Xing‐Chang Wei
-
- Metamaterials and Metasurfaces Applications 20
- Aerospace Engineering top 0.5%
- Advanced Antenna and Metasurface Technologies 73
- Antenna Design and Analysis 29
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- Electromagnetic Compatibility and Measurements 104
- Electromagnetic Compatibility and Noise Suppression 97
- Microwave Engineering and Waveguides 31
- Microwave and Dielectric Measurement Techniques 29
- 3D IC and TSV technologies 22
- Polymers and Plastics top 10%
- Co-authors
- Da YiEr‐Ping LiWenge ZhengBin ShenWentao ZhaiEn‐Xiao LiuYufei ShuRui Yang
- Cited by
- Electronic, Optical and Magnetic MaterialsNuclear Energy and EngineeringAerospace Engineering
- Journals
- IEEE Transactions on Electromagnetic Compatibility (28 papers)IEEE Transactions on Antennas and Propagation (12 papers)IEEE Transactions on Microwave Theory and Techniques (11 papers)
- Partner nations
- ChinaSingaporeUnited States
In The Last Decade
Xing‐Chang Wei
185 papers receiving 2.8k citations
Hit Papers
Peers
Comparison fields: 5 of 69
- Electronic, Optical and Magnetic Materials 1.2k
- Nuclear Energy and Engineering 26
- Aerospace Engineering 1.4k
- Electrical and Electronic Engineering 1.6k
- Polymers and Plastics 205
Countries citing papers authored by Xing‐Chang Wei
This map shows the geographic impact of Xing‐Chang Wei's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Xing‐Chang Wei with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Xing‐Chang Wei more than expected).
Fields of papers citing papers by Xing‐Chang Wei
This network shows the impact of papers produced by Xing‐Chang Wei. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Xing‐Chang Wei. The network helps show where Xing‐Chang Wei may publish in the future.
Co-authorship network
The 25 scholars most cited alongside Xing‐Chang Wei, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2025 | 0 | |
| 2 | 2024 | 0 | |
| 3 | 2024 | 0 | |
| 4 | 2024 | 1 | |
| 5 | 2024 | 1 | |
| 6 | 2023 | 1 | |
| 7 | 2022 | 12 | |
| 8 | 2020 | 9 | |
| 9 | 2019 | 30 | |
| 10 | 2019 | 65 | |
| 11 | A Wideband and High Sensitivity Probe Design for Near-Field Scanning | 2019 | 1 |
| 12 | A Miniaturized Stop-Band Frequency Selective Surface Based on Sub-wavelength Slow-Wave Dipole | 2019 | 1 |
| 13 | 2017 | 18 | |
| 14 | 2015 | 3 | |
| 15 | Crosstalk reduction in TSV arrays with direct ohmic contact between metal and silicon-substrate | 2014 | 1 |
| 16 | Design of compact and low-EMI waveguide structures based on through glass vias | 2014 | 2 |
| 17 | Radio channel modeling and measurement of a localization rescue system | 2013 | 3 |
| 18 | 2013 | 18 | |
| 19 | 2012 | 28 | |
| 20 | Analysis of SMT decoupling capacitor placement in electronic packages using hybrid modeling method | 2009 | 2 |
About Xing‐Chang Wei
Xing‐Chang Wei is a scholar working on Aerospace Engineering, Electrical and Electronic Engineering and Electronic, Optical and Magnetic Materials, having authored 211 papers that have together received 2.9k indexed citations. Recurring topics across this work include Electromagnetic Compatibility and Measurements (104 papers), Electromagnetic Compatibility and Noise Suppression (97 papers), Advanced Antenna and Metasurface Technologies (73 papers), Microwave Engineering and Waveguides (31 papers), Microwave and Dielectric Measurement Techniques (29 papers), Antenna Design and Analysis (29 papers), 3D IC and TSV technologies (22 papers) and Metamaterials and Metasurfaces Applications (20 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (1.2k citations), Nuclear Energy and Engineering (26 citations) and Aerospace Engineering (1.4k citations). Xing‐Chang Wei has collaborated with scholars based in China, Singapore and United States. Frequent co-authors include Da Yi, Er‐Ping Li, Wenge Zheng, Bin Shen, Wentao Zhai, En‐Xiao Liu, Yufei Shu, Rui Yang, Yang Li and Lihua Zhang. Their work appears in journals such as IEEE Transactions on Electromagnetic Compatibility, IEEE Transactions on Antennas and Propagation, IEEE Transactions on Microwave Theory and Techniques, IEEE Microwave and Wireless Components Letters and IEEE Transactions on Instrumentation and Measurement.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.