Wen‐Zhen Wang
Impact in
- Mechanical Engineering top 2%
- Advanced materials and composites
- Intermetallics and Advanced Alloy Properties
- High Entropy Alloys Studies
- Aluminum Alloys Composites Properties
- Mechanics of Materials top 2%
- Metal and Thin Film Mechanics
- Tribology and Wear Analysis
Papers in
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- Metal and Thin Film Mechanics 27
- Tribology and Wear Analysis 15
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- Advanced materials and composites 37
- Aluminum Alloys Composites Properties 11
- Intermetallics and Advanced Alloy Properties 9
Wen‐Zhen Wang
81 papers receiving 1.8k citations
Peers
Comparison fields: 5 of 78
- Mechanical Engineering 1.1k
- Mechanics of Materials 645
- Ceramics and Composites 131
- Aerospace Engineering 429
- Materials Chemistry 688
Countries citing papers authored by Wen‐Zhen Wang
This map shows the geographic impact of Wen‐Zhen Wang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Wen‐Zhen Wang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Wen‐Zhen Wang more than expected).
Fields of papers citing papers by Wen‐Zhen Wang
This network shows the impact of papers produced by Wen‐Zhen Wang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Wen‐Zhen Wang. The network helps show where Wen‐Zhen Wang may publish in the future.
Co-authors
The 25 scholars most cited alongside Wen‐Zhen Wang, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2025 | 0 | |
| 2 | 2025 | 2 | |
| 3 | 2025 | 0 | |
| 4 | 2025 | 0 | |
| 5 | 2025 | 0 | |
| 6 | 2024 | 2 | |
| 7 | 2024 | 2 | |
| 8 | 2024 | 12 | |
| 9 | 2023 | 17 | |
| 10 | 2023 | 9 | |
| 11 | 2023 | 9 | |
| 12 | 2021 | 9 | |
| 13 | 2019 | 27 | |
| 14 | 2017 | 64 | |
| 15 | 2017 | 8 | |
| 16 | 2017 | 13 | |
| 17 | 2012 | 92 | |
| 18 | 2011 | 134 | |
| 19 | 2008 | 18 | |
| 20 | 2005 | 35 |
About Wen‐Zhen Wang
Wen‐Zhen Wang is a scholar working on Mechanics of Materials, Mechanical Engineering, Ceramics and Composites, Materials Chemistry and Electronic, Optical and Magnetic Materials, having authored 85 papers that have together received 1.8k indexed citations. Recurring topics across this work include Advanced materials and composites (37 papers), Metal and Thin Film Mechanics (27 papers), Tribology and Wear Analysis (15 papers), High-Temperature Coating Behaviors (14 papers), Aluminum Alloys Composites Properties (11 papers), Magnetism in coordination complexes (11 papers), Intermetallics and Advanced Alloy Properties (9 papers) and Metal complexes synthesis and properties (8 papers). The work is most often cited by research in Mechanical Engineering (1.1k citations), Mechanics of Materials (645 citations), Ceramics and Composites (131 citations), Aerospace Engineering (429 citations) and Materials Chemistry (688 citations). Wen‐Zhen Wang has collaborated with scholars based in China, Taiwan and United States. Frequent co-authors include Junhong Jia, Gewen Yi, Eryong Liu, Minmin Han, Yimin Gao, Yu Shan, Bo Li, Hongjian Guo, Yimin Gao and Junhong Jia. Their work appears in journals such as Tribology International, Ceramics International, Journal of Alloys and Compounds, Wear and Surface and Coatings Technology.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.