Tomohiro Uno

588 total citations
29 papers, 461 citations indexed

About

Tomohiro Uno is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Mechanical Engineering. According to data from OpenAlex, Tomohiro Uno has authored 29 papers receiving a total of 461 indexed citations (citations by other indexed papers that have themselves been cited), including 26 papers in Electrical and Electronic Engineering, 10 papers in Electronic, Optical and Magnetic Materials and 9 papers in Mechanical Engineering. Recurrent topics in Tomohiro Uno's work include Electronic Packaging and Soldering Technologies (19 papers), 3D IC and TSV technologies (12 papers) and Copper Interconnects and Reliability (8 papers). Tomohiro Uno is often cited by papers focused on Electronic Packaging and Soldering Technologies (19 papers), 3D IC and TSV technologies (12 papers) and Copper Interconnects and Reliability (8 papers). Tomohiro Uno collaborates with scholars based in Japan, China and Germany. Tomohiro Uno's co-authors include Takashi Yamada, Kohei Tatsumi, Shin‐Ichi Terashima, Taiichi Otsuji, Mitsuhiro Hanabe, Eiichi Sano, Yahya Moubarak Meziani, Hideaki Machida, Masato Ishikawa and V. Ryzhii and has published in prestigious journals such as Applied Physics Letters, Japanese Journal of Applied Physics and Microelectronics Reliability.

In The Last Decade

Tomohiro Uno

28 papers receiving 416 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Tomohiro Uno Japan 11 406 152 88 74 71 29 461
B. L. Weiss United States 12 141 0.3× 83 0.5× 47 0.5× 191 2.6× 55 0.8× 27 381
Aapo Varpula Finland 11 248 0.6× 38 0.3× 22 0.3× 146 2.0× 58 0.8× 37 363
R. R. Kola United States 10 223 0.5× 50 0.3× 47 0.5× 80 1.1× 63 0.9× 40 311
Kwang Lok Kim South Korea 12 254 0.6× 23 0.2× 70 0.8× 53 0.7× 34 0.5× 17 512
Brian Kearney United States 10 191 0.5× 13 0.1× 307 3.5× 64 0.9× 57 0.8× 22 454
Jinjer Huang China 13 255 0.6× 94 0.6× 43 0.5× 108 1.5× 188 2.6× 58 401
Rahul Jairath United States 5 195 0.5× 113 0.7× 89 1.0× 102 1.4× 79 1.1× 10 329
Kazuo Shiraishi Japan 13 336 0.8× 17 0.1× 31 0.4× 47 0.6× 153 2.2× 29 400
Yan Cao China 12 101 0.2× 42 0.3× 58 0.7× 366 4.9× 61 0.9× 35 424
Yoshio Kobayashi Japan 15 602 1.5× 60 0.4× 17 0.2× 96 1.3× 99 1.4× 90 707

Countries citing papers authored by Tomohiro Uno

Since Specialization
Citations

This map shows the geographic impact of Tomohiro Uno's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Tomohiro Uno with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Tomohiro Uno more than expected).

Fields of papers citing papers by Tomohiro Uno

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Tomohiro Uno. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Tomohiro Uno. The network helps show where Tomohiro Uno may publish in the future.

Co-authorship network of co-authors of Tomohiro Uno

This figure shows the co-authorship network connecting the top 25 collaborators of Tomohiro Uno. A scholar is included among the top collaborators of Tomohiro Uno based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Tomohiro Uno. Tomohiro Uno is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Uno, Tomohiro, et al.. (2017). High-Performance Silver Alloy Bonding Wire for Memory Devices. 1996–2001. 5 indexed citations
2.
Yamada, Takashi, et al.. (2017). Newly developed high reliability palladium coated Cu wire for automotive application. 1–5. 2 indexed citations
3.
Uno, Tomohiro, et al.. (2017). Thermal Bond Reliability of High Reliability New Palladium-Coated Copper Wire. 1297–1302. 11 indexed citations
4.
Ishikawa, Shinji, et al.. (2015). Development of a New Die-attach Process and Investigation of its Reliability for High Temperature Electronics Using Ni-nanoparticles. Journal of Smart Processing. 4(4). 190–195. 1 indexed citations
5.
Suda, Kohei, Tomohiro Uno, Naomi Sawamoto, et al.. (2013). Ge2Sb2Te5 Film Fabrication by Tellurization of Chemical Vapor Deposited GeSb. Japanese Journal of Applied Physics. 52(12R). 128006–128006. 12 indexed citations
6.
Uno, Tomohiro, et al.. (2012). Evaluation of Ge<sub>x</sub>Sb<sub>y</sub>Te<sub>z</sub> Film Grown by Chemical Vapor Deposition. Materials science forum. 725. 289–292. 6 indexed citations
7.
Uno, Tomohiro, Hideaki Machida, Masato Ishikawa, et al.. (2011). Composition control of Ge<inf>x</inf>Sb<inf>y</inf>Te<inf>z</inf> film for PCRAM application by chemical vapor deposition. 49. 1–4. 1 indexed citations
8.
Uno, Tomohiro, et al.. (2011). Development of Enhanced Bondability and Reliability Multi-Layer Cu Bonding Wire EX1. Materia Japan. 50(1). 30–32. 3 indexed citations
9.
Uno, Tomohiro. (2010). Enhancing bondability with coated copper bonding wire. Microelectronics Reliability. 51(1). 88–96. 50 indexed citations
10.
Uno, Tomohiro. (2010). Bond reliability under humid environment for coated copper wire and bare copper wire. Microelectronics Reliability. 51(1). 148–156. 80 indexed citations
11.
Uno, Tomohiro, Keiichi Kimura, & Takashi Yamada. (2009). Surface-enhanced copper bonding wire for LSI and its bond reliability under humid environment. European Microelectronics and Packaging Conference. 1–10. 2 indexed citations
12.
Uno, Tomohiro, Shin‐Ichi Terashima, & Takashi Yamada. (2009). Surface-enhanced copper bonding wire for LSI. 1486–1495. 71 indexed citations
13.
Otsuji, Taiichi, et al.. (2006). Grating-bicoupled plasmon-resonant terahertz emitter fabricated with GaAs-based heterostructure material systems. Applied Physics Letters. 89(26). 40 indexed citations
14.
Uno, Tomohiro, Keiichi Kimura, & Kohei Tatsumi. (2005). Thermal bond reliability of high reliability gold alloy wires for automotive IC's. 557–565. 6 indexed citations
15.
Hanabe, Mitsuhiro, et al.. (2005). Modulation Effects of Photocarriers on the Terahertz Plasma-Wave Resonance in High-Electron-Mobility Transistors under Interband Photoexcitation. Japanese Journal of Applied Physics. 44(6R). 3842–3842. 18 indexed citations
16.
Uno, Tomohiro & Kohei Tatsumi. (2001). Reliability of Au/Al Bonds and its Governing Factors.. QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY. 19(1). 156–166. 2 indexed citations
17.
Terashima, Shin‐Ichi, et al.. (2001). Improvement in Thermal Reliability of a Flip Chip Interconnection System Joined by Pb-Free Solder and Au bumps. MATERIALS TRANSACTIONS. 42(5). 803–808. 10 indexed citations
18.
Uno, Tomohiro & Kohei Tatsumi. (2000). Thermal reliability of gold–aluminum bonds encapsulated in bi-phenyl epoxy resin. Microelectronics Reliability. 40(1). 145–153. 34 indexed citations
19.
Tatsumi, Kohei, et al.. (1997). Fine-pitch wire ball bonding technology. 39–44. 1 indexed citations
20.
Mizuno, K., et al.. (1995). Gold Diffusion and Intermetallic Formation in Au/Al<SUB>2</SUB>O<SUB>3</SUB>/Al Film. Journal of the Japan Institute of Metals and Materials. 59(11). 1095–1102. 5 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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