Urara Satake

499 total citations
41 papers, 365 citations indexed

About

Urara Satake is a scholar working on Biomedical Engineering, Mechanical Engineering and Electrical and Electronic Engineering. According to data from OpenAlex, Urara Satake has authored 41 papers receiving a total of 365 indexed citations (citations by other indexed papers that have themselves been cited), including 32 papers in Biomedical Engineering, 24 papers in Mechanical Engineering and 14 papers in Electrical and Electronic Engineering. Recurrent topics in Urara Satake's work include Advanced Surface Polishing Techniques (27 papers), Advanced machining processes and optimization (23 papers) and Integrated Circuits and Semiconductor Failure Analysis (8 papers). Urara Satake is often cited by papers focused on Advanced Surface Polishing Techniques (27 papers), Advanced machining processes and optimization (23 papers) and Integrated Circuits and Semiconductor Failure Analysis (8 papers). Urara Satake collaborates with scholars based in Japan and United States. Urara Satake's co-authors include Toshiyuki Enomoto, Tatsuya Sugihara, Kei Hirose, Tsutomu Fujita, Toshiki Enomoto, Hidenori Nakagawa, Tadaatsu Imaizumi, Kazuhiko Seya, Hiroshi Tanaka and Motoki Sato and has published in prestigious journals such as Journal of Materials Processing Technology, CIRP Annals and Journal of Neuroimmunology.

In The Last Decade

Urara Satake

37 papers receiving 342 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Urara Satake Japan 10 267 229 95 74 56 41 365
Cheng Yong Wang China 11 279 1.0× 237 1.0× 153 1.6× 40 0.5× 50 0.9× 73 388
Mustapha Abouridouane Germany 12 383 1.4× 186 0.8× 103 1.1× 136 1.8× 187 3.3× 30 494
Yongbo Wu China 12 141 0.5× 267 1.2× 110 1.2× 65 0.9× 72 1.3× 43 353
Rolf Bertrand Schroeter Brazil 13 397 1.5× 163 0.7× 163 1.7× 140 1.9× 109 1.9× 29 468
Andrea la Monaca United Kingdom 6 552 2.1× 302 1.3× 254 2.7× 90 1.2× 138 2.5× 8 624
Declan Brazil United States 8 224 0.8× 137 0.6× 66 0.7× 39 0.5× 45 0.8× 25 311
Zhirong Liao China 7 565 2.1× 314 1.4× 255 2.7× 77 1.0× 125 2.2× 15 637
C. Veiga Brazil 4 448 1.7× 93 0.4× 91 1.0× 139 1.9× 257 4.6× 9 542
G. Le Coz France 6 570 2.1× 285 1.2× 373 3.9× 48 0.6× 57 1.0× 8 598
Quanren Zeng United Kingdom 8 175 0.7× 181 0.8× 72 0.8× 88 1.2× 85 1.5× 14 385

Countries citing papers authored by Urara Satake

Since Specialization
Citations

This map shows the geographic impact of Urara Satake's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Urara Satake with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Urara Satake more than expected).

Fields of papers citing papers by Urara Satake

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Urara Satake. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Urara Satake. The network helps show where Urara Satake may publish in the future.

Co-authorship network of co-authors of Urara Satake

This figure shows the co-authorship network connecting the top 25 collaborators of Urara Satake. A scholar is included among the top collaborators of Urara Satake based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Urara Satake. Urara Satake is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Seguchi, Y., Urara Satake, & Toshiyuki Enomoto. (2025). Improved polishing process for silicon wafers in semiconductor manufacturing. Procedia CIRP. 134. 139–144.
2.
Satake, Urara, et al.. (2025). A novel flexible-structured saw blade for bone cutting: reducing ploughing and promoting chip evacuation. Journal of Materials Processing Technology. 344. 119000–119000. 1 indexed citations
3.
4.
Satake, Urara, et al.. (2024). Comparative analysis of cutting characteristics of simulated and bovine cortical bone. Procedia CIRP. 125. 231–236. 1 indexed citations
5.
Satake, Urara & Toshiyuki Enomoto. (2024). Changes in edge shape during silicon wafer polishing: Roll-off and roll-up formation. CIRP Annals. 73(1). 273–276. 1 indexed citations
6.
Satake, Urara, et al.. (2023). Modeling of oscillating bone sawing forces with instantaneous cutting speed and depth of cut. Journal of Materials Processing Technology. 324. 118225–118225. 8 indexed citations
7.
Satake, Urara & Toshiyuki Enomoto. (2023). Polishing pad design for uniform removal distributions in double-sided polishing. CIRP Annals. 72(1). 289–292. 4 indexed citations
8.
Satake, Urara & Toshiyuki Enomoto. (2023). Kinematic analysis of double-sided polishing of silicon wafers for improving surface flatness. Procedia CIRP. 117. 56–61. 2 indexed citations
9.
Enomoto, Toshiyuki, et al.. (2020). New water-based fluids as alternatives to oil-based fluids in superfinishing processes. CIRP Annals. 69(1). 297–300. 1 indexed citations
10.
Satake, Urara, et al.. (2020). Polishing pad for reducing edge roll-off while maintaining good global flatness of silicon wafer. Precision Engineering. 66. 577–592. 9 indexed citations
11.
Imaizumi, Tadaatsu, Urara Satake, Shogo Kawaguchi, et al.. (2019). Interferon-induced transmembrane protein 1 and Myxovirus resistance protein 1 are induced by polyinosinic-polycytidylic acid in cultured hCMEC/D3 human cerebral microvascular endothelial cells. Journal of Neuroimmunology. 337. 577047–577047. 2 indexed citations
12.
Satake, Urara, et al.. (2019). Stabilization of Removal Rate in Small Tool Polishing of Glass Lenses. International Journal of Automation Technology. 13(2). 221–229. 6 indexed citations
13.
Hirose, Kei, et al.. (2018). Optimization of Polishing Conditions for Reducing Thickness Variation of Wafer in Double-Sided Polishing. Journal of the Japan Society for Precision Engineering. 84(3). 277–283. 4 indexed citations
14.
Satake, Urara, et al.. (2018). Surgical diamond wheels for minimally invasive surgery in bone resection under small quantity of coolant supply. Precision Engineering. 56. 80–86. 14 indexed citations
15.
Satake, Urara, et al.. (2016). Optimization Method for Double-sided Polishing Process based on Kinematical Analysis. Procedia CIRP. 41. 870–874. 22 indexed citations
16.
Satake, Urara, et al.. (2014). Change in Edge Surface Flatness of Silicon Wafer during Polishing. Journal of the Japan Society for Precision Engineering. 80(8). 777–782. 3 indexed citations
17.
Sugihara, Tatsuya, et al.. (2012). Improving Anti-Adhesion in Cutting of Aluminum Alloy by Micro Stripe Texture – Considering Texture Combination. Key engineering materials. 523-524. 1092–1097. 1 indexed citations
18.
Satake, Urara, et al.. (2012). Improvement of Edge Surface Flatness by A New Stacked Polishing Pad. Procedia CIRP. 1. 675–676. 3 indexed citations
19.
Enomoto, Toshiki, et al.. (2011). A newly developed polishing pad for achieving high surface flatness without edge roll off. CIRP Annals. 60(1). 371–374. 16 indexed citations
20.
Satake, Urara, et al.. (2011). Investigation of a Polishing Pad and a Carrier Film for Decreasing Edge Roll Off of Workpiece. Advanced materials research. 325. 476–481.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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2026