Seol Ha Kim
- Computational Mechanics top 2%
- Mechanical Engineering top 5%
- Surfaces, Coatings and Films top 5%
- Electrical and Electronic Engineering
- Aerospace Engineering top 10%
- Co-authors
- Moo Hwan KimHyun Sun ParkKiyofumi MoriyamaGi Cheol LeeJun Young KangHo Seon AhnMassoud KavianyHyungmo Kim
- Topics
- Fluid Dynamics and Heat Transfer (14 papers)Heat Transfer and Boiling Studies (12 papers)Surface Modification and Superhydrophobicity (9 papers)
- Partner nations
- South KoreaChinaUnited States
In The Last Decade
Seol Ha Kim
23 papers receiving 687 citations
Peers
Comparison fields: 5 of 38
- Computational Mechanics 476
- Mechanical Engineering 417
- Surfaces, Coatings and Films 198
- Electrical and Electronic Engineering 119
- Aerospace Engineering 104
Countries citing papers authored by Seol Ha Kim
This map shows the geographic impact of Seol Ha Kim's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Seol Ha Kim with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Seol Ha Kim more than expected).
Fields of papers citing papers by Seol Ha Kim
This network shows the impact of papers produced by Seol Ha Kim. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Seol Ha Kim. The network helps show where Seol Ha Kim may publish in the future.
Co-authorship network of co-authors of Seol Ha Kim
This figure shows the co-authorship network connecting the top 25 collaborators of Seol Ha Kim. A scholar is included among the top collaborators of Seol Ha Kim based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Seol Ha Kim. Seol Ha Kim is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 43 | |
| 2 | 7 | |
| 3 | 22 | |
| 4 | 18 | |
| 5 | 1 | |
| 6 | 43 | |
| 7 | 9 | |
| 8 | 32 | |
| 9 | 45 | |
| 10 | 28 | |
| 11 | 32 | |
| 12 | 46 | |
| 13 | 1 | |
| 14 | 50 | |
| 15 | 39 | |
| 16 | 1 | |
| 17 | 1 | |
| 18 | 20 | |
| 19 | 2 | |
| 20 | Pool boiling experiments on modified heterogeneous wetting surfaces with Teflon dots | 3 |
About Seol Ha Kim
Seol Ha Kim is a scholar working on Surfaces, Coatings and Films, Computational Mechanics and Mechanical Engineering, having authored 23 papers that have together received 696 indexed citations. Recurring topics across this work include Fluid Dynamics and Heat Transfer (14 papers), Heat Transfer and Boiling Studies (12 papers) and Surface Modification and Superhydrophobicity (9 papers). The work is most often cited by research in Surfaces, Coatings and Films (198 citations), Computational Mechanics (476 citations) and Mechanical Engineering (417 citations). Seol Ha Kim has collaborated with scholars based in South Korea, China and United States. Frequent co-authors include Moo Hwan Kim, Hyun Sun Park, Kiyofumi Moriyama, Gi Cheol Lee, Jun Young Kang, Ho Seon Ahn, Massoud Kaviany, Hyungmo Kim, HangJin Jo and Yuyan Jiang. Their work appears in journals such as Applied Physics Letters, Langmuir and International Journal of Heat and Mass Transfer.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.