Chun‐Sean Lau
- Electrical and Electronic Engineering
- Mechanical Engineering
- Mechanics of Materials
- Computational Mechanics
- Control and Systems Engineering
- Co-authors
- M.Z. AbdullahFakhrozi Che AniC. Y. KhorW.C. LeongMohd Sharizal Abdul AzizIshak Abdul AzidM. Abdul MujeebuNing Ye
- Topics
- Electronic Packaging and Soldering Technologies (15 papers)3D IC and TSV technologies (12 papers)Adhesion, Friction, and Surface Interactions (3 papers)
- Journals
- SHILAP Revista de lepidopterologíaMicroelectronics ReliabilityIEEE Transactions on Components Packaging and Manufacturing Technology
- Partner nations
- MalaysiaUnited States
In The Last Decade
Chun‐Sean Lau
15 papers receiving 224 citations
Peers
Comparison fields: 5 of 32
- Electrical and Electronic Engineering 184
- Mechanical Engineering 101
- Mechanics of Materials 69
- Computational Mechanics 27
- Control and Systems Engineering 23
Countries citing papers authored by Chun‐Sean Lau
This map shows the geographic impact of Chun‐Sean Lau's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Chun‐Sean Lau with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Chun‐Sean Lau more than expected).
Fields of papers citing papers by Chun‐Sean Lau
This network shows the impact of papers produced by Chun‐Sean Lau. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Chun‐Sean Lau. The network helps show where Chun‐Sean Lau may publish in the future.
Co-authorship network of co-authors of Chun‐Sean Lau
This figure shows the co-authorship network connecting the top 25 collaborators of Chun‐Sean Lau. A scholar is included among the top collaborators of Chun‐Sean Lau based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Chun‐Sean Lau. Chun‐Sean Lau is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 2 | |
| 2 | 7 | |
| 3 | 0 | |
| 4 | 1 | |
| 5 | Finite Element Analysis On The Effect Of Solder
\nJoint Geometry For The Reliability Of Ball Grid Array Assembly With Flexible And Rigid PCBS
\n | 10 |
| 6 | 14 | |
| 7 | 28 | |
| 8 | 14 | |
| 9 | 31 | |
| 10 | 27 | |
| 11 | 19 | |
| 12 | 44 | |
| 13 | 29 | |
| 14 | 2 | |
| 15 | 3 | |
| 16 | 1 |
About Chun‐Sean Lau
Chun‐Sean Lau is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials and Mechanical Engineering, having authored 16 papers that have together received 232 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (15 papers), 3D IC and TSV technologies (12 papers) and Adhesion, Friction, and Surface Interactions (3 papers). The work is most often cited by research in Electrical and Electronic Engineering (184 citations), Mechanics of Materials (69 citations) and Mechanical Engineering (101 citations). Chun‐Sean Lau has collaborated with scholars based in Malaysia and United States. Frequent co-authors include M.Z. Abdullah, Fakhrozi Che Ani, C. Y. Khor, W.C. Leong, Mohd Sharizal Abdul Aziz, Ishak Abdul Azid, M. Abdul Mujeebu, Ning Ye, Bo Yang and Wei Tan. Their work appears in journals such as SHILAP Revista de lepidopterología, Microelectronics Reliability and IEEE Transactions on Components Packaging and Manufacturing Technology.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.