W.C. Leong

498 total citations
14 papers, 395 citations indexed

About

W.C. Leong is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials and Control and Systems Engineering. According to data from OpenAlex, W.C. Leong has authored 14 papers receiving a total of 395 indexed citations (citations by other indexed papers that have themselves been cited), including 9 papers in Electrical and Electronic Engineering, 8 papers in Mechanics of Materials and 6 papers in Control and Systems Engineering. Recurrent topics in W.C. Leong's work include Electronic Packaging and Soldering Technologies (8 papers), Material Properties and Processing (8 papers) and Vibration and Dynamic Analysis (6 papers). W.C. Leong is often cited by papers focused on Electronic Packaging and Soldering Technologies (8 papers), Material Properties and Processing (8 papers) and Vibration and Dynamic Analysis (6 papers). W.C. Leong collaborates with scholars based in Malaysia and India. W.C. Leong's co-authors include M.Z. Abdullah, C. Y. Khor, Zainal Ahmad, Dadan Ramdan, Zulkifli Mohamad Ariff, Chun‐Sean Lau, Mohd Sharizal Abdul Aziz, M. Abdul Mujeebu and R. Chan and has published in prestigious journals such as Journal of environmental chemical engineering, International Communications in Heat and Mass Transfer and Microelectronics Reliability.

In The Last Decade

W.C. Leong

14 papers receiving 391 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
W.C. Leong Malaysia	10	186	119	101	87	77	14	395
Jesús Casanova Kindelán Spain	13	76 0.4×	62 0.5×	15 0.1×	144 1.7×	82 1.1×	24	593
Rishi Relan Denmark	8	249 1.3×	36 0.3×	20 0.2×	23 0.3×	47 0.6×	31	441
G. Liao China	12	67 0.4×	24 0.2×	60 0.6×	6 0.1×	23 0.3×	23	552
Mohammad Farshchi Iran	14	131 0.7×	34 0.3×	61 0.6×	17 0.2×	39 0.5×	54	558
Hwataik Han South Korea	13	99 0.5×	160 1.3×	7 0.1×	46 0.5×	292 3.8×	40	712
Jinxi Wang China	14	45 0.2×	13 0.1×	126 1.2×	28 0.3×	147 1.9×	40	474
Zeyu Zhang China	7	36 0.2×	64 0.5×	51 0.5×	12 0.1×	62 0.8×	15	309
Mohammadreza Baghoolizadeh Iran	16	73 0.4×	199 1.7×	15 0.1×	14 0.2×	215 2.8×	37	675
Maria del Rosario Heras Celemín Spain	22	61 0.3×	494 4.2×	34 0.3×	23 0.3×	477 6.2×	43	1.1k
C. Tricarico Italy	13	272 1.5×	49 0.4×	55 0.5×	23 0.3×	242 3.1×	26	515

Countries citing papers authored by W.C. Leong

Since Specialization

Citations

This map shows the geographic impact of W.C. Leong's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by W.C. Leong with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites W.C. Leong more than expected).

Fields of papers citing papers by W.C. Leong

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by W.C. Leong. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by W.C. Leong. The network helps show where W.C. Leong may publish in the future.

Co-authorship network of co-authors of W.C. Leong

This figure shows the co-authorship network connecting the top 25 collaborators of W.C. Leong. A scholar is included among the top collaborators of W.C. Leong based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with W.C. Leong. W.C. Leong is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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14 of 14 papers shown

Leong, W.C., et al.. (2019). Prediction of air pollution index (API) using support vector machine (SVM). Journal of environmental chemical engineering. 8(3). 103208–103208. 155 indexed citations

Khor, C. Y., M.Z. Abdullah, Chun‐Sean Lau, W.C. Leong, & Mohd Sharizal Abdul Aziz. (2014). Influence of solder bump arrangements on molded IC encapsulation. Microelectronics Reliability. 54(4). 796–807. 28 indexed citations

Leong, W.C., et al.. (2013). FSI STUDY OF THE EFFECT OF AIR INLET/OUTLET ARRANGEMENTS ON THE RELIABILITY AND COOLING PERFORMANCES OF FLEXIBLE PRINTED CIRCUIT BOARD ELECTRONICS. DergiPark (Istanbul University). 3 indexed citations

Leong, W.C., M.Z. Abdullah, & C. Y. Khor. (2013). Optimization of flexible printed circuit board electronics in the flow environment using response surface methodology. Microelectronics Reliability. 53(12). 1996–2004. 21 indexed citations

Abdullah, M.Z., et al.. (2013). Numerical Modeling and Analysis of Microbump Pitch Effect in 3D IC Package with TSV During Molded Underfill (MUF). Engineering Applications of Computational Fluid Mechanics. 7(2). 210–222. 9 indexed citations

Leong, W.C., M.Z. Abdullah, C. Y. Khor, & Dadan Ramdan. (2013). Study on the fluid‐structure interaction of flexible printed circuit board motherboard in personal computer casings. Microelectronics International. 30(3). 138–150. 7 indexed citations

Leong, W.C., et al.. (2012). Study on the Fluid–Structure Interaction of Flexible Printed Circuit Board Electronics in the Flow Environment. IEEE Transactions on Components Packaging and Manufacturing Technology. 2(8). 1335–1345. 11 indexed citations

Ramdan, Dadan, et al.. (2012). Fluid/Structure Interaction Investigation in PBGA Packaging. IEEE Transactions on Components Packaging and Manufacturing Technology. 2(11). 1786–1795. 24 indexed citations

Khor, C. Y., M.Z. Abdullah, Zulkifli Mohamad Ariff, & W.C. Leong. (2012). Effect of stacking chips and inlet positions on void formation in the encapsulation of 3D stacked flip-chip package. International Communications in Heat and Mass Transfer. 39(5). 670–680. 31 indexed citations

10.

Khor, C. Y., M.Z. Abdullah, & W.C. Leong. (2012). Visualization of Fluid/Structure Interaction in IC Encapsulation. IEEE Transactions on Components Packaging and Manufacturing Technology. 2(8). 1239–1246. 5 indexed citations

11.

Leong, W.C., M.Z. Abdullah, & M. Abdul Mujeebu. (2011). Flow Induced Deflection and Stress on Flexible Printed Circuit Board in Fan-Cooled Electronic Systems: FSI Approach. IEEE Transactions on Components Packaging and Manufacturing Technology. 2(4). 617–624. 7 indexed citations

12.

Leong, W.C., M.Z. Abdullah, & C. Y. Khor. (2011). Application of flexible printed circuit board (FPCB) in personal computer motherboards: Focusing on mechanical performance. Microelectronics Reliability. 52(4). 744–756. 30 indexed citations

13.

Khor, C. Y., M.Z. Abdullah, & W.C. Leong. (2011). Fluid/Structure Interaction Analysis of the Effects of Solder Bump Shapes and Input/Output Counts on Moulded Packaging. IEEE Transactions on Components Packaging and Manufacturing Technology. 2(4). 604–616. 32 indexed citations

14.

Khor, C. Y., et al.. (2011). Investigation of the fluid/structure interaction phenomenon in IC packaging. Microelectronics Reliability. 52(1). 241–252. 32 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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