Qiwei Ren

457 total citations
9 papers, 87 citations indexed

About

Qiwei Ren is a scholar working on Electrical and Electronic Engineering, Hardware and Architecture and Computer Networks and Communications. According to data from OpenAlex, Qiwei Ren has authored 9 papers receiving a total of 87 indexed citations (citations by other indexed papers that have themselves been cited), including 9 papers in Electrical and Electronic Engineering, 5 papers in Hardware and Architecture and 1 paper in Computer Networks and Communications. Recurrent topics in Qiwei Ren's work include 3D IC and TSV technologies (5 papers), Advanced Memory and Neural Computing (4 papers) and Ferroelectric and Negative Capacitance Devices (3 papers). Qiwei Ren is often cited by papers focused on 3D IC and TSV technologies (5 papers), Advanced Memory and Neural Computing (4 papers) and Ferroelectric and Negative Capacitance Devices (3 papers). Qiwei Ren collaborates with scholars based in China, United States and Cayman Islands. Qiwei Ren's co-authors include Bing Yu, Hongbin Sun, Xiaofeng Zhou, Zhe Zhang, Yixin Guo, Dimin Niu, Yubing Wang, Wenwu Xiao, Yubing Wang and Yuhao Wang and has published in prestigious journals such as IEEE Transactions on Circuits and Systems I Regular Papers, IEEE Transactions on Very Large Scale Integration (VLSI) Systems and Electronics.

In The Last Decade

Qiwei Ren

8 papers receiving 81 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Qiwei Ren China 7 61 30 22 13 8 9 87
Hyunyoon Cho South Korea 7 117 1.9× 90 3.0× 71 3.2× 8 0.6× 9 1.1× 9 165
Skanda Koppula United States 3 54 0.9× 24 0.8× 9 0.4× 24 1.8× 27 3.4× 5 77
Jason Zheng United States 7 51 0.8× 51 1.7× 11 0.5× 6 0.5× 15 1.9× 15 80
Sergey Shumarayev United States 8 92 1.5× 43 1.4× 18 0.8× 12 0.9× 9 1.1× 14 110
Jin-Sheng Ren Taiwan 4 152 2.5× 52 1.7× 20 0.9× 12 0.9× 33 4.1× 4 167
Y.K. Kim Italy 2 45 0.7× 38 1.3× 36 1.6× 2 0.2× 9 1.1× 2 67
Hoeju Chung South Korea 5 75 1.2× 32 1.1× 26 1.2× 2 0.2× 8 1.0× 10 95
Alireza Namazi Iran 8 88 1.4× 57 1.9× 39 1.8× 2 0.2× 16 2.0× 17 122
Christelle Caillouet France 6 58 1.0× 9 0.3× 83 3.8× 7 0.5× 6 0.8× 10 110
LI Jian-hua China 3 17 0.3× 19 0.6× 18 0.8× 6 0.5× 4 0.5× 7 38

Countries citing papers authored by Qiwei Ren

Since Specialization
Citations

This map shows the geographic impact of Qiwei Ren's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Qiwei Ren with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Qiwei Ren more than expected).

Fields of papers citing papers by Qiwei Ren

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Qiwei Ren. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Qiwei Ren. The network helps show where Qiwei Ren may publish in the future.

Co-authorship network of co-authors of Qiwei Ren

This figure shows the co-authorship network connecting the top 25 collaborators of Qiwei Ren. A scholar is included among the top collaborators of Qiwei Ren based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Qiwei Ren. Qiwei Ren is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

9 of 9 papers shown
1.
Xiao, Wenwu, et al.. (2023). A True Process-Heterogeneous Stacked Embedded DRAM Structure Based on Wafer-Level Hybrid Bonding. Electronics. 12(5). 1077–1077. 8 indexed citations
2.
Yu, Bing, Wenwu Xiao, Liang Bai, et al.. (2023). A 135 GBps/Gbit 0.66 pJ/bit Stacked Embedded DRAM with Multilayer Arrays by Fine Pitch Hybrid Bonding and Mini-TSV. 1–2. 11 indexed citations
3.
Xiao, Wenwu, Yue Peng, Yan Liu, et al.. (2023). Hf0.5Zr0.5O2 1T−1C FeRAM arrays with excellent endurance performance for embedded memory. Science China Information Sciences. 66(4).
4.
Niu, Dimin, Shuangchen Li, Yuhao Wang, et al.. (2022). 184QPS/W 64Mb/mm23D Logic-to-DRAM Hybrid Bonding with Process-Near-Memory Engine for Recommendation System. 2022 IEEE International Solid- State Circuits Conference (ISSCC). 1–3. 34 indexed citations
5.
Zhou, Xiaofeng, et al.. (2022). A 1596-GB/s 48-Gb Stacked Embedded DRAM 384-Core SoC With Hybrid Bonding Integration. IEEE Solid-State Circuits Letters. 5. 110–113. 9 indexed citations
6.
Guo, Yixin, et al.. (2022). A Low-Cost Reduced-Latency DRAM Architecture With Dynamic Reconfiguration of Row Decoder. IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 31(1). 128–141. 8 indexed citations
7.
Zhou, Xiaofeng, Bing Yu, Yubing Wang, et al.. (2021). A 1596GB/s 48Gb Embedded DRAM 384-Core SoC with Hybrid Bonding Integration. 1–3. 6 indexed citations
9.
Sun, Hongbin, et al.. (2015). Logic-DRAM Co-Design to Exploit the Efficient Repair Technique for Stacked DRAM. IEEE Transactions on Circuits and Systems I Regular Papers. 62(5). 1362–1371. 7 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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