Aspects. 704. 135457–135457. 1 indexed citations
5.
Liu, Jianghao, et al.. (2024). Chemical mechanical polishing for copper films in integrated circuit wiring layers using an advanced slurry. Tribology International. 198. 109832–109832. 12 indexed citations
6.
7.
Niu, Xinhuan, et al.. (2024). Multifunctional sensors for surface synchronized monitoring of Pressure/Biopotential signals and motion recognition. Chemical Engineering Journal. 496. 154214–154214. 4 indexed citations
8.
Niu, Xinhuan, et al.. (2024). Effects of grazing disturbances on soil seed bank diversity in two vegetation types. Global Ecology and Conservation. 53. e03047–e03047.
9.
10.
Wu, Jiang‐Nan, Wei Li, Zihao Zhang, et al.. (2023). Microglial priming induced by loss of Mef2C contributes to postoperative cognitive dysfunction in aged mice. Experimental Neurology. 365. 114385–114385. 10 indexed citations
11.
Zhu, Pengfei, Di Zhang, Xinhuan Niu, et al.. (2023). A Lightweight Neural Network for Spectroscopic Ellipsometry Analysis. Advanced Optical Materials. 12(4). 2 indexed citations
12.
Yan, Han, et al.. (2023). A review: research progress of chemical–mechanical polishing slurry for copper interconnection of integrated circuits. The International Journal of Advanced Manufacturing Technology. 125(1-2). 47–71. 33 indexed citations
13.
Niu, Xinhuan, et al.. (2023). Surface Interaction Effect and Mechanism of Methionine Derivatives as Novel Inhibitors for Alkaline Copper CMP: Insights from Molecular Simulation and Experimental Analysis. ECS Journal of Solid State Science and Technology. 12(9). 94001–94001. 9 indexed citations
14.
Ma, Tengda, Baimei Tan, Yuling Liu, et al.. (2019). Role of 1,2-benzisothiazolin-3-one (BIT) in the Improvement of Barrier CMP Performance with Alkaline Slurry. ECS Journal of Solid State Science and Technology. 8(9). P449–P456. 8 indexed citations
15.
Wang, Jianchao, Xinhuan Niu, Yuling Liu, et al.. (2018). Improvement of Barrier CMP Performance with Alkaline Slurry: Role of Ionic Strength. ECS Journal of Solid State Science and Technology. 7(9). P462–P467. 16 indexed citations
16.
Liu, Yuling, et al.. (2018). Application of surfactant for facilitating benzotriazole removal and inhibiting copper corrosion during post-CMP cleaning. Microelectronic Engineering. 202. 1–8. 28 indexed citations
17.
Wang, Qingwei, et al.. (2018). Controlling the Removal Rate Selectivity of Ruthenium to Copper during CMP by Using Guanidine Carbonate and 1, 2, 4-Triazole. ECS Journal of Solid State Science and Technology. 7(10). P567–P574. 14 indexed citations
18.
Wang, Yanxin, Xinhuan Niu, Xiaoli Guo, et al.. (2018). Heterologous expression, characterization and possible functions of the chitin deacetylases, Cda1 and Cda2, from mushroom Coprinopsis cinerea. Glycobiology. 28(5). 318–332. 20 indexed citations
19.
Niu, Xinhuan, et al.. (2017). Genome-wide analysis of basic helix-loop-helix (bHLH) transcription factors in Brachypodium distachyon. BMC Genomics. 18(1). 619–619. 75 indexed citations
20.
Zhang, Wenming, Xinhuan Niu, Wen Zhang, Zhonghua Liu, & Sheng Yuan. (2013). The cultivation of Agaricus bisporus on the spent substrate of Flammulina velutipes. African Journal of Agricultural Research. 8(38). 4860–4863. 9 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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