Chun‐Sean Lau

1.1k total citations
16 papers, 232 citations indexed

About

Chun‐Sean Lau is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials and Mechanical Engineering. According to data from OpenAlex, Chun‐Sean Lau has authored 16 papers receiving a total of 232 indexed citations (citations by other indexed papers that have themselves been cited), including 15 papers in Electrical and Electronic Engineering, 6 papers in Mechanics of Materials and 4 papers in Mechanical Engineering. Recurrent topics in Chun‐Sean Lau's work include Electronic Packaging and Soldering Technologies (15 papers), 3D IC and TSV technologies (12 papers) and Adhesion, Friction, and Surface Interactions (3 papers). Chun‐Sean Lau is often cited by papers focused on Electronic Packaging and Soldering Technologies (15 papers), 3D IC and TSV technologies (12 papers) and Adhesion, Friction, and Surface Interactions (3 papers). Chun‐Sean Lau collaborates with scholars based in Malaysia and United States. Chun‐Sean Lau's co-authors include M.Z. Abdullah, Fakhrozi Che Ani, C. Y. Khor, W.C. Leong, Mohd Sharizal Abdul Aziz, Ishak Abdul Azid, M. Abdul Mujeebu, Ning Ye, Bo Yang and Wei Tan and has published in prestigious journals such as SHILAP Revista de lepidopterología, Microelectronics Reliability and IEEE Transactions on Components Packaging and Manufacturing Technology.

In The Last Decade

Chun‐Sean Lau

15 papers receiving 224 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
Chun‐Sean Lau Malaysia	9	184	101	69	27	23	16	232
Joon Sik Son South Korea	7	39 0.2×	292 2.9×	54 0.8×	20 0.7×	20 0.9×	11	348
Kyu‐Seob Kim South Korea	9	272 1.5×	147 1.5×	32 0.5×	5 0.2×	123 5.3×	25	337
Dong-Cheol Kim South Korea	11	46 0.3×	355 3.5×	68 1.0×	25 0.9×	9 0.4×	42	407
É. Ya. Rapoport Russia	9	29 0.2×	206 2.0×	23 0.3×	55 2.0×	40 1.7×	33	286
Runqiong Wang China	9	96 0.5×	288 2.9×	104 1.5×	16 0.6×	27 1.2×	14	331
Erlong Li China	10	31 0.2×	148 1.5×	80 1.2×	29 1.1×	7 0.3×	26	234
Abderrazak El Ouafi Canada	10	39 0.2×	310 3.1×	50 0.7×	77 2.9×	7 0.3×	61	337
H. Kapeller Austria	8	236 1.3×	166 1.6×	18 0.3×	7 0.3×	184 8.0×	22	346
Xingyu Yang China	11	43 0.2×	175 1.7×	39 0.6×	8 0.3×	70 3.0×	27	274
R. Dekker Netherlands	8	299 1.6×	29 0.3×	55 0.8×	13 0.5×	29 1.3×	17	407

Countries citing papers authored by Chun‐Sean Lau

Since Specialization

Citations

This map shows the geographic impact of Chun‐Sean Lau's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Chun‐Sean Lau with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Chun‐Sean Lau more than expected).

Fields of papers citing papers by Chun‐Sean Lau

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Chun‐Sean Lau. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Chun‐Sean Lau. The network helps show where Chun‐Sean Lau may publish in the future.

Co-authorship network of co-authors of Chun‐Sean Lau

This figure shows the co-authorship network connecting the top 25 collaborators of Chun‐Sean Lau. A scholar is included among the top collaborators of Chun‐Sean Lau based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Chun‐Sean Lau. Chun‐Sean Lau is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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16 of 16 papers shown

Lau, Chun‐Sean, et al.. (2021). Board-Level Reliability Performance of Enterprise and Datacenter SSD Form Factor (EDSFF). 1346–1352. 2 indexed citations

Lau, Chun‐Sean, et al.. (2020). A Numerical Technique to Evaluate Warpage Behavior of Double Sided Rigid-Flex Board Assemblies during Reflow Soldering Process. 554–560. 7 indexed citations

Lau, Chun‐Sean, et al.. (2018). A Response Spectrum Method and Post-layout Optimization for Mechanical Shock Analysis of 3D NAND BGA Packages. 1–4.

Khor, C. Y., et al.. (2018). Influence of surface mount solder joint height during the thermo-mechanical analysis. AIP conference proceedings. 2030. 20127–20127. 1 indexed citations

Lau, Chun‐Sean, et al.. (2014). Finite Element Analysis On The Effect Of Solder \nJoint Geometry For The Reliability Of Ball Grid Array Assembly With Flexible And Rigid PCBS \n. SHILAP Revista de lepidopterología. 10 indexed citations

Khor, C. Y., M.Z. Abdullah, Chun‐Sean Lau, & Ishak Abdul Azid. (2014). Recent fluid–structure interaction modeling challenges in IC encapsulation – A review. Microelectronics Reliability. 54(8). 1511–1526. 14 indexed citations

Khor, C. Y., M.Z. Abdullah, Chun‐Sean Lau, W.C. Leong, & Mohd Sharizal Abdul Aziz. (2014). Influence of solder bump arrangements on molded IC encapsulation. Microelectronics Reliability. 54(4). 796–807. 28 indexed citations

Lau, Chun‐Sean & M.Z. Abdullah. (2013). Simulation Investigations on Fluid/Structure Interaction in the Reflow Soldering Process of Board-Level BGA Packaging. International Journal of Computer Theory and Engineering. 645–649. 14 indexed citations

Lau, Chun‐Sean, M.Z. Abdullah, & C. Y. Khor. (2013). Optimization of the reflow soldering process with multiple quality characteristics in ball grid array packaging by using the grey‐based Taguchi method. Microelectronics International. 30(3). 151–168. 31 indexed citations

10.

Lau, Chun‐Sean, M.Z. Abdullah, & Fakhrozi Che Ani. (2012). Effect of Solder Joint Arrangements on BGA Lead-Free Reliability During Cooling Stage of Reflow Soldering Process. IEEE Transactions on Components Packaging and Manufacturing Technology. 2(12). 2098–2107. 19 indexed citations

11.

Lau, Chun‐Sean, M.Z. Abdullah, & Fakhrozi Che Ani. (2012). Optimization modeling of the cooling stage of reflow soldering process for ball grid array package using the gray-based Taguchi method. Microelectronics Reliability. 52(6). 1143–1152. 27 indexed citations

12.

Lau, Chun‐Sean, M.Z. Abdullah, & Fakhrozi Che Ani. (2012). Computational fluid dynamic and thermal analysis for BGA assembly during forced convection reflow soldering process. Soldering and Surface Mount Technology. 24(2). 77–91. 44 indexed citations

13.

Lau, Chun‐Sean, M.Z. Abdullah, & Fakhrozi Che Ani. (2012). Three‐dimensional thermal investigations at board level in a reflow oven using thermal‐coupling method. Soldering and Surface Mount Technology. 24(3). 167–182. 29 indexed citations

14.

Lau, Chun‐Sean, et al.. (2004). CBGA solder joint thermal fatigue life estimation by a simple method. Soldering and Surface Mount Technology. 16(2). 41–45. 2 indexed citations

15.

Lau, Chun‐Sean, et al.. (2003). CBGA Solder Joint Thermal Fatigue Life Estimation by a Simple Method. 417–422. 3 indexed citations

16.

Lau, Chun‐Sean, et al.. (2002). Design of Experiments in Ball Grid Array Thermal Fatigue Life Tests. 221–227. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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