Tsetska Radeva
- Surfaces, Coatings and Films top 2%
- Physical and Theoretical Chemistry top 2%
- Biomedical Engineering
- Electrical and Electronic Engineering
- Materials Chemistry
- Co-authors
- Івана ПетканчинNikоlai BoshkovR. VaroquiH. HoffmannHiroshi MaédaMaria StoimenovaJ.A. LaddNikolay A. Grozev
- Topics
- Polymer Surface Interaction Studies (20 papers)Electrostatics and Colloid Interactions (18 papers)Electrowetting and Microfluidic Technologies (9 papers)
- Partner nations
- BulgariaUnited StatesJapan
In The Last Decade
Tsetska Radeva
44 papers receiving 644 citations
Peers
Comparison fields: 5 of 66
- Surfaces, Coatings and Films 279
- Physical and Theoretical Chemistry 254
- Biomedical Engineering 167
- Electrical and Electronic Engineering 155
- Materials Chemistry 128
Countries citing papers authored by Tsetska Radeva
This map shows the geographic impact of Tsetska Radeva's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Tsetska Radeva with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Tsetska Radeva more than expected).
Fields of papers citing papers by Tsetska Radeva
This network shows the impact of papers produced by Tsetska Radeva. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Tsetska Radeva. The network helps show where Tsetska Radeva may publish in the future.
Co-authorship network of co-authors of Tsetska Radeva
This figure shows the co-authorship network connecting the top 25 collaborators of Tsetska Radeva. A scholar is included among the top collaborators of Tsetska Radeva based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Tsetska Radeva. Tsetska Radeva is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 6 | |
| 2 | 4 | |
| 3 | 9 | |
| 4 | 1 | |
| 5 | 12 | |
| 6 | 4 | |
| 7 | 3 | |
| 8 | 10 | |
| 9 | 19 | |
| 10 | 32 | |
| 11 | 12 | |
| 12 | 17 | |
| 13 | 12 | |
| 14 | 14 | |
| 15 | 17 | |
| 16 | 19 | |
| 17 | 6 | |
| 18 | 47 | |
| 19 | 21 | |
| 20 | 6 |
About Tsetska Radeva
Tsetska Radeva is a scholar working on Surfaces, Coatings and Films, Physical and Theoretical Chemistry and Bioengineering, having authored 44 papers that have together received 658 indexed citations. Recurring topics across this work include Polymer Surface Interaction Studies (20 papers), Electrostatics and Colloid Interactions (18 papers) and Electrowetting and Microfluidic Technologies (9 papers). The work is most often cited by research in Surfaces, Coatings and Films (279 citations), Physical and Theoretical Chemistry (254 citations) and Molecular Medicine (32 citations). Tsetska Radeva has collaborated with scholars based in Bulgaria, United States and Japan. Frequent co-authors include Івана Петканчин, Nikоlai Boshkov, R. Varoqui, H. Hoffmann, Hiroshi Maéda, Maria Stoimenova, J.A. Ladd, Nikolay A. Grozev, Valentin S. Dimitrov and Stefan L. Spassov. Their work appears in journals such as Langmuir, Journal of Colloid and Interface Science and Biomacromolecules.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.