Thomas F. Marinis
- Electrical and Electronic Engineering
- Biomedical Engineering top 10%
- Materials Chemistry
- Electronic, Optical and Magnetic Materials
- Automotive Engineering top 10%
- Co-authors
- Yang RaoChing‐Ping WongJianmin QuYet‐Ming ChiangFan XuNancy J. DudneyRyan C. WartenaWei Lai
- Topics
- Advanced MEMS and NEMS Technologies (12 papers)3D IC and TSV technologies (8 papers)Electronic Packaging and Soldering Technologies (6 papers)
- Partner nations
- United States
In The Last Decade
Thomas F. Marinis
27 papers receiving 539 citations
Peers
Comparison fields: 5 of 55
- Electrical and Electronic Engineering 305
- Biomedical Engineering 291
- Materials Chemistry 202
- Electronic, Optical and Magnetic Materials 148
- Automotive Engineering 83
Countries citing papers authored by Thomas F. Marinis
This map shows the geographic impact of Thomas F. Marinis's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Thomas F. Marinis with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Thomas F. Marinis more than expected).
Fields of papers citing papers by Thomas F. Marinis
This network shows the impact of papers produced by Thomas F. Marinis. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Thomas F. Marinis. The network helps show where Thomas F. Marinis may publish in the future.
Co-authorship network of co-authors of Thomas F. Marinis
This figure shows the co-authorship network connecting the top 25 collaborators of Thomas F. Marinis. A scholar is included among the top collaborators of Thomas F. Marinis based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Thomas F. Marinis. Thomas F. Marinis is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 1 | |
| 2 | 1 | |
| 3 | 2 | |
| 4 | 10 | |
| 5 | 5 | |
| 6 | 2 | |
| 7 | 0 | |
| 8 | 4 | |
| 9 | 156 | |
| 10 | 1 | |
| 11 | 21 | |
| 12 | 0 | |
| 13 | 5 | |
| 14 | 1 | |
| 15 | 3 | |
| 16 | 4 | |
| 17 | 266 | |
| 18 | 1 | |
| 19 | 1 | |
| 20 | 16 |
About Thomas F. Marinis
Thomas F. Marinis is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Automotive Engineering, having authored 32 papers that have together received 560 indexed citations. Recurring topics across this work include Advanced MEMS and NEMS Technologies (12 papers), 3D IC and TSV technologies (8 papers) and Electronic Packaging and Soldering Technologies (6 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (148 citations), Automotive Engineering (83 citations) and Biomedical Engineering (291 citations). Thomas F. Marinis has collaborated with scholars based in United States. Frequent co-authors include Yang Rao, Ching‐Ping Wong, Jianmin Qu, Yet‐Ming Chiang, Fan Xu, Nancy J. Dudney, Ryan C. Wartena, Wei Lai, Can K. Erdonmez and Ryszard J. Pryputniewicz. Their work appears in journals such as Advanced Materials, IEEE Transactions on Components and Packaging Technologies and Strain.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.