Qingfeng Li
- Electrical and Electronic Engineering
- Computational Mechanics top 5%
- Biomedical Engineering
- Automotive Engineering top 10%
- Mechanical Engineering
- Co-authors
- David GrojoHaitao MinYanan WangHua LiZhengkun WangMaxime ChambonneauAnne‐Patricia AllonclePhilippe Delaporte
- Topics
- Laser Material Processing Techniques (20 papers)Advanced Surface Polishing Techniques (6 papers)Integrated Circuits and Semiconductor Failure Analysis (4 papers)
- Journals
- SHILAP Revista de lepidopterologíaScientific ReportsIEEE Transactions on Power Electronics
In The Last Decade
Qingfeng Li
29 papers receiving 369 citations
Peers
Comparison fields: 5 of 44
- Electrical and Electronic Engineering 193
- Computational Mechanics 188
- Biomedical Engineering 137
- Automotive Engineering 118
- Mechanical Engineering 68
Countries citing papers authored by Qingfeng Li
This map shows the geographic impact of Qingfeng Li's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Qingfeng Li with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Qingfeng Li more than expected).
Fields of papers citing papers by Qingfeng Li
This network shows the impact of papers produced by Qingfeng Li. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Qingfeng Li. The network helps show where Qingfeng Li may publish in the future.
Co-authorship network of co-authors of Qingfeng Li
This figure shows the co-authorship network connecting the top 25 collaborators of Qingfeng Li. A scholar is included among the top collaborators of Qingfeng Li based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Qingfeng Li. Qingfeng Li is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 1 | |
| 2 | 0 | |
| 3 | 2 | |
| 4 | 0 | |
| 5 | 1 | |
| 6 | 1 | |
| 7 | 4 | |
| 8 | 6 | |
| 9 | 1 | |
| 10 | 1 | |
| 11 | 123 | |
| 12 | 3 | |
| 13 | 13 | |
| 14 | 16 | |
| 15 | 38 | |
| 16 | 12 | |
| 17 | 14 | |
| 18 | 3 | |
| 19 | 2 | |
| 20 | 2 |
About Qingfeng Li
Qingfeng Li is a scholar working on Computational Mechanics, Numerical Analysis and Energy Engineering and Power Technology, having authored 32 papers that have together received 397 indexed citations. Recurring topics across this work include Laser Material Processing Techniques (20 papers), Advanced Surface Polishing Techniques (6 papers) and Integrated Circuits and Semiconductor Failure Analysis (4 papers). The work is most often cited by research in Automotive Engineering (118 citations), Computational Mechanics (188 citations) and Electrical and Electronic Engineering (193 citations). Qingfeng Li has collaborated with scholars based in China, Germany and France. Frequent co-authors include David Grojo, Haitao Min, Yanan Wang, Hua Li, Zhengkun Wang, Maxime Chambonneau, Anne‐Patricia Alloncle, Philippe Delaporte, Margaux Chanal and N. Sanner. Their work appears in journals such as SHILAP Revista de lepidopterología, Scientific Reports and IEEE Transactions on Power Electronics.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.