Takashi Matsumae

966 total citations
76 papers, 727 citations indexed

About

Takashi Matsumae is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Materials Chemistry. According to data from OpenAlex, Takashi Matsumae has authored 76 papers receiving a total of 727 indexed citations (citations by other indexed papers that have themselves been cited), including 65 papers in Electrical and Electronic Engineering, 24 papers in Biomedical Engineering and 16 papers in Materials Chemistry. Recurrent topics in Takashi Matsumae's work include 3D IC and TSV technologies (46 papers), Electronic Packaging and Soldering Technologies (27 papers) and Semiconductor materials and devices (26 papers). Takashi Matsumae is often cited by papers focused on 3D IC and TSV technologies (46 papers), Electronic Packaging and Soldering Technologies (27 papers) and Semiconductor materials and devices (26 papers). Takashi Matsumae collaborates with scholars based in Japan, United States and Ghana. Takashi Matsumae's co-authors include Hideki Takagi, Yuichi Kurashima, Hitoshi Umezawa, Eiji Higurashi, Tadatomo Suga, Michitaka Yamamoto, Toshihiro Itoh, Masahisa Fujino, Koji Tanaka and Hideyuki Watanabe and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Journal of The Electrochemical Society.

In The Last Decade

Takashi Matsumae

70 papers receiving 717 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Takashi Matsumae Japan 16 479 288 169 158 80 76 727
Thomas Kups Germany 16 256 0.5× 353 1.2× 93 0.6× 106 0.7× 76 0.9× 44 574
Day-Shan Liu Taiwan 16 310 0.6× 361 1.3× 117 0.7× 149 0.9× 36 0.5× 46 547
M. Kamruddin India 19 395 0.8× 582 2.0× 176 1.0× 287 1.8× 158 2.0× 37 859
Tai‐Hong Chen Taiwan 14 397 0.8× 184 0.6× 107 0.6× 99 0.6× 47 0.6× 59 591
Dragos Seghete United States 13 868 1.8× 656 2.3× 166 1.0× 127 0.8× 70 0.9× 23 1.0k
Peng Zuo China 16 404 0.8× 321 1.1× 140 0.8× 242 1.5× 67 0.8× 33 755
Takeshi Bessho Japan 19 512 1.1× 256 0.9× 181 1.1× 131 0.8× 45 0.6× 50 825
Igor Bello Hong Kong 14 590 1.2× 806 2.8× 274 1.6× 231 1.5× 144 1.8× 21 1.1k
Hidemitsu Aoki Japan 13 351 0.7× 269 0.9× 78 0.5× 157 1.0× 109 1.4× 96 563

Countries citing papers authored by Takashi Matsumae

Since Specialization
Citations

This map shows the geographic impact of Takashi Matsumae's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Takashi Matsumae with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Takashi Matsumae more than expected).

Fields of papers citing papers by Takashi Matsumae

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Takashi Matsumae. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Takashi Matsumae. The network helps show where Takashi Matsumae may publish in the future.

Co-authorship network of co-authors of Takashi Matsumae

This figure shows the co-authorship network connecting the top 25 collaborators of Takashi Matsumae. A scholar is included among the top collaborators of Takashi Matsumae based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Takashi Matsumae. Takashi Matsumae is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Matsumae, Takashi, et al.. (2025). Low-temperature bonding of HCl-dipped Ge substrate with diamond heat-spreader through atomically thin layer. Materialia. 39. 102369–102369. 1 indexed citations
2.
Takeuchi, Kai, et al.. (2025). Au hollow pyramidal bumps for low-temperature low-pressure bonding fabricated via Au film transfer method. Sensors and Actuators A Physical. 395. 116968–116968.
3.
Matsumae, Takashi, et al.. (2025). Micropatterning process of diamond substrates by stamping Ni imprint molds. Diamond and Related Materials. 152. 111999–111999. 1 indexed citations
4.
Takeuchi, Kai, Takashi Matsumae, Hideki Takagi, et al.. (2025). Room temperature bonding of Au plating through surface smoothing using polyimide template stripping. Sensors and Actuators A Physical. 383. 116211–116211. 2 indexed citations
5.
Takeuchi, Kai, Takashi Matsumae, Hideki Takagi, et al.. (2023). Template Stripping of Au from Polyimide Film for Smoothing of Bonding Surface. 133–134. 1 indexed citations
6.
Kurashima, Yuichi, Taisei Motomura, Shinya Yanagimachi, et al.. (2023). High-Efficiency Plasma Source Using a Magnetic Mirror Trap for Miniature-Ion Pumps. Sensors. 23(2). 1040–1040. 4 indexed citations
7.
Matsumae, Takashi, et al.. (2022). Hydrophilic direct bonding of GaN and Si substrates by wet treatments using H 2 SO 4 /H 2 O 2 mixture and NH 3 /H 2 O 2 mixture. Japanese Journal of Applied Physics. 61(SF). SF1005–SF1005. 4 indexed citations
8.
Matsumae, Takashi, et al.. (2022). Simple and low-temperature vacuum packaging process by using Au/Ta/Ti metal multilayer. Japanese Journal of Applied Physics. 61(5). 51004–51004.
9.
Matsumae, Takashi, Yuichi Kurashima, Hideki Takagi, et al.. (2022). Efficient heat dissipation from β-Ga2O3 film directly bonded on diamond substrate. 99–100.
10.
Matsumae, Takashi, Yuichi Kurashima, Hideki Takagi, et al.. (2020). Heterogeneous direct bonding of diamond and semiconductor substrates using NH3/H2O2 cleaning. Applied Physics Letters. 117(20). 13 indexed citations
11.
Matsumae, Takashi, Yuichi Kurashima, Hideki Takagi, et al.. (2020). Hetero-Integration of β-Ga2O3 and Diamond Substrates by Hydrophilic Bonding Technique. ECS Transactions. 98(4). 17–20. 2 indexed citations
12.
Kurashima, Yuichi, et al.. (2019). An all-sapphire Cs gas cell for a chip-scale atomic clock. Japanese Journal of Applied Physics. 58(9). 96506–96506. 7 indexed citations
13.
Matsumae, Takashi, Yuichi Kurashima, Hitoshi Umezawa, & Hideki Takagi. (2019). Hydrophilic direct bonding of diamond (111) substrate using treatment with H 2 SO 4 /H 2 O 2. Japanese Journal of Applied Physics. 59(SB). SBBA01–SBBA01. 18 indexed citations
14.
Yamamoto, Michitaka, Takashi Matsumae, Yuichi Kurashima, et al.. (2019). Wafer-scale Au-Au surface activated bonding using atmospheric-pressure plasma. 361–364. 3 indexed citations
15.
Matsumae, Takashi, Yuichi Kurashima, Hitoshi Umezawa, & Hideki Takagi. (2019). Hydrophilic low-temperature direct bonding of diamond and Si substrates under atmospheric conditions. Scripta Materialia. 175. 24–28. 21 indexed citations
16.
Kurashima, Yuichi, Takashi Matsumae, & Hideki Takagi. (2017). Room-temperature Au–Au bonding in atmospheric air using direct transferred atomically smooth Au film on electroplated patterns. Microelectronic Engineering. 189. 1–5. 25 indexed citations
17.
Matsumae, Takashi, Andrew D. Koehler, Jordan D. Greenlee, et al.. (2015). Temporary Bonding with Polydimethylglutarimide Based Lift Off Resist as a Layer Transfer Platform. ECS Journal of Solid State Science and Technology. 4(7). P190–P194. 5 indexed citations
18.
Matsumae, Takashi, Masahisa Fujino, & Tadatomo Suga. (2015). Room-temperature bonding method for polymer substrate of flexible electronics by surface activation using nano-adhesion layers. Japanese Journal of Applied Physics. 54(10). 101602–101602. 20 indexed citations
19.
Matsumae, Takashi, Masahisa Fujino, & Tadatomo Suga. (2013). Direct bonding of PEN at room temperature by means of surface activated bonding method using nano-adhesion layer. 236. 1–3. 7 indexed citations
20.
Matsumae, Takashi, et al.. (2012). Room Temperature Bonding of Polymer to Glass Wafers using Surface Activated Bonding (SAB) Method. ECS Meeting Abstracts. MA2012-02(40). 2991–2991. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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