Ryan J. Kershner
- Molecular Biology
- Biomedical Engineering
- Electrical and Electronic Engineering
- Materials Chemistry
- Atomic and Molecular Physics, and Optics
- Co-authors
- Michael J. CimaAlbert M. HungMarco BersaniChristine MicheelPaul W. K. RothemundJane FrommerLuisa BozanoCharles Rettner
- Topics
- 3D IC and TSV technologies (3 papers)Electrophoretic Deposition in Materials Science (2 papers)Electronic Packaging and Soldering Technologies (2 papers)
- Partner nations
- United States
In The Last Decade
Ryan J. Kershner
9 papers receiving 454 citations
Peers
Comparison fields: 5 of 57
- Molecular Biology 278
- Biomedical Engineering 193
- Electrical and Electronic Engineering 113
- Materials Chemistry 66
- Atomic and Molecular Physics, and Optics 56
Countries citing papers authored by Ryan J. Kershner
This map shows the geographic impact of Ryan J. Kershner's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Ryan J. Kershner with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Ryan J. Kershner more than expected).
Fields of papers citing papers by Ryan J. Kershner
This network shows the impact of papers produced by Ryan J. Kershner. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Ryan J. Kershner. The network helps show where Ryan J. Kershner may publish in the future.
Co-authorship network of co-authors of Ryan J. Kershner
This figure shows the co-authorship network connecting the top 25 collaborators of Ryan J. Kershner. A scholar is included among the top collaborators of Ryan J. Kershner based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Ryan J. Kershner. Ryan J. Kershner is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 3 | |
| 2 | 14 | |
| 3 | 317 | |
| 4 | 16 | |
| 5 | 105 | |
| 6 | 1 | |
| 7 | 3 | |
| 8 | 7 | |
| 9 | 2 |
About Ryan J. Kershner
Ryan J. Kershner is a scholar working on General Materials Science, Physical and Theoretical Chemistry and Electrical and Electronic Engineering, having authored 9 papers that have together received 468 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (3 papers), Electrophoretic Deposition in Materials Science (2 papers) and Electronic Packaging and Soldering Technologies (2 papers). The work is most often cited by research in Biomedical Engineering (193 citations), Molecular Biology (278 citations) and Surfaces, Coatings and Films (24 citations). Ryan J. Kershner has collaborated with scholars based in United States. Frequent co-authors include Michael J. Cima, Albert M. Hung, Marco Bersani, Christine Micheel, Paul W. K. Rothemund, Jane Frommer, Luisa Bozano, Charles Rettner, Gregory M. Wallraff and N. Jennifer. Their work appears in journals such as Nature Nanotechnology, Langmuir and Journal of Colloid and Interface Science.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.