William L. Benard

498 total citations
8 papers, 375 citations indexed

About

William L. Benard is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Atomic and Molecular Physics, and Optics. According to data from OpenAlex, William L. Benard has authored 8 papers receiving a total of 375 indexed citations (citations by other indexed papers that have themselves been cited), including 5 papers in Electrical and Electronic Engineering, 4 papers in Biomedical Engineering and 3 papers in Atomic and Molecular Physics, and Optics. Recurrent topics in William L. Benard's work include Shape Memory Alloy Transformations (3 papers), Advanced MEMS and NEMS Technologies (2 papers) and 3D IC and TSV technologies (2 papers). William L. Benard is often cited by papers focused on Shape Memory Alloy Transformations (3 papers), Advanced MEMS and NEMS Technologies (2 papers) and 3D IC and TSV technologies (2 papers). William L. Benard collaborates with scholars based in United States. William L. Benard's co-authors include Michael Huff, H. Kahn, A. H. Heuer, Steven J. Eppell, Roger Marchant, Ping Xue, David L. Wilson, Christopher Meyer, Lauren Boteler and S. F. Cheng and has published in prestigious journals such as Journal of Microelectromechanical Systems, ECS Transactions and Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena.

In The Last Decade

William L. Benard

8 papers receiving 351 citations

Peers

William L. Benard

BE

MC

EEE

ME

MM

Langquan Shui China

Bernhard Winzek Germany

Shoji Okamoto Japan

Onnik Yaglioglu United States

Raynald Séveno France

J. Busch United States

Weikun Zhu United States

Laurent Hirsinger France

R. Linderman United States

Glenn J. T. Leighton United Kingdom

Langquan Shui China

William L. Benard

213 ×1.1

BE

121 ×0.7

MC

101 ×0.9

EEE

122 ×1.6

ME

70 ×1.1

MM

Citations per year, relative to William L. Benard William L. Benard (= 1×) peers Langquan Shui

Countries citing papers authored by William L. Benard

Since Specialization

Citations

This map shows the geographic impact of William L. Benard's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by William L. Benard with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites William L. Benard more than expected).

Fields of papers citing papers by William L. Benard

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by William L. Benard. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by William L. Benard. The network helps show where William L. Benard may publish in the future.

Co-authorship network of co-authors of William L. Benard

This figure shows the co-authorship network connecting the top 25 collaborators of William L. Benard. A scholar is included among the top collaborators of William L. Benard based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with William L. Benard. William L. Benard is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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8 of 8 papers shown

1.

Meyer, Christopher, et al.. (2012). Heterogeneous Chip Integration into Silicon Templates by Through-Wafer Copper Electroplating. ECS Meeting Abstracts. MA2012-01(20). 874–874. 1 indexed citations

2.

Meyer, Christopher, et al.. (2012). Heterogeneous Chip Integration into Silicon Templates by Through-Wafer Copper Electroplating. ECS Transactions. 45(6). 163–169. 2 indexed citations

3.

Edelstein, A. S., et al.. (2006). THE MEMS FLUX CONCENTRATOR: POTENTIAL LOW-COST, HIGHSENSITIVITYMAGNETOMETER. Insecta mundi. 1 indexed citations

4.

Benard, William L., H. Kahn, A. H. Heuer, & Michael Huff. (2002). A titanium-nickel shape-memory alloy actuated micropump. 1. 361–364. 28 indexed citations

5.

Benard, William L., H. Kahn, A. H. Heuer, & Michael Huff. (1998). Thin-film shape-memory alloy actuated micropumps. Journal of Microelectromechanical Systems. 7(2). 245–251. 298 indexed citations

6.

Benard, William L., H. Kahn, & Michael Huff. (1997). <title>TiNi shape-memory alloy actuated micropump with fluid isolation</title>. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 3046. 156–164. 3 indexed citations

7.

Kahn, H., William L. Benard, Michael Huff, & A. H. Heuer. (1996). Titanium-Nickel Shape Memory Thin Film Actuators for Micromachined Valves. MRS Proceedings. 444. 14 indexed citations

8.

Wilson, David L., et al.. (1996). Morphological modeling of atomic force microscopy imaging including nanostructure probes and fibrinogen molecules. Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena. 14(4). 2407–2416. 28 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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