Xin Lan

499 total citations
50 papers, 362 citations indexed

About

Xin Lan is a scholar working on Mechanics of Materials, Mechanical Engineering and Civil and Structural Engineering. According to data from OpenAlex, Xin Lan has authored 50 papers receiving a total of 362 indexed citations (citations by other indexed papers that have themselves been cited), including 21 papers in Mechanics of Materials, 15 papers in Mechanical Engineering and 12 papers in Civil and Structural Engineering. Recurrent topics in Xin Lan's work include Fatigue and fracture mechanics (13 papers), Mechanical Behavior of Composites (12 papers) and Structural Load-Bearing Analysis (10 papers). Xin Lan is often cited by papers focused on Fatigue and fracture mechanics (13 papers), Mechanical Behavior of Composites (12 papers) and Structural Load-Bearing Analysis (10 papers). Xin Lan collaborates with scholars based in China, Japan and United States. Xin Lan's co-authors include N. Noda, J. M. Khodadadi, Yu Zhang, Yong Cheng, Kazuhiro ODA, Yu Zhang, Ning Zhao, Gongming Xin, Xinghua Wang and Xinyu Wang and has published in prestigious journals such as Nature Communications, The Journal of Chemical Physics and Physical Chemistry Chemical Physics.

In The Last Decade

Xin Lan

46 papers receiving 350 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Xin Lan China 13 170 157 66 51 46 50 362
Stefan Weihe Germany 14 280 1.6× 242 1.5× 92 1.4× 66 1.3× 28 0.6× 81 490
Amin Emamian Iran 14 172 1.0× 253 1.6× 66 1.0× 58 1.1× 69 1.5× 26 453
Huajie Shi China 11 191 1.1× 248 1.6× 22 0.3× 64 1.3× 28 0.6× 17 355
Hisashi Kumazawa Japan 13 183 1.1× 307 2.0× 62 0.9× 34 0.7× 26 0.6× 25 391
Scott A. Fawaz United States 9 169 1.0× 244 1.6× 74 1.1× 26 0.5× 20 0.4× 28 337
Abdelkader Slimane Algeria 10 239 1.4× 132 0.8× 46 0.7× 49 1.0× 14 0.3× 32 311
Wentao Wang China 9 229 1.3× 165 1.1× 82 1.2× 29 0.6× 15 0.3× 22 373
Kyung-Hun Lee South Korea 12 386 2.3× 267 1.7× 43 0.7× 42 0.8× 25 0.5× 40 451
Terutake Matsubara Japan 10 160 0.9× 282 1.8× 70 1.1× 18 0.4× 21 0.5× 28 393
Raghuram Karthik Desu India 9 206 1.2× 104 0.7× 53 0.8× 37 0.7× 107 2.3× 15 374

Countries citing papers authored by Xin Lan

Since Specialization
Citations

This map shows the geographic impact of Xin Lan's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Xin Lan with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Xin Lan more than expected).

Fields of papers citing papers by Xin Lan

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Xin Lan. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Xin Lan. The network helps show where Xin Lan may publish in the future.

Co-authorship network of co-authors of Xin Lan

This figure shows the co-authorship network connecting the top 25 collaborators of Xin Lan. A scholar is included among the top collaborators of Xin Lan based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Xin Lan. Xin Lan is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Zhang, Guangzheng, Dong Shi-lin, Xin Qian, et al.. (2025). Transistor-level thermal management in wide and ultra-wide bandgap power semiconductor transistors: A review. International Journal of Thermal Sciences. 219. 110200–110200. 1 indexed citations
3.
Wang, Hui, et al.. (2025). Reconfigurable metamaterial honeycomb sandwich panels based on embedded tube Helmholtz resonators. Composite Structures. 368. 119290–119290. 1 indexed citations
4.
5.
Chen, Yifeng, et al.. (2025). Failure evolution analysis of SiC power modules in electric-thermal-mechanical multi-physical fields. Microelectronics Reliability. 169. 115751–115751. 2 indexed citations
6.
Lan, Xin, Lin Geng, Zhen Zhang, et al.. (2025). Tunable synthesis of atomic one-dimensional VxTey magnets within single-walled carbon nanotubes. Nature Communications. 16(1). 6300–6300.
7.
Cao, Jie, et al.. (2024). Reliability and thermal fatigue life prediction of solder joints using nanoindentation. Materials Today Communications. 39. 109240–109240. 4 indexed citations
8.
Lan, Xin & Ning Zhao. (2024). Development of a steady state electrothermal cosimulation model of SiC power modules. International Journal of Heat and Mass Transfer. 226. 125460–125460. 5 indexed citations
9.
Lan, Xin, et al.. (2024). Numerical study of variable density and height flow guided pin fin in an open microchannel heat sink. International Journal of Heat and Mass Transfer. 225. 125405–125405. 14 indexed citations
10.
Li, J, et al.. (2024). Short-Peptide-Modified Copper Nanoclusters as a Fluorescent Probe for the Specific Detection of Ascorbic Acid. Sensors. 24(21). 6974–6974. 1 indexed citations
11.
Shi-lin, Dong, et al.. (2024). Machine learning-assisted investigation on the thermal transport of β-Ga2O3 with vacancy. The Journal of Chemical Physics. 161(21). 1 indexed citations
12.
Pan, Jie, et al.. (2024). Research on the influence of concrete damage in wharf structures under fatigue loads on chloride ion diffusion. Results in Engineering. 25. 103754–103754. 1 indexed citations
13.
Lan, Xin, et al.. (2024). Fabrication and enhanced thermal performance of a self-rewetting wick of silicon-based loop heat pipe. International Communications in Heat and Mass Transfer. 160. 108378–108378. 1 indexed citations
14.
Lan, Xin, et al.. (2023). Temperature uniformity analysis and multi-objective optimization of a small-scale variable density alternating obliquely truncated microchannel. Thermal Science and Engineering Progress. 38. 101652–101652. 10 indexed citations
15.
Shi-lin, Dong, Bowen Yang, Qian Xin, et al.. (2022). Interfacial thermal transport of graphene/β-Ga2O3 heterojunctions: a molecular dynamics study with a self-consistent interatomic potential. Physical Chemistry Chemical Physics. 24(21). 12837–12848. 7 indexed citations
16.
Shu, Minglei, et al.. (2020). Improvement of vehicle axle load test method based on portable WIM. Measurement. 173. 108626–108626. 12 indexed citations
17.
Noda, N., Fei Ren, Yoshikazu Sano, et al.. (2020). Variation of intensity of singular stress field (ISSF) along the interface outer edge of prismatic butt joint and debonding condition expressed by the ISSF. International Journal of Adhesion and Adhesives. 102. 102665–102665. 4 indexed citations
18.
Noda, N. & Xin Lan. (2012). Stress intensity factors for an edge interface crack in a bonded semi-infinite plate for arbitrary material combination. International Journal of Solids and Structures. 49(10). 1241–1251. 25 indexed citations
19.
Zhang, Yu, et al.. (2012). Variation of stress intensity factors for several interface crack problems under arbitrary material combinations. Science China Physics Mechanics and Astronomy. 55(11). 2128–2134. 1 indexed citations
20.
Zhang, Yu, et al.. (2011). Effect of Adhesive Thickness on the Interface of Singular Stress at the Adhesive Dissimilar Joint. TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A. 77(774). 360–372. 7 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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