Hsiao‐Chun Huang

543 total citations
14 papers, 429 citations indexed

About

Hsiao‐Chun Huang is a scholar working on Electrical and Electronic Engineering, Molecular Biology and Cell Biology. According to data from OpenAlex, Hsiao‐Chun Huang has authored 14 papers receiving a total of 429 indexed citations (citations by other indexed papers that have themselves been cited), including 6 papers in Electrical and Electronic Engineering, 4 papers in Molecular Biology and 3 papers in Cell Biology. Recurrent topics in Hsiao‐Chun Huang's work include Electronic Packaging and Soldering Technologies (6 papers), 3D IC and TSV technologies (4 papers) and Microtubule and mitosis dynamics (3 papers). Hsiao‐Chun Huang is often cited by papers focused on Electronic Packaging and Soldering Technologies (6 papers), 3D IC and TSV technologies (4 papers) and Microtubule and mitosis dynamics (3 papers). Hsiao‐Chun Huang collaborates with scholars based in Taiwan and United States. Hsiao‐Chun Huang's co-authors include Ming-Yao Yen, Wei‐Ping Dow, Tzu-Chiao Hung, Chun-Eng Liu, Yi-Chen Huang, Ching-Fang Chang, Tsung‐Shing Andrew Wang, Pan‐Chyr Yang, Frank Leigh Lu and Kuo-Hsuan Hung and has published in prestigious journals such as Nature Communications, Journal of The Electrochemical Society and Scientific Reports.

In The Last Decade

Hsiao‐Chun Huang

14 papers receiving 401 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
Hsiao‐Chun Huang Taiwan	8	322	151	97	62	47	14	429
Chunyan Xing China	9	95 0.3×	139 0.9×	51 0.5×	66 1.1×	22 0.5×	18	339
Emmanuelle Pichonat France	8	156 0.5×	155 1.0×	42 0.4×	127 2.0×	18 0.4×	9	332
Chia-Wei Chen Taiwan	13	268 0.8×	205 1.4×	38 0.4×	63 1.0×	23 0.5×	20	580
Qianqian Duan China	12	204 0.6×	186 1.2×	29 0.3×	81 1.3×	19 0.4×	26	426
Zan Feng China	9	140 0.4×	230 1.5×	121 1.2×	131 2.1×	13 0.3×	18	443
R. Haarindraprasad Malaysia	10	155 0.5×	126 0.8×	25 0.3×	174 2.8×	46 1.0×	12	360
Thomas M. Heim France	12	172 0.5×	49 0.3×	39 0.4×	166 2.7×	14 0.3×	27	497
Haena Yim South Korea	13	182 0.6×	124 0.8×	47 0.5×	49 0.8×	3 0.1×	42	387
Jae-Hun Chung South Korea	7	298 0.9×	195 1.3×	83 0.9×	45 0.7×	8 0.2×	8	492
Sunghwan Hong South Korea	10	69 0.2×	76 0.5×	63 0.6×	70 1.1×	10 0.2×	16	316

Countries citing papers authored by Hsiao‐Chun Huang

Since Specialization

Citations

This map shows the geographic impact of Hsiao‐Chun Huang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Hsiao‐Chun Huang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Hsiao‐Chun Huang more than expected).

Fields of papers citing papers by Hsiao‐Chun Huang

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Hsiao‐Chun Huang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Hsiao‐Chun Huang. The network helps show where Hsiao‐Chun Huang may publish in the future.

Co-authorship network of co-authors of Hsiao‐Chun Huang

This figure shows the co-authorship network connecting the top 25 collaborators of Hsiao‐Chun Huang. A scholar is included among the top collaborators of Hsiao‐Chun Huang based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Hsiao‐Chun Huang. Hsiao‐Chun Huang is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

Sort: Min cites: Since: Top N: Style:

14 of 14 papers shown

Lin, Dawei, Jye‐Chian Hsiao, Tzu-Chiao Hung, et al.. (2021). Construction of intracellular asymmetry and asymmetric division in Escherichia coli. Nature Communications. 12(1). 888–888. 14 indexed citations

Lin, Dawei, et al.. (2021). Localized Proteolysis for the Construction of Intracellular Asymmetry in Escherichia coli. ACS Synthetic Biology. 10(8). 1830–1836. 5 indexed citations

Hsiao, Michael, et al.. (2020). Selection of a malignant subpopulation from a colorectal cancer cell line. Oncology Letters. 20(3). 2937–2945. 1 indexed citations

Nam, Sungmin, et al.. (2019). The evolution of spindles and their mechanical implications for cancer metastasis. Cell Cycle. 18(15). 1671–1675. 7 indexed citations

Chen, Shang‐Fu, Kuo-Hsuan Hung, Ching-Fang Chang, et al.. (2017). Efficient Generation of Chemically Induced Mesenchymal Stem Cells from Human Dermal Fibroblasts. Scientific Reports. 7(1). 44534–44534. 24 indexed citations

Hung, Tzu-Chiao, et al.. (2017). Selective Targeting of Vibrios by Fluorescent Siderophore-Based Probes. ACS Chemical Biology. 12(11). 2720–2724. 17 indexed citations

Chen, Wei‐An, et al.. (2016). Kinesin-5 Contributes to Spindle-length Scaling in the Evolution of Cancer toward Metastasis. Scientific Reports. 6(1). 35767–35767. 15 indexed citations

Liu, Cheng-Hsiang, et al.. (2016). Wafer Warpage Characterization of Multi-layer Structure Composed of Diverse Passivation Layers and Re-Distribution Layers for Cost-Effective 2.5D IC Packaging Alternatives. 524–530. 2 indexed citations

Chao, Chun‐Chieh, et al.. (2014). Study of TSV thinning wafer strength enhancement for 3DIC package. 868–872. 2 indexed citations

10.

Huang, Hsiao‐Chun, et al.. (2014). Development and characterization of new generation panel fan-out (P-FO) packaging technology. 947–951. 33 indexed citations

11.

Liu, Cheng-Hsiang, et al.. (2013). Adaptable and integrated packaging platform for MEMS-based combo sensors utilizing innovative wafer-level packaging technologies. 5 indexed citations

12.

Liu, Chun-Eng, et al.. (2012). Decreasing catheter-related bloodstream infections in the intensive care unit: Interventions in a medical center in central Taiwan. Journal of Microbiology Immunology and Infection. 45(5). 370–376. 14 indexed citations

13.

Dow, Wei‐Ping, et al.. (2008). Filling mechanism in microvia metallization by copper electroplating. Electrochimica Acta. 53(28). 8228–8237. 112 indexed citations

14.

Dow, Wei‐Ping, et al.. (2005). Influence of Convection-Dependent Adsorption of Additives on Microvia Filling by Copper Electroplating. Journal of The Electrochemical Society. 152(6). C425–C425. 178 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact