Seong Jun Kim
- Biomedical Engineering top 5%
- Materials Chemistry top 10%
- Electrical and Electronic Engineering
- Electronic, Optical and Magnetic Materials top 10%
- Polymers and Plastics top 10%
- Co-authors
- Bok Ki MinChoon‐Gi ChoiYoonsik YiShuvra MondalVan‐Tam NguyenWooseok SongKi‐Seok AnHo Young Lee
- Topics
- 2D Materials and Applications (8 papers)Graphene research and applications (6 papers)MXene and MAX Phase Materials (5 papers)
- Partner nations
- South KoreaUnited StatesIndia
In The Last Decade
Seong Jun Kim
26 papers receiving 920 citations
Peers
Comparison fields: 5 of 48
- Biomedical Engineering 542
- Materials Chemistry 412
- Electrical and Electronic Engineering 290
- Electronic, Optical and Magnetic Materials 227
- Polymers and Plastics 205
Countries citing papers authored by Seong Jun Kim
This map shows the geographic impact of Seong Jun Kim's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Seong Jun Kim with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Seong Jun Kim more than expected).
Fields of papers citing papers by Seong Jun Kim
This network shows the impact of papers produced by Seong Jun Kim. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Seong Jun Kim. The network helps show where Seong Jun Kim may publish in the future.
Co-authorship network of co-authors of Seong Jun Kim
This figure shows the co-authorship network connecting the top 25 collaborators of Seong Jun Kim. A scholar is included among the top collaborators of Seong Jun Kim based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Seong Jun Kim. Seong Jun Kim is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 0 | |
| 2 | 6 | |
| 3 | 12 | |
| 4 | 16 | |
| 5 | 3 | |
| 6 | 20 | |
| 7 | 2 | |
| 8 | 7 | |
| 9 | 3 | |
| 10 | 17 | |
| 11 | 26 | |
| 12 | 151 | |
| 13 | 3 | |
| 14 | 164 | |
| 15 | 52 | |
| 16 | 81 | |
| 17 | 25 | |
| 18 | 9 | |
| 19 | 1 | |
| 20 | Application of UNIFAC Model for Swelling Equilibria of Mixed Solvent/Poly(vinylchloride) Systems | 2 |
About Seong Jun Kim
Seong Jun Kim is a scholar working on Materials Chemistry, Biomedical Engineering and Electronic, Optical and Magnetic Materials, having authored 28 papers that have together received 933 indexed citations. Recurring topics across this work include 2D Materials and Applications (8 papers), Graphene research and applications (6 papers) and MXene and MAX Phase Materials (5 papers). The work is most often cited by research in Polymers and Plastics (205 citations), Electronic, Optical and Magnetic Materials (227 citations) and Biomedical Engineering (542 citations). Seong Jun Kim has collaborated with scholars based in South Korea, United States and India. Frequent co-authors include Bok Ki Min, Choon‐Gi Choi, Yoonsik Yi, Shuvra Mondal, Van‐Tam Nguyen, Wooseok Song, Ki‐Seok An, Ho Young Lee, Sang Jun Lee and Jae Young Jho. Their work appears in journals such as Advanced Materials, Nano Letters and ACS Nano.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.