Wei‐Ping Dow

3.8k total citations
68 papers, 3.3k citations indexed

About

Wei‐Ping Dow is a scholar working on Electrical and Electronic Engineering, Materials Chemistry and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, Wei‐Ping Dow has authored 68 papers receiving a total of 3.3k indexed citations (citations by other indexed papers that have themselves been cited), including 54 papers in Electrical and Electronic Engineering, 28 papers in Materials Chemistry and 19 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in Wei‐Ping Dow's work include Electrodeposition and Electroless Coatings (44 papers), Electronic Packaging and Soldering Technologies (34 papers) and Copper Interconnects and Reliability (19 papers). Wei‐Ping Dow is often cited by papers focused on Electrodeposition and Electroless Coatings (44 papers), Electronic Packaging and Soldering Technologies (34 papers) and Copper Interconnects and Reliability (19 papers). Wei‐Ping Dow collaborates with scholars based in Taiwan, United States and Japan. Wei‐Ping Dow's co-authors include Ta-Jen Huang, Ming-Yao Yen, Chengwei Liu, Hsiao‐Chun Huang, Sumei Huang, Chen‐Chia Huang, Chih‐Ming Chen, Hsuan Lee, Jenshi B. Wang and Jing‐Yuan Lin and has published in prestigious journals such as Journal of The Electrochemical Society, Langmuir and Chemical Communications.

In The Last Decade

Wei‐Ping Dow

65 papers receiving 3.2k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Wei‐Ping Dow Taiwan 32 2.3k 1.9k 693 654 392 68 3.3k
Adriana Ispas Germany 25 911 0.4× 697 0.4× 212 0.3× 396 0.6× 333 0.8× 86 1.6k
Cuijuan Zhang China 37 3.1k 1.3× 1.5k 0.8× 761 1.1× 334 0.5× 120 0.3× 116 4.2k
Rohan Akolkar United States 23 1.9k 0.8× 541 0.3× 454 0.7× 169 0.3× 313 0.8× 92 2.2k
Jin Xiao China 31 3.0k 1.3× 1.7k 0.9× 700 1.0× 98 0.1× 112 0.3× 85 4.0k
Zen‐ichiro Takehara Japan 32 3.1k 1.3× 622 0.3× 343 0.5× 155 0.2× 283 0.7× 138 3.7k
Elena Markevich Israel 36 6.3k 2.7× 635 0.3× 1.1k 1.6× 415 0.6× 122 0.3× 68 6.7k
A. Visintin Argentina 25 830 0.4× 852 0.5× 312 0.5× 221 0.3× 217 0.6× 90 1.6k
Jeong Ho Ryu South Korea 34 1.5k 0.7× 2.2k 1.2× 307 0.4× 195 0.3× 100 0.3× 135 2.9k
Takayuki Doi Japan 37 4.2k 1.8× 808 0.4× 871 1.3× 122 0.2× 95 0.2× 150 4.5k

Countries citing papers authored by Wei‐Ping Dow

Since Specialization
Citations

This map shows the geographic impact of Wei‐Ping Dow's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Wei‐Ping Dow with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Wei‐Ping Dow more than expected).

Fields of papers citing papers by Wei‐Ping Dow

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Wei‐Ping Dow. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Wei‐Ping Dow. The network helps show where Wei‐Ping Dow may publish in the future.

Co-authorship network of co-authors of Wei‐Ping Dow

This figure shows the co-authorship network connecting the top 25 collaborators of Wei‐Ping Dow. A scholar is included among the top collaborators of Wei‐Ping Dow based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Wei‐Ping Dow. Wei‐Ping Dow is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Dow, Wei‐Ping, et al.. (2019). Polyimide Metallization Using Nickel Nano-Film as both Catalyst and Barrier Layer of Copper Electroless Deposition. Journal of The Electrochemical Society. 166(15). D843–D850. 9 indexed citations
2.
Lee, Hsuan, et al.. (2017). Impurity Incorporation in the Cu Electrodeposit and Its Effects on the Microstructural Evolution of the Sn/Cu Solder Joints. Journal of The Electrochemical Society. 164(7). D457–D462. 26 indexed citations
3.
Dow, Wei‐Ping, et al.. (2017). Direct Copper Pattern Plating on Glass and Ceramic Substrates Using an Al-Doped ZnO as an Adhesive and Conducting Layer. Journal of The Electrochemical Society. 164(12). D687–D693. 13 indexed citations
4.
Chang, Hou-Chien, et al.. (2017). Effects of Additives and Convection on Cu Foil Fabrication with a Low Surface Roughness. Journal of The Electrochemical Society. 164(9). D660–D665. 25 indexed citations
5.
Dow, Wei‐Ping, et al.. (2016). Effects of Brighteners in a Copper Plating Bath on Throwing Power and Thermal Reliability of Plated Through Holes. Electrochimica Acta. 212. 572–582. 44 indexed citations
6.
Dow, Wei‐Ping, et al.. (2015). Optimization of the Copper Plating Process Using the Taguchi Experimental Design Method. Journal of The Electrochemical Society. 162(10). D525–D530. 19 indexed citations
7.
Lin, Ying‐Chen, et al.. (2015). Microvia Filling with Nickel-Tungsten Alloy to Decrease the Coefficient of Thermal Expansion of Electronic Circuit Interconnections. ECS Electrochemistry Letters. 4(9). D25–D27. 8 indexed citations
8.
Dow, Wei‐Ping, et al.. (2013). Silver Metallization of Polyimide Surfaces Using Environmentally Friendly Reducing Agents. ECS Electrochemistry Letters. 2(11). D45–D48. 14 indexed citations
9.
Dow, Wei‐Ping, et al.. (2013). Use of 3,3-Thiobis(1-propanesulfonate) to Accelerate Microvia Filling by Copper Electroplating. Journal of The Electrochemical Society. 160(12). D3271–D3277. 12 indexed citations
10.
Dow, Wei‐Ping, et al.. (2011). The effect of acid on fast through-hole filling by Cu electroplating. 153. 485–487.
11.
12.
Yau, Shuehlin, et al.. (2009). Revelation of the spatial structures and polymerization of aniline on Au(100) electrode by in situ scanning tunnelling microscopy. Chemical Communications. 5737–5737. 9 indexed citations
13.
Dow, Wei‐Ping, et al.. (2009). Novel Cu plating formula for filling through silicon vias. 17. 186–189. 14 indexed citations
14.
Dow, Wei‐Ping, et al.. (2009). Copper Fill of Microvia Using a Thiol-Modified Cu Seed Layer and Various Levelers. Journal of The Electrochemical Society. 156(8). D314–D314. 96 indexed citations
15.
Dow, Wei‐Ping, et al.. (2009). Microvia Filling by Cu Electroplating Over a Au Seed Layer Modified by a Disulfide. Journal of The Electrochemical Society. 156(4). D155–D155. 79 indexed citations
16.
Dow, Wei‐Ping, et al.. (2008). Through-Hole Filling by Copper Electroplating. Journal of The Electrochemical Society. 155(12). D750–D750. 92 indexed citations
17.
Dow, Wei‐Ping, et al.. (2005). Roles of Chloride Ion in Microvia Filling by Copper Electrodeposition. Journal of The Electrochemical Society. 152(2). C77–C77. 117 indexed citations
18.
Dow, Wei‐Ping, et al.. (2005). Roles of Chloride Ion in Microvia Filling by Copper Electrodeposition. Journal of The Electrochemical Society. 152(2). C67–C67. 130 indexed citations
19.
Dow, Wei‐Ping, et al.. (2003). Interactions Between Brightener and Chloride Ions on Copper Electroplating for Laser-Drilled Via-Hole Filling. Electrochemical and Solid-State Letters. 6(9). C134–C134. 97 indexed citations
20.
Dow, Wei‐Ping & Ta-Jen Huang. (1996). Effect of chlorine on TPR and TPO behavior of an YSZ/γ-Al2O3 supported copper oxide catalyst. Applied Catalysis A General. 141(1-2). 17–29. 29 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact

Breakdown of academic impact, for papers by Adriana Ispas Breakdown of academic impact, for papers by Cuijuan Zhang Breakdown of academic impact, for papers by Rohan Akolkar Breakdown of academic impact, for papers by Jin Xiao Breakdown of academic impact, for papers by Zen‐ichiro Takehara Breakdown of academic impact, for papers by Elena Markevich Breakdown of academic impact, for papers by A. Visintin Breakdown of academic impact, for papers by Jeong Ho Ryu Breakdown of academic impact, for papers by Takayuki Doi
Rankless by CCL
2026