Tomohiro Uno
Impact in
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Terahertz technology and applications
- Integrated Circuits and Semiconductor Failure Analysis
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- Copper Interconnects and Reliability
Papers in
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- Copper Interconnects and Reliability 8
- Liquid Crystal Research Advancements 2
- Co-authors
- Takashi YamadaKohei TatsumiShin‐Ichi TerashimaTaiichi OtsujiMitsuhiro HanabeEiichi SanoYahya Moubarak MezianiHideaki Machida
In The Last Decade
Tomohiro Uno
28 papers receiving 416 citations
Peers
Comparison fields: 5 of 27
- Electrical and Electronic Engineering 406
- Electronic, Optical and Magnetic Materials 88
- Mechanical Engineering 152
- Astronomy and Astrophysics 38
- Atomic and Molecular Physics, and Optics 71
Countries citing papers authored by Tomohiro Uno
This map shows the geographic impact of Tomohiro Uno's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Tomohiro Uno with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Tomohiro Uno more than expected).
Fields of papers citing papers by Tomohiro Uno
This network shows the impact of papers produced by Tomohiro Uno. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Tomohiro Uno. The network helps show where Tomohiro Uno may publish in the future.
Co-authorship network
The 19 scholars most cited alongside Tomohiro Uno, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2017 | 5 | |
| 2 | 2017 | 2 | |
| 3 | 2017 | 11 | |
| 4 | 2015 | 1 | |
| 5 | 2013 | 12 | |
| 6 | 2012 | 6 | |
| 7 | 2011 | 1 | |
| 8 | 2011 | 3 | |
| 9 | 2010 | 50 | |
| 10 | 2010 | 80 | |
| 11 | Surface-enhanced copper bonding wire for LSI and its bond reliability under humid environment | 2009 | 2 |
| 12 | 2009 | 71 | |
| 13 | 2006 | 40 | |
| 14 | Thermal bond reliability of high reliability gold alloy wires for automotive IC's | 2005 | 6 |
| 15 | 2005 | 18 | |
| 16 | 2001 | 2 | |
| 17 | 2001 | 10 | |
| 18 | 2000 | 34 | |
| 19 | Fine-pitch wire ball bonding technology | 1997 | 1 |
| 20 | 1995 | 5 |
About Tomohiro Uno
Tomohiro Uno is a scholar working on General Materials Science, Electronic, Optical and Magnetic Materials, Electrical and Electronic Engineering, Surfaces, Coatings and Films and Mechanical Engineering, having authored 29 papers that have together received 461 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (19 papers), 3D IC and TSV technologies (12 papers), Copper Interconnects and Reliability (8 papers), Phase-change materials and chalcogenides (3 papers), Terahertz technology and applications (3 papers), Aluminum Alloys Composites Properties (3 papers), Liquid Crystal Research Advancements (2 papers) and Electrical Contact Performance and Analysis (2 papers). The work is most often cited by research in Electrical and Electronic Engineering (406 citations), Electronic, Optical and Magnetic Materials (88 citations), Mechanical Engineering (152 citations), Astronomy and Astrophysics (38 citations) and Atomic and Molecular Physics, and Optics (71 citations). Tomohiro Uno has collaborated with scholars based in Japan, China and Germany. Frequent co-authors include Takashi Yamada, Kohei Tatsumi, Shin‐Ichi Terashima, Taiichi Otsuji, Mitsuhiro Hanabe, Eiichi Sano, Yahya Moubarak Meziani, Hideaki Machida, Masato Ishikawa and V. Ryzhii. Their work appears in journals such as Journal of the Japan Institute of Metals and Materials, Microelectronics Reliability, Japanese Journal of Applied Physics, Applied Physics Letters and QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.