Xing‐Chang Wei

3.8k total citations · 1 hit paper
211 papers, 2.9k citations indexed

About

Xing‐Chang Wei is a scholar working on Electrical and Electronic Engineering, Aerospace Engineering and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, Xing‐Chang Wei has authored 211 papers receiving a total of 2.9k indexed citations (citations by other indexed papers that have themselves been cited), including 180 papers in Electrical and Electronic Engineering, 91 papers in Aerospace Engineering and 29 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in Xing‐Chang Wei's work include Electromagnetic Compatibility and Measurements (104 papers), Electromagnetic Compatibility and Noise Suppression (97 papers) and Advanced Antenna and Metasurface Technologies (73 papers). Xing‐Chang Wei is often cited by papers focused on Electromagnetic Compatibility and Measurements (104 papers), Electromagnetic Compatibility and Noise Suppression (97 papers) and Advanced Antenna and Metasurface Technologies (73 papers). Xing‐Chang Wei collaborates with scholars based in China, Singapore and United States. Xing‐Chang Wei's co-authors include Da Yi, Er‐Ping Li, Wenge Zheng, Bin Shen, Wentao Zhai, En‐Xiao Liu, Yufei Shu, Rui Yang, Yang Li and Lihua Zhang and has published in prestigious journals such as Carbon, Optics Letters and Optics Express.

In The Last Decade

Xing‐Chang Wei

185 papers receiving 2.8k citations

Hit Papers

Microcellular graphene foam for improved broadband electr... 2016 2026 2019 2022 2016 100 200 300

Peers

Xing‐Chang Wei
B. Chambers United Kingdom
Yan Zhao China
G. Ross United States
Si‐Ping Gao Singapore
T. Lasri France
B. Chambers United Kingdom
Xing‐Chang Wei
Citations per year, relative to Xing‐Chang Wei Xing‐Chang Wei (= 1×) peers B. Chambers

Countries citing papers authored by Xing‐Chang Wei

Since Specialization
Citations

This map shows the geographic impact of Xing‐Chang Wei's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Xing‐Chang Wei with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Xing‐Chang Wei more than expected).

Fields of papers citing papers by Xing‐Chang Wei

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Xing‐Chang Wei. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Xing‐Chang Wei. The network helps show where Xing‐Chang Wei may publish in the future.

Co-authorship network of co-authors of Xing‐Chang Wei

This figure shows the co-authorship network connecting the top 25 collaborators of Xing‐Chang Wei. A scholar is included among the top collaborators of Xing‐Chang Wei based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Xing‐Chang Wei. Xing‐Chang Wei is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Pan, Biao, et al.. (2025). Non-Local Mean Denoising of Multi-Layer With Adaptive Filtering Strength Based on ASIC Implementation. IEEE Transactions on Circuits and Systems I Regular Papers. 72(12). 7848–7859.
2.
Wei, Xing‐Chang, et al.. (2024). A Slot-Type Ez Probe With a Lower Effective Center. IEEE Transactions on Electromagnetic Compatibility. 67(1). 33–41.
3.
Wei, Xing‐Chang, et al.. (2024). Electromagnetic Coupling Estimation Based on Hybrid Equivalent Dipoles and Field-Circuit Models. IEEE Transactions on Electromagnetic Compatibility. 66(5). 1577–1584.
4.
Zhou, Jun, et al.. (2024). Inception-V4 Convolutional Neural Network for Near-field to Far-field Transform. 1–8. 1 indexed citations
5.
Wei, Xing‐Chang, et al.. (2024). Phaseless Near-Field-to-Near-Field Transformation Based on Modified U-Net Neural Network. 1–3. 1 indexed citations
6.
Wei, Xing‐Chang, et al.. (2023). Prediction of Electromagnetic Leakage from Circuits inside Package. 1–3. 1 indexed citations
7.
Zhang, Ling, Da Li, Xing‐Chang Wei, et al.. (2022). A Novel Machine-Learning-Based Batch Selection Method in Sparse Near-Field Scanning. IEEE Transactions on Microwave Theory and Techniques. 70(11). 5019–5028. 12 indexed citations
8.
Wei, Xing‐Chang, et al.. (2020). An EM Imaging Method Based on Plane-Wave Spectrum and Transmission Line Model. IEEE Transactions on Microwave Theory and Techniques. 68(10). 4161–4168. 9 indexed citations
9.
Wei, Xing‐Chang, et al.. (2019). An Efficient Probe Calibration Based Near-Field-to-Near-Field Transformation for EMI Diagnosis. IEEE Transactions on Antennas and Propagation. 67(6). 4141–4147. 30 indexed citations
10.
Shu, Yufei, Xing‐Chang Wei, Jun Fan, Rui Yang, & Yanbin Yang. (2019). An Equivalent Dipole Model Hybrid With Artificial Neural Network for Electromagnetic Interference Prediction. IEEE Transactions on Microwave Theory and Techniques. 67(5). 1790–1797. 65 indexed citations
11.
Yang, Rui, et al.. (2019). A Wideband and High Sensitivity Probe Design for Near-Field Scanning. European Conference on Antennas and Propagation. 1 indexed citations
12.
Yi, Da, Xing‐Chang Wei, & Yanbin Yang. (2019). A Miniaturized Stop-Band Frequency Selective Surface Based on Sub-wavelength Slow-Wave Dipole. European Conference on Antennas and Propagation. 1 indexed citations
13.
Liu, En‐Xiao, et al.. (2017). Near-field scanning and its EMC applications. 327–332. 18 indexed citations
14.
Yi, Da, et al.. (2015). Transparent microwave absorber based on single layer graphene film. 2015 Asia-Pacific Microwave Conference (APMC). 1–3. 3 indexed citations
15.
Li, Jun, et al.. (2014). Crosstalk reduction in TSV arrays with direct ohmic contact between metal and silicon-substrate. International Symposium on Electromagnetic Compatibility. 374–377. 1 indexed citations
16.
Wei, Xing‐Chang, et al.. (2014). Design of compact and low-EMI waveguide structures based on through glass vias. International Symposium on Electromagnetic Compatibility. 378–381. 2 indexed citations
17.
Wei, Xing‐Chang, et al.. (2013). Radio channel modeling and measurement of a localization rescue system. International Symposium on Antennas and Propagation. 3 indexed citations
18.
Lu, Yunlong, Gaole Dai, Xing‐Chang Wei, & Er‐Ping Li. (2013). A BROADBAND OUT-OF-PHASE POWER DIVIDER FOR HIGH POWER APPLICATIONS USING THROUGH GROUND VIA (TGV). Electromagnetic waves. 137. 653–667. 18 indexed citations
19.
Hao, Ran, Er‐Ping Li, & Xing‐Chang Wei. (2012). Two-dimensional light confinement in cross-index-modulation plasmonic waveguides. Optics Letters. 37(14). 2934–2934. 28 indexed citations
20.
Liu, En‐Xiao, et al.. (2009). Analysis of SMT decoupling capacitor placement in electronic packages using hybrid modeling method. 627–630. 2 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact

Rankless by CCL
2026